Hybrid integrated circuit

• US 5,559,374 A
• Filed: 03/25/1994
• Issued: 09/24/1996
• Est. Priority Date: 03/25/1993
• Status: Expired due to Fees

• Current Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Sakamoto, Noriaki, Ohta, Susumu, Ohkawa, Katsumi
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US08/218,604
• Time in Patent Office: 914 Days
• Field of Search: 257/723, 257/724, 257/693, 257/694
• US Class Current: 257/723
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A hybrid integrated circuit includes a plurality of metal plates supporting circuit elements and connectable directly to external power/output lines. The direct connection eliminates the need for solder terminals, allowing for reduced size and cost with increased reliability and lifespan. The metal plates can be position to allow for further minimization of the device, and uniform connection of internal wiring to the circuit elements.

Claims

1. A hybrid integrated circuit comprising:

a metallic substrate;

first and second metal plates;

said first metal plate being mounted on said metallic substrate;

said second metal plate shaped substantially as a step and having an upper step portion and a lower step portion;

said lower step portion being mounted on said metallic substrate;

said upper step portion of said second metal plate disposed above a portion of said first metal plate.

said upper step portion having an opening above a part of said portion of said first metal plate;

said upper step portion of said second metal plate having a control pattern thereon;

said first metal plate having means for mounting a switching element;

said switching element being arranged on said part of said portion of said first metal plate below said opening such that a plurality of connections between said switching element and said control pattern are of equal length, through said opening;

means for encasing said metallic substrate, said plurality of switching elements, said first and said second metal plates, and said plurality of connections;

said first and said second metal plates each including an end extending said first and said second metal plates beyond said means for encasing.

2. A hybrid integrated circuit comprising:

a metallic substrate;

first, second, and third metal plates;

said first metal plate being mounted on said metallic substrate;

said second metal plate shaped substantially as a step and having an upper step portion and a lower step portion;

said lower step portion being mounted on said metallic substrate;

said upper step portion of said second metal plate above said first metal plate and having an opening above said first metal plate;

said upper step portion of said second metal plate having a first control pattern thereon;

said first metal plate having means for mounting a first switching element;

said first switching element being arranged on said first metal plate below said opening;

said third metal plate above a part of said lower step portion of said second metal plate;

said third metal plate having a second control pattern thereon;

said lower step portion of said second metal plate having means for mounting a second switching element;

said second switching element being arranged on said lower step portion such that a plurality of connections made between said second switching element and said second control patten of said third metal plate are of equal length;

means for encasing said metallic substrate, said first and second switching elements, said first, said second and said third metal plates, and said connections;

said first, second and third metal plates including first, second and third protrusions, respectively; and

said first, second and third protrusions extending beyond said means for encasing.

3. A hybrid integrated circuit according to claim 2, wherein:

said first metal plate and said lower step portion of said second metal plate are in a same plane; and

at least one of said first, second, and third protrusions are substantially perpendicular to said plane.

4. A hybrid integrated circuit comprising:

a metallic substrate;

first, second and third copper plates

said first copper plate and at least a portion of said second copper plate being mounted on said metallic substrate and defining a plane;

said third copper plate being disposed above said plane by a predetermined distance and overlaps said second copper plate;

a source-side switching element disposed on said first copper plate;

a sink-side switching element disposed on said portion of said second copper plate being mounted on said metallic substrate;

means for connecting said source-side switching element, said sink-side switching element and said first, second and third copper plates in a predetermined pattern;

means for encasing said metallic substrate, said source-side switching element, said sink-side switching element, said first, second and third copper plates, and said means for connecting;

said first and said third copper plates including first and third protrusions, respectively, which extend beyond a periphery of said means for encasing;

said second copper plate including a second protrusion substantially perpendicular to said plane and extending beyond a top surface of said means for encasing; and

each of said first, second and third protrusions including means for connecting the respective protrusion to external circuits;

said second copper plate having an overlapping surface which is not part of said portion of said second copper plate being mounted on said substrate;

said overlapping surface being disposed above said first copper plate;

said overlapping surface having an opening through which portions of said source-side switching element are exposed;

a first control pattern disposed on said overlapping surface around said opening;

said means for connecting including means for uniformly connecting said source-side switching element to said control pattern;

a second control pattern disposed on said third copper plate; and

said means for connecting including means for linking said sink-side switching element to said second control pattern.

5. A hybrid integrated circuit according to claim 4, further comprising a capacitor connected between said first and second metal plates.