Method of forming a device by selectively thermal spraying a metallic conductive material thereon

• US 5,559,677 A
• Filed: 02/14/1995
• Issued: 09/24/1996
• Est. Priority Date: 04/29/1994
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Errichiello, Dominic R.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): WHANG, YOUNG
• Application Number:
  US08/386,416
• Time in Patent Office: 588 Days
• Field of Search: 361/752, 361/796, 361/800, 361/816, 361/818, 174/35 R, 174/35 MS, 29/25.35, 427/239, 228/121, 228/215
• US Class Current: 361/816
• CPC Class Codes: H05K 9/0084 comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Abstract

The method disclosed herein begins with a molded housing (13 or 31). In one embodiment (20) the molded housing (13) has a ground shield (14) that is formed by thermally spraying a metallic conductive material onto the housing (13). Electrical connections are then made to link an electronic circuit on a printed circuit board assembly (21) to the ground shield (14). In another embodiment (30), the molded housing (31) has a plurality of elements (such as an indented channel (32), extrusions (33), a slot connector (34), and a notch (35)) that are thermally sprayed in selected areas to form a plurality of connective elements required by the electronic circuit of the printed circuit board assembly.

Claims

1. An electronic device comprising:

(a) a printed circuit board assembly having a plurality of electronic components forming an electronic circuit;

(b) a three-dimensional molded housing comprised of plastic, the three-dimensional molded housing including;

(i) an inner surface disposed about the electronic circuit, wherein at least a part of the inner surface has a ground shield comprised of a metallic conductive material thermally sprayed thereon; and

(ii) a plurality of molded elements, wherein selected areas of the plurality of molded elements are thermally sprayed with a metallic conductive material.

2. The electronic device of claim 1, wherein the metallic conductive material is comprised of copper.

3. The electronic device of claim 1, wherein the metallic conductive material is comprised of silver.

4. The electronic device of claim 1, wherein the metallic conductive material is comprised of gold.

5. The electronic device of claim 1, wherein the plurality of molded elements includes an indented channel.

6. The electronic device of claim 1, wherein the plurality of molded elements includes a notch.

7. An electronic device comprising:

(a) a printed circuit board assembly having a plurality of electronic components forming an electronic circuit;

(b) a three-dimensional molded housing comprised of plastic, the three-dimensional molded housing including;

(i) an inner surface disposed about the electronic circuit, wherein at least a part of the inner surface has a ground shield comprised of a metallic conductive material thermally sprayed thereon; and

(ii) a plurality of molded elements, wherein selected areas of the plurality of molded elements are thermally sprayed with a metallic conductive material, wherein the plurality of molded elements includes a slot connector.