Micro-bolometric infrared staring array

• US 5,554,849 A
• Filed: 01/17/1995
• Issued: 09/10/1996
• Est. Priority Date: 01/17/1995
• Status: Expired due to Term

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Gates, James L.
• Primary Examiner(s): Fields, Carolyn E.
• Assistant Examiner(s): Glick, Edward J.
• Application Number:
  US08/372,982
• Time in Patent Office: 602 Days
• Field of Search: 250/338.4, 250/332, 250/370.08, 250/338.1, 250/349, 250/338.4, 250/332, 250/370.08
• US Class Current: 250/370.08
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: H01L 27/14649 Infrared imagers
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

A micro-bolometric infrared (IR) staring array is described. The active element in each pixel within a two-dimensional array is a device having a selectively forward-biased p-n junction, e.g. a selectively biased diode. Each diode in the array serves as both an IR energy detecting element and a switching element. Each diode in a given row of the IR pixel array to be sensed, or read, is driven at a constant voltage, rendering its IR response highly controllable in the forward biased operating curve of the diodes in the addressed row. Diodes not being driven are, due to their reverse bias, in their off state producing minute leakage current and thus make no significant contribution to the sensed current representing a given pixel'"'"'s IR exposure. The row-addressed driven or active diodes are sensed column by column by sample and hold techniques to produce a two-dimensional IR pixel image of a target. This simplifies the geometries as well as the cell structures while increasing the fill ratio to greater than approximately fifty percent. Moreover, manufacturing yields are greatly improved because of the topologic and process simplicities and compatibility with standard integrated circuit processes.

Claims

1. A two-dimensional bolometric array comprising:

plural bolometer devices arranged in a generally planar two-dimensional array across a semiconductor substrate,

each bolometer device in said array being characterized as a semiconductor junction that is, by external drive means, normally reverse biased and that is selectively forward biasable at a substantially fixed forward bias voltage produced by external means, said device being exposable to infrared energy incident on said device and said device exhibiting a determinedly variable response to a varying amount of absorbed infrared energy incident upon said device, said device being thermally isolated from said substrate that forms a part of said device, said device having on one side of the junction a drive line for applying a bias thereto and having on another side of the junction a sense line for measuring said device'"'"'s response to the amount of infrared energy incident on said device,

wherein plural ones of said plural devices share one or more common drive or one or more common sense lines controllable by associated bolometric array drive and sense circuitry.

2. The array of claim 1, wherein selective ones of said plural devices share a common drive line and wherein each of said selective ones of said plural devices is sensed in succession by plural sense lines.

3. The array of claim 1, wherein selective ones of said plural devices share a common sense line and wherein each of said selective ones of said plural devices is driven in succession by plural drive lines.

4. The array of claim 1 in which said array is two-dimensional, wherein selective ones of said plural devices share a common drive line and wherein each of said selective ones of said plural devices is sensed in succession by plural sense lines and wherein selective ones of said plural devices shares a common sense line and wherein each of said selective ones of said plural devices is driven in succession by plural drive lines.

5. The array of claim 1 in which said devices are diodes and selected ones of the devices have common anodes and have a sense line corresponding to each of plural cathodes.

6. The array of claim 1 in which said devices are diodes and selected ones of the devices have common cathodes and have a drive line corresponding to each of plural anodes.

7. The array of claim 1 in which said array is two-dimensional and in which the devices are diodes selected ones of which have common anodes and a sense line corresponding to each of plural cathodes, and selected ones of which have common cathodes and a sense line corresponding to each of plural anodes.

8. A bolometric array formed on a substrate, said array comprising:

a generally planar two-dimensional arrangement of semiconductor diodes defining addressable rows each of which contains plural diodes having common anodes and a connected drive line and columns each of which contains plural diodes having common cathodes and a connected sense line, wherein each diode is a bolometer;

drive circuitry supplying a fixed forward bias voltage to drive a selected one of said rows via a connected drive line;

sense circuitry for sensing each one of said columns via a connected sense line in a defined column-by-column succession; and

a controller for controlling said drive circuitry to selectively drive ones of said rows in a defined row-by-row succession and for imposing synchronization between said drive circuitry and said sense circuitry to achieve drive-and-sense scanning of said array to produce an infrared energy-indicative two-dimensional pixel image representative of the infrared energy incident upon said array.

9. The array of claim 8, wherein said controller operates to produce a timed succession of plural ones of said two-dimensional images at a substantially flicker-free periodic rate.

10. The array of claim 8, wherein said diodes in said two-dimensional arrangement are substantially thermally isolated from said substrate.

11. The array of claim 8, wherein said diodes fill approximately fifty percent or greater of the surface area of said generally planar diode arrangement within said array.

12. The array of claim 8, wherein said diodes are arranged with a packing density providing said controller with the ability to produce two-dimensional pixel images having a resolution of approximately 480 rows and approximately 640 columns.