Inductor for high frequency circuits

• US 5,559,360 A
• Filed: 12/19/1994
• Issued: 09/24/1996
• Est. Priority Date: 12/19/1994
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Sung, Janmye, Chiu, Tzu-Yin, Jeon, Duk Y., Erceg, Frank M.
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): Tang, Alice W.
• Application Number:
  US08/359,309
• Time in Patent Office: 645 Days
• Field of Search: 257/531, 257/528, 257/773, 257/728, 257/379, 257/691, 257/698, 257/730, 336/200, 336/220, 336/65
• US Class Current: 257/531
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate inductors for integrated circuits H01L28/10

Abstract

An inductor fabricated for semiconductor use is disclosed. The inductor is formed with a multi-level, multi-element conductor metallization structure which effectively increases conductance throughout the inductor thereby increasing the inductor'"'"'s Q. The structure of the inductor may also provide for routing the current flowing through the multi-level, multi-element conductors in a way that increases the self inductance between certain conductive elements, thereby increasing the inductor'"'"'s total inductance.

Claims

1. An integrated circuit for use in high frequency applications that includes an inductive structure, said structure comprising:

a) a first electrical conductor comprising a sequence of substantially parallel first conductive elements electrically connected in parallel, each having first and second ends and disposed sequentially to form a first planar pattern, said first conductive elements having unequal electrical lengths and being electrically isolated from each other along said first pattern; and

a second electrical conductor

b) comprising a sequence of substantially parallel second conductive elements connected in parallel, each having first and second ends and disposed sequentially to form a second planar pattern, said second conductive elements having unequal electrical lengths and being electrically isolated from each other along said second pattern, said first planar pattern separated from said second planar pattern by a layer of dielectric material,

wherein individual said second ends of sequentially longer ones of said first conductive elements are electrically coupled to individual first ends of sequentially shorter ones of said second conductive elements thereby forming a combination of substantially equal length, equiresistant conductive elements from said first ends of said first conductive elements to said second ends of said second conductive elements.

2. The integrated circuit of claim 1, wherein said high frequency applications describe a range extending from about 100 MHz to about 10 GHz.

3. The integrated circuit defined by claim 1, wherein said inductive structure further comprises:

a) a third electrical conductor having a width W and a length L comprising a sequence of substantially parallel electrically isolated, conductive elements having first and second ends, wherein each sequential conductive element of said third conductor is juxtaposed with each sequential element of said first conductor; and

b) a fourth electrical conductor having a width W and a length L comprising a sequence of substantially parallel, electrically isolated, conductive elements having first and second ends, wherein each sequential conductive element of said fourth conductor is juxtaposed with each sequential element of said second conductor, wherein second ends of said conductive elements of said third conductor are electrically connected inverse sequentially to first ends of said conductive elements of said fourth conductor, and wherein said second ends of said elements of said second conductor are electrically connected sequentially to said first ends of said elements of said third conductor forming a sequence of substantially equal length, equiresistant, conductive elements.

4. The integrated circuit defined by claim 3, wherein said first end of said conductive elements of said first conductor are electrically connected and said second ends of conductive elements of said fourth conductor are electrically connected thereby defining a single conductive path formed of separate, parallel connected substantially equiresistant, equilength elements.

6. The inductive structure according to claim 1, wherein said first pattern is a first spiral and said second pattern is a second spiral.

7. The inductive structure according to claim 1, wherein said first spiral spirals inwardly in a clockwise direction and said second spiral spirals inwardly in a counterclockwise direction.

8. The inductive structure according to claim 1, wherein said dielectric substrate has opposed first and second planar surfaces, with said first electrical conductor disposed on said first planar surface and said second electrical conductor disposed on said second planar surface.

9. The structure defined by claim 8, wherein said first ends of said first conductor are electrically connected, and said second ends of said second conductor are electrically connected, defining a single conductive path formed of separate, parallel, connected, equilength elements.

10. The structure defined by claim 8, wherein said conductors are spiral shaped.

11. The structure defined by claim 8, further comprising:

a) a third electrical conductor comprising a sequence of substantially parallel, electrically isolated conductive elements having a width W and a length L extending between first and second ends, wherein each consecutive element of said third conductor is juxtaposed upon said first surface with each consecutive element of said first conductor; and

b) a fourth electrical conductor comprising a sequence of substantially parallel, electrically isolated conductive elements having a width W and a length L extending between first and second ends, wherein each consecutive element of said fourth conductor is juxtaposed upon said second surface with each consecutive element of said second conductor, wherein second ends of said conductive elements of said third conductor are electrically connected inverse sequentially to said first ends of said conductive elements of said fourth conductor, and wherein second ends of said conductive elements of said second conductor are electrically connected sequentially to first ends of said conductive elements of said third conductor thereby forming a sequence of substantially equal length, equiresistant conductive elements.

12. The structure defined by claim 11, wherein said first ends of said conductive elements of said first conductor are electrically connected, and said second ends of said conductive elements of said fourth conductor are electrically connected.

13. The structure defined by claim 8, wherein each of said first and second conductors have a width W, and further wherein a non-conductive region having a width W'"'"' is disposed between each element such that W>

W'"'"'.

14. The structure defined by claim 13, wherein the number of said substantially parallel, electrically isolated, conductive elements having first and second ends is 10, W is approximately equal to 6 μ

m and W'"'"' is approximately equal to 1 μ

m.

5. An inductive structure integrable with a semiconductor integrated circuit, comprising:

a) a dielectric substrate;

b) a first electrical conductor comprising a sequence of substantially parallel first conductive elements electrically connected in parallel, each having first and second ends and disposed in sequential order as a first pattern upon said substrate, said first conductive elements having unequal electrical lengths and being electrically isolated from each other along said first pattern; and

c) a second electrical conductor comprising a sequence of substantially parallel second conductive elements electrically connected in parallel, each having first and second ends, and disposed in sequential order upon said substrate as a second pattern in proximity to elements of said first conductor, said second conductive elements having unequal electrical lengths and being electrically isolated from each other along said second pattern, wherein individual second ends of sequentially longer ones of said first conducting elements are coupled to individual first ends of sequentially shorter ones of said second conductive elements, thereby forming a sequence of substantially equal length, equiresistant conductive path elements from said first ends of said first conductive elements to said second ends of said second conductive elements.