Headset for hands-free wireless telephone

• US 5,557,653 A
• Filed: 07/27/1993
• Issued: 09/17/1996
• Est. Priority Date: 07/27/1993
• Status: Expired due to Term

• Current Assignee: Spectralink Corporation (Mobile Devices Holdings LLC)
• Original Assignee: Spectralink Corporation (Mobile Devices Holdings LLC)
• Inventors: Boyd, Mark R., Bliss, Gary L., Paterson, Graeme S.
• Primary Examiner(s): Coles, Sr., Edward L.
• Assistant Examiner(s): Stoll, Thomas L.
• Application Number:
  US08/097,881
• Time in Patent Office: 1,148 Days
• Field of Search: 379/58, 379/59, 379/60, 379/62
• US Class Current: 455/575.2
• CPC Class Codes: H04B 1/38 Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
• CPC Class Codes: H04M 1/6058 involving the use of a headset accessory device connected to the portable telephone

Abstract

A wireless telephone using an RF receiver unit and an RF transmitter unit and having a removable headset, the telephone and headset particularly suitable for applications where the RF transmitter unit is switched on and off at a frequency less than twenty kilohertz. The wireless telephone is coupled to the headset using a conventional stereo plug and jack. A headset detect logic signal is generated from the speaker audio line. A microphone current detect logic signal is generated from the microphone audio line. A digital logic circuit, preferably including a microprocessor, monitors the headset detect logic signal and microphone current detect logic signals and generates a programmed response to the headset detect logic signal. The programmed response reduces audible noise to the headset user, generates a ringing signal on the speaker audio line when an incoming call is received and allows the headset user to answer incoming calls, and place outgoing calls while touching only the headset. The wireless telephone and headset include circuitry to reject RF noise and circuitry to attenuate RF noise passed into the wireless telephone by a long multi-conductor wire coupling the headset to the wireless telephone.

Claims

1. A wireless telephone having an RF receiver unit for receiving digitized voice information transmitted at a radio frequency and converting the received digitized voice information into a received audio signal on a speaker audio line, the wireless telephone also having an RF transmitter unit for converting a transmit audio signal of a users voice on a microphone audio line into digitized voice information and transmitting the digitized voice information at the radio frequency, wherein the RF transmitter unit is switched on and off at a frequency less than twenty kilohertz, the wireless telephone comprising:

a headset jack for receiving a headset plug, the headset jack having a ground conductor, first and second movable conductors, and first and second stationary conductors, wherein each of the movable conductors are electrically isolated from the stationary conductors when a headset is plugged into the headset jack and the second movable conductor is coupled to the microphone audio line;

a first RF attenuation network coupled to the speaker audio line, the first movable conductor, and ground;

a second RF attenuation network coupled to the microphone audio line and ground; and

an audio amplifier having an input coupled to the second RF attenuation network and having an output coupled to the RF transmitter unit.

2. The wireless telephone of claim 1 wherein the first and second RF attenuation networks are designed to filter energy at the frequency at which the RF transmitter unit is switched on and off.

3. The wireless telephone of claim 1 wherein the first RF attenuation network comprises:

a series coupled first resistor and inductor coupled between the first movable conductor and the speaker audio line;

a first capacitor coupled between the first movable conductor and ground.

4. The wireless telephone of claim 3 wherein the second RF attenuation network comprises:

a second capacitor coupled between the microphone audio line and ground;

a second resistor having a first end coupled to the microphone audio line and a second end;

a third capacitor coupled between the second end of the second resistor and ground.

5. The wireless telephone of claim 4 further comprising a fourth capacitor coupled between the input of the audio amplifier and ground, wherein the fourth capacitor is coupled physically close to input of the audio amplifier.

6. The wireless telephone of claim 1 further comprising:

a multi-conductor wire having a ground conductor, a speaker conductor, and a microphone conductor, wherein a lower portion of the multi-conductor wire is adapted for coupling the headset jack and the multi-conductor wire also having an upper portion;

an earphone capsule coupled to the upper portion of the multi-conductor wire;

a headset speaker positioned in the earphone capsule electrically coupled between the speaker conductor and the ground conductor of the upper portion of the multi-conductor wire;

a microphone amplifier positioned in the earphone capsule and having an output coupled to the microphone conductor and an input;

a microphone cartridge positioned near a users mouth;

a boom extending from the earphone capsule to the microphone cartridge

a first wire coupling to the ground conductor in the earphone capsule and passing from the earphone capsule through the boom to the microphone cartridge;

a second wire coupling to the input of the microphone amplifier and passing from the earphone capsule through the boom to the microphone cartridge;

a headset microphone positioned in the microphone cartridge and having a pair of leads coupled across the first wire and the second wires; and

a first capacitor electrically coupled to the pair of leads of the microphone.

7. The wireless telephone of claim 6 wherein the multi-conductor wire further comprises a manual switch placed in line with the microphone conductor for electrically disconnecting an upper portion of the microphone conductor from a lower portion of the microphone conductor.

8. The wireless telephone of claim 6 further comprising:

a second capacitor electrically coupled between the microphone amplifier input and the ground conductor; and

a third capacitor electrically coupled between the microphone amplifier output and the ground conductor.

9. The wireless telephone of claim 6 wherein the lower portion of the multi-conductor wire comprises a shielded cable having a conductive sheath surrounding the microphone conductor and speaker conductor, wherein the conductive sheath is electrically coupled to the ground conductor.

10. The wireless telephone of claim 6 wherein the first capacitor is positioned in the microphone capsule.

11. The wireless telephone of claim 10 wherein the first capacitor is a 270 picofarad surface mount capacitor.

12. The wireless telephone of claim 6 wherein the second and third capacitors are positioned in the earphone capsule.

13. A headset for a wireless telephone operating in a time division duplex or a time division multiple access environment, the headset having an earphone capsule encasing a headset speaker and a microphone amplifier, and having a microphone cartridge housing a microphone wherein the microphone cartridge is mounted on a boom extending from the earphone cartridge, the headset comprising:

a multi-conductor wire having a ground conductor, a speaker conductor, and a microphone conductor, wherein a lower portion of the multi-conductor wire is shielded and is adapted for coupling to a wireless telephone and an upper portion of the multi-conductor wire extends to the earphone capsule, wherein the headset speaker is electrically coupled between the speaker conductor and the ground conductor of the upper portion of the multi-conductor wire and the microphone amplifier has an output coupled to the microphone conductor;

a first wire coupling to the ground conductor in the earphone capsule and passing from the earphone capsule through the boom to electrically couple to the microphone;

a second wire coupling to an input of the microphone amplifier and passing from the earphone capsule through the boom to electrically couple to the microphone;

a headset microphone positioned in the microphone cartridge and having a pair of leads coupled across the first wire and the second wires; and

a first capacitor electrically coupled to the pair of leads of the microphone.