In-situ monitoring of the change in thickness of films

• US 5,559,428 A
• Filed: 04/10/1995
• Issued: 09/24/1996
• Est. Priority Date: 04/10/1995
• Status: Expired due to Term

• Current Assignee: Ebara Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Barbee, Steven G., Li, Leping, Halperin, Arnold, Heinz, Tony F.
• Primary Examiner(s): TOKAR, MICHAEL J
• Application Number:
  US08/419,206
• Time in Patent Office: 533 Days
• Field of Search: 324/765, 324/71.5, 324/767, 324/671, 324/230, 324/654, 324/758, 324/690, 324/239, 324/228, 324/262, 324/229
• US Class Current: 324/71.5
• CPC Class Codes: G01B 7/06 for measuring thickness measuring during the manufacture of coatings C23C14/54
• CPC Class Codes: G01B 7/10 using magnetic means, e.g. by measuring change of reluctance

Abstract

The change in thickness of a film on an underlying body such as a semiconductor substrate is monitored in situ by inducing a current in the film, and as the thickness of the film changes (either increase or decrease), the changes in the current are detected. With a conductive film, eddy currents are induced in the film by a generating an alternating electromagnetic field with a sensor which includes a capacitor and an inductor.

Claims

1. A method of in-situ monitoring of the change in thickness of a conductive film on an underlying body comprising the steps of:

(a) inducing an eddy current in the film by producing an alternating electromagnetic field with a sensor proximate the film, the sensor including a coil, a capacitor electrically connected to the coil, and a ferrite pot core for shaping the electromagnetic field; and

(b) detecting a change in the current due to the change in thickness of the film.

2. The method of claim 1 wherein the sensor is embedded in a means for strengthening the sensor.

3. The method of claim 2 wherein the strengthening means comprises a phenolic tube and epoxy for sealing the sensor inside the tube.

4. A method of in-situ monitoring of the change in thickness of a conductive film on an underlying body comprising the steps of:

(a) inducing an eddy current in the film by producing an alternating electromagnetic field with a sensor proximate the conductive film, the alternating electromagnetic field produced by electrically exciting the sensor from a sweep output from a spectrum analyzer through an impedance means; and

(b) detecting a change in the current due to the change in thickness of the film.

5. A method of in-situ monitoring of the change in thickness of a conductive film on an underlying body comprising the steps of:

(a) inducing an eddy current in the film by producing an alternating electromagnetic field with a sensor proximate the conductive film, the alternating electromagnetic field produced by electrically exciting the sensor from a swept output from a function generator through an impedance means; and

(b) detecting a change in the current due to the change in thickness of the film.

6. A method of in-situ monitoring of the change in thickness of a conductive film on a semiconductor substrate having a front side with the conductive film formed thereon, and a back side, comprising the steps of:

(a) inducing an eddy current in the film; and

(b) detecting a change in the current due to the change in thickness of the film.

7. The method of claim 6 wherein the semiconductor substrate further comprises at least one underlying film.

8. The method of claim 7 wherein the underlying film is conductive.

9. The method of claim 8 wherein the underlying film is a metal selected from the group of metals consisting of Cu, Cr, W, Al, Ta, Ti, TiN, and combinations thereof.

10. The method of claim 7 wherein the underlying film is magnetic.

11. The method of claim 7 wherein the underlying film is patterned into a semiconductor device structure.

12. The method of claim 7 wherein the conductive film to be removed is the same material as the underlying film.

13. A method of in-situ monitoring of the change in thickness of a conductive film on an underlying body, the film being removed by etching comprising the steps of:

(a) inducing an eddy current in the film by producing an alternating electromagnetic field with a sensor proximate the film; and

(b) detecting a change in the current due to the change in thickness of the film.

14. A method of in-situ monitoring of the change in thickness of a conductive film on an underlying body, the film being removed by chemical-mechanical polishing, comprising the steps of:

(a) inducing an eddy current in the film by producing an alternating electromagnetic field with a sensor proximate the film; and

b) detecting a change in the current due to the change in thickness of the film.

15. The method of claim 14 wherein the sensor is embedded in a wafer carrier for holding a semiconductor wafer against a polishing pad on top of a metal polishing table.

16. The method of claim 15 wherein the sensor is proximate only one side of the semiconductor wafer.

17. The method of claim 16 wherein the sensor is proximate a side of the semiconductor wafer away from the film.

18. The method of claim 17 wherein the metal polishing table has a shielding means on top of the table for limiting the penetration of the alternating electromagnetic field into the table.

19. The method of claim 18 wherein the shielding means comprises a ferrite coating.