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Light emitting semiconductor device with sub-mount

  • US 5,557,115 A
  • Filed: 08/10/1995
  • Issued: 09/17/1996
  • Est. Priority Date: 08/11/1994
  • Status: Expired due to Term
First Claim
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1. A light emitting semiconductor device comprising:

  • a semiconductor chip; and

    a sub-mount assembled with the semiconductor chip;

    wherein the semiconductor chip includes;

    a light-permeable insulating substrate having a support surface and a tail surface opposite to the support surface;

    a laminate of semiconductor layers formed on the support surface of the insulating substrate, the laminate including at least one N-type layer, a light emitting layer for generating light for emission from the tail surface of the substrate, and at least one P-type layer;

    at least one anode electrode formed on the P-type layer; and

    at least one cathode electrode formed on the N-type layer; and

    wherein the sub-mount includes an electrically conductive substrate having a mounting surface facing the support surface of the insulating substrate, the mounting surface of the conductive substrate being formed with at least one auxiliary anode electrode which is electrically connected to the conductive substrate and the anode electrode of the semiconductor chip, the mounting surface of the conductive substrate being also formed with at least one auxiliary cathode electrode which is insulated from the conductive substrate but electrically connected to the cathode electrode of the semiconductor chip.

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