Heat dissipating arrangement in a portable computer
First Claim
Patent Images
1. Apparatus, comprising:
- a first printed circuit board having an opening therein and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being plated with a thermally-conductive material, said layer of etch being in thermally-conductive contact with said thermally-conductive material;
a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed relative to said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; and
a thermally-conductive slug disposed in said opening of said first printed circuit board in contact with the plated sides thereof, said slug in said first printed circuit board being in physical contact and in a thermally-conductive relationship with said integrated circuit on said second printed circuit board and in a thermally-conductive relationship with said layer of etch in said first printed circuit board to effect heat transfer therebetween.
3 Assignments
0 Petitions
Accused Products
Abstract
A heat dissipating arrangement in a portable computer uses a copper slug disposed between a heat-generating central processing unit (CPU) chip and the underside of a metallic keyboard baseplate. The slug also extends through a copper-plated hole in a printed circuit (PC) board, and is either soldered to the copper plating or press-fit into the hole to enhance heat transfer between the slug and the PC board. Small through-holes extend through the PC board and the copper plating next to the opening. These through-holes connect the copper plating to several layers of etch within the PC board, so that these layers act like fins on a heat sink to increase heat transfer away from the CPU.
-
Citations
21 Claims
-
1. Apparatus, comprising:
-
a first printed circuit board having an opening therein and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being plated with a thermally-conductive material, said layer of etch being in thermally-conductive contact with said thermally-conductive material; a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed relative to said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; and a thermally-conductive slug disposed in said opening of said first printed circuit board in contact with the plated sides thereof, said slug in said first printed circuit board being in physical contact and in a thermally-conductive relationship with said integrated circuit on said second printed circuit board and in a thermally-conductive relationship with said layer of etch in said first printed circuit board to effect heat transfer therebetween. - View Dependent Claims (2, 3, 4, 5, 19, 20, 21)
-
-
6. Apparatus, comprising:
-
a first printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in thermally-conductive relationship with said thermally-conductive material; a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed adjacent one side of said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; a thermally-conductive slug disposed in said opening of said first printed circuit board in thermally-conductive contact with the coated sides thereof, said thermally-conductive slug being in a thermally-conductive relationship with said integrated circuit; and a thermally-conductive plate, being different in kind from said integrated circuit, disposed on the opposite side of said first printed circuit board from said second printed circuit board and being in a thermally-conductive relationship with said thermally-conductive slug to effect heat transfer between said integrated circuit on said second printed circuit board and said plate. - View Dependent Claims (7)
-
-
8. Apparatus, comprising:
-
a housing; a printed circuit board secured to said housing, said printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in a thermally-conductive relationship with said thermally-conductive material; a thermally-conductive slug disposed in said opening of said printed circuit board in thermally-conductive contact with the plated sides thereof, said slug being in a thermally-conductive relationship with said layer of etch; a keyboard attached to said housing closely spaced apart from one side of said printed circuit board, said keyboard having a thermally-conductive baseplate at the underside thereof in a thermally-conductive relationship with said thermally-conductive slug; and an integrated circuit disposed on the other side of said printed circuit board from said baseplate, said integrated circuit being substantially aligned with said opening and in a thermally-conductive relationship with the other end of said thermally-conductive slug to effect heat transfer between said integrated circuit and said baseplate. - View Dependent Claims (9, 10)
-
-
11. Apparatus, comprising:
-
a first printed circuit board having an opening therethrough and a layer of thermally-conductive etch adjacent said opening, the sides of said opening being coated with a thermally-conductive material, said layer of etch being in a thermally-conductive relationship with said thermally-conductive material; a thermally-conductive slug disposed in said opening of said first printed circuit board, said slug being in a thermally-conductive relationship with said coated sides of said opening and with said layer of etch; a second printed circuit board having an integrated circuit mounted thereon, said second printed circuit board being disposed relative to said first printed circuit board such that said integrated circuit is substantially aligned with said opening in said first printed circuit board; and a layer of thermal grease being interposed between and in physical contact with said thermally-conductive slug in said opening of said first printed circuit board and said integrated circuit on said second printed circuit board for transferring heat therebetween. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
-
Specification