Light emitting semiconductor device with sub-mount
First Claim
1. A light emitting semiconductor device comprising:
- a semiconductor chip; and
a sub-mount assembled with the semiconductor chip;
wherein the semiconductor chip includes;
a light-permeable insulating substrate having a support surface and a tail surface opposite to the support surface;
a laminate of semiconductor layers formed on the support surface of the insulating substrate, the laminate including at least one N-type layer, a light emitting layer for generating light for emission from the tail surface of the substrate, and at least one P-type layer;
at least one anode electrode formed on the P-type layer; and
at least one cathode electrode formed on the N-type layer; and
wherein the sub-mount includes an electrically conductive substrate having a mounting surface facing the support surface of the insulating substrate, the mounting surface of the conductive substrate being formed with at least one auxiliary anode electrode which is electrically connected to the conductive substrate and the anode electrode of the semiconductor chip, the mounting surface of the conductive substrate being also formed with at least one auxiliary cathode electrode which is insulated from the conductive substrate but electrically connected to the cathode electrode of the semiconductor chip.
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Accused Products
Abstract
A light emitting semiconductor device is provided which comprises a semiconductor chip and a sub-mount assembled with the semiconductor chip. The semiconductor chip includes a light-permeable insulating substrate and a laminate of semiconductor layers formed on a support surface of the insulating substrate for generating light to be emitted from a tail surface of the substrate. The sub-mount includes an electrically conductive substrate having a mounting surface facing the support surface of the insulating substrate. The mounting surface of the conductive substrate is formed with at least one auxiliary anode electrode which is electrically connected to the conductive substrate and an anode electrode of the semiconductor chip. The mounting surface of the conductive substrate is also formed with at least one auxiliary cathode electrode which is insulated from the conductive substrate but electrically connected to a cathode electrode of the semiconductor chip.
109 Citations
6 Claims
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1. A light emitting semiconductor device comprising:
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a semiconductor chip; and a sub-mount assembled with the semiconductor chip; wherein the semiconductor chip includes;
a light-permeable insulating substrate having a support surface and a tail surface opposite to the support surface;
a laminate of semiconductor layers formed on the support surface of the insulating substrate, the laminate including at least one N-type layer, a light emitting layer for generating light for emission from the tail surface of the substrate, and at least one P-type layer;
at least one anode electrode formed on the P-type layer; and
at least one cathode electrode formed on the N-type layer; andwherein the sub-mount includes an electrically conductive substrate having a mounting surface facing the support surface of the insulating substrate, the mounting surface of the conductive substrate being formed with at least one auxiliary anode electrode which is electrically connected to the conductive substrate and the anode electrode of the semiconductor chip, the mounting surface of the conductive substrate being also formed with at least one auxiliary cathode electrode which is insulated from the conductive substrate but electrically connected to the cathode electrode of the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification