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Hybrid integrated circuit

  • US 5,559,374 A
  • Filed: 03/25/1994
  • Issued: 09/24/1996
  • Est. Priority Date: 03/25/1993
  • Status: Expired due to Fees
First Claim
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1. A hybrid integrated circuit comprising:

  • a metallic substrate;

    first and second metal plates;

    said first metal plate being mounted on said metallic substrate;

    said second metal plate shaped substantially as a step and having an upper step portion and a lower step portion;

    said lower step portion being mounted on said metallic substrate;

    said upper step portion of said second metal plate disposed above a portion of said first metal plate.said upper step portion having an opening above a part of said portion of said first metal plate;

    said upper step portion of said second metal plate having a control pattern thereon;

    said first metal plate having means for mounting a switching element;

    said switching element being arranged on said part of said portion of said first metal plate below said opening such that a plurality of connections between said switching element and said control pattern are of equal length, through said opening;

    means for encasing said metallic substrate, said plurality of switching elements, said first and said second metal plates, and said plurality of connections;

    said first and said second metal plates each including an end extending said first and said second metal plates beyond said means for encasing.

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