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Method for placing semiconductive plates on a support

  • US 5,559,043 A
  • Filed: 01/25/1995
  • Issued: 09/24/1996
  • Est. Priority Date: 01/26/1994
  • Status: Expired due to Term
First Claim
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1. Method for placing at least one semiconductive plate having a specific size and thickness on a support and including the following stages:

  • the bombardment by ions of one face of a semiconductive substrate so as to create there a film of gaseous microbubbles along a splitting plane of the substrate, the ion implantation energy being provided so as to obtain the film of gaseous microbubbles at a depth corresponding to the specific thickness of the semiconductive plate, the ions being selected from rare gas or hydrogen gas ions,then rendering integral structure by applying a support on said face of the substrate,illuminating by a laser beam of a zone of the face of the substrate corresponding to the plate to be placed through the support, the luminous energy transmitted by the beam through said support needing to be sufficient so as to induce in the corresponding region of the film of gaseous microbubbles a temperature sufficient to cause splitting of the plate of the support and provoke increasing the adherence of the plate to the support,thereby separating the substrate with respect to the support, this separation separating the plate from the substrate and retaining it on the support.

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