Gas-filled plastic enclosed relay

• US 5,554,963 A
• Filed: 02/06/1995
• Issued: 09/10/1996
• Est. Priority Date: 06/11/1992
• Status: Expired due to Term

• Current Assignee: Tyco Electronics Logistics AG (TE Connectivity Limited)
• Original Assignee: Alcatel Sel AG (Nokia Corporation)
• Inventors: Johler, Werner, Kalin, Werner
• Primary Examiner(s): SCOTT, JAMES R
• Application Number:
  US08/384,692
• Time in Patent Office: 582 Days
• Field of Search: 174/52.3, 200/144 R-144 AP, 200/302.1-302.3, 200/306, 200/293, 335/128, 335/151, 335/189-204, 218/1, 218/43, 218/85
• US Class Current: 335/151
• CPC Class Codes: H01H 2050/025 containing inert or dielectric gasses, e.g. SF6, for arc prevention or arc extinction
• CPC Class Codes: H01H 33/22 Selection of fluids for arc-extinguishing
• CPC Class Codes: H01H 50/023 Details concerning sealing, e.g. sealing casing with resin
• CPC Class Codes: H01H 50/026 Details concerning isolation between driving and switching circuit
• CPC Class Codes: H01H 51/29 Relays having armature, contacts, and operating coil within a sealed casing H01H51/27 takes precedence

Abstract

A relay includes a plastic enclosure, contacts disposed in the plastic enclosure for selectively operating to make and/or break at least one electrical connection, a gas filling containing at least one electronegative gas, and a sealed plastic encapsulation for preventing the at least one electronegative gas from diffusing away, whereby the dielectric strength of the at least one electronegative gas is maintained throughout the intended life of the relay.

Claims

1. A gas-filled plastic enclosed relay for mounting on printed-circuit boards, comprising:

a relay in an irreversibly sealed plastic enclosure, having a gas filling under a pressure of less than 1.5 bar,

wherein the gas filling comprises at least one electronegative gas; and

wherein the sealed plastic enclosure encapsulates the relay and gas filling, and acts as a micro-filter matched to the at least one electronegative gas, preventing the electronegative gas which is under a pressure of less than 1.5 bar, from diffusing away over a predetermined lifetime of the relay, so that the partial pressure of the at least one electronegative gas, and thus an increased dielectric strength, are maintained to a sufficient extent.

2. A gas-filled plastic-enclosed relay for mounting on printed-circuit boards as claimed in claim 1, wherein the at least one electronegative gas comprises technically pure SF₆.

3. A gas-filled plastic-enclosed relay for mounting on printed-circuit boards as claimed in claim 1, wherein the at least one electronegative gas comprises a mixture of at least two gases.

4. A gas-filled plastic-enclosed relay for mounting on printed-circuit boards as claimed in claim 3 wherein one of the at least two gases is SF₆.