Protective coating for dielectric material on wafer support used in integrated circuit processing apparatus and method of forming same

• US 5,560,780 A
• Filed: 04/12/1995
• Issued: 10/01/1996
• Est. Priority Date: 04/22/1993
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Ding, Jian, Wu, Robert
• Primary Examiner(s): Wilczewski, Mary
• Assistant Examiner(s): DUTTON, BRIAN KEITH
• Application Number:
  US08/420,620
• Time in Patent Office: 538 Days
• Field of Search: 118/728, 361/234, 269/8
• US Class Current: 118/728
• CPC Class Codes: H01L 21/6831 using electrostatic chucks

Abstract

Improvements in a wafer support apparatus used for electrostatic clamping of a wafer to the wafer support, and a method of making same, are disclosed wherein a dielectric material, formed on the surface of a wafer support facing the wafer to facilitate the electrostatic clamping, has a protective coating formed over the dielectric material to provide protection to the dielectric material against chemical attack from chemicals used during the processing of the semiconductor wafer. In a preferred embodiment, the protective coating comprises an aluminum compound, such as an oxide of aluminum or aluminum nitride, having a thickness ranging from about 1 micron to about 30 microns, but not exceeding about 50% of the thickness of the dielectric material so as to not interfere with the electrostatic charge used for clamping the wafer to the wafer support.

Claims

1. In a semiconductor wafer processing apparatus wherein an aluminum wafer support has a polymeric dielectric material formed thereon to permit electrostatic clamping of a semiconductor wafer to said wafer support by electrostatic charges, the improvement which comprises:

a protective coating of an inorganic aluminum compound of uniform thickness formed over at least portions of said polymeric dielectric material to protect said polymeric dielectric material from attack by chemicals used in processing said semiconductor wafer.

2. The apparatus of claim 1 wherein said protective coating has a maximum thickness which does not exceed about 50% of the thickness of said polymeric dielectric material.

3. The apparatus of claim 2 wherein said protective coating has a maximum coating thickness not exceeding about 30 microns.

4. The apparatus of claim 3 wherein said protective coating is uniform in thickness over said polymeric dielectric material to provide uniformity in the strength of said electrostatic charges exerted on said semiconductor wafer.

5. The apparatus of claim 3 wherein the thermal coefficient of expansion of said protective coating:

a) does not vary from the thermal coefficient of expansion of said wafer support by more than about 5%; and

b) does not vary from the thermal coefficient of expansion of said dielectric material by more than about 5%.

6. The apparatus of claim 3 wherein said protective coating has a minimum coating thickness of at least about 1 micron.

7. The apparatus of claim 3 wherein said protective coating has a minimum coating thickness of at least about 3 microns.

8. The apparatus of claim 3 wherein said protective coating is capable of protecting said dielectric material against penetration of said protective coating by particles during processing of said semiconductor wafer.

9. The apparatus of claim 3 wherein said protective coating has a resistivity ranging from about 10¹³ cm. to about 10²⁰ Ω

cm. to permit holding of said electrostatic charges thereon during said electrostatic clamping of said wafer and release of said semiconductor electrostatic charges when said wafer is to be removed from said wafer support.

10. The apparatus of claim 3 wherein said protective coating of said inorganic aluminum compound is selected from the group consisting of an oxide of aluminum and aluminum nitride.

11. The apparatus of claims 10 wherein said polymeric dielectric material comprises a polyimide material.

12. The apparatus of claim 2 wherein said protective coating has a maximum coating thickness not exceeding about 10 microns.

13. In a semiconductor wafer processing apparatus wherein a wafer support, comprising aluminum or an aluminum alloy, has a polymeric dielectric material formed thereon to permit clamping of a semiconductor wafer to said wafer support by electrostatic charges, the improvement which comprises:

a protective coating of uniform thickness formed over at least portions of said dielectric material, said protective coating of uniform thickness comprising an inorganic aluminum compound having a minimum coating thickness of at least about 1 micron and a maximum coating thickness of about 30 microns formed over said polymeric dielectric material to protect said polymeric dielectric material from attack by chemicals used in processing said semiconductor wafer.

14. The apparatus of claim 13 wherein said protective coating has a maximum coating thickness which does not exceed about 50% of the thickness of said polymeric dielectric material.

15. The apparatus of claim 13 wherein said protective coating is uniform in thickness over said dielectric material to provide uniformity in the strength of said electrostatic charges exerted on said semiconductor wafer.

16. The apparatus of claim 13 wherein the thermal coefficient of expansion of said protective coating:

does not vary from the thermal coefficient of expansion of said wafer support by more than about 5%; and

b) does not vary from the thermal coefficient of expansion of said dielectric material by more than about 5%.

17. The apparatus of claim 13 wherein said protective coating has a minimum coating thickness of at least about 3 microns.

18. The apparatus of claim 13 wherein said protective coating has a maximum coating thickness of about 10 microns.

19. The apparatus of claim 13 wherein said protective coating has a resistivity ranging from about 10¹³ Ω

cm. to about 10²⁰ Ω

cm. to permit holding of said electrostatic charge thereon during the electrostatic clamping of said semiconductor wafer and release of said electrostatic charge when said wafer is to be removed from said wafer support.

20. The apparatus of claim 13 wherein said aluminum compound is selected from the group consisting of an oxide of aluminum and aluminum nitride.

21. In a semiconductor wafer processing apparatus wherein an aluminum wafer support has a polymeric dielectric material formed thereon to permit clamping of a semiconductor wafer to said wafer support by electrostatic charges, the improvement which comprises:

a protective coating of uniform thickness selected from the group consisting of aluminum oxide and aluminum nitride formed over at least portions of the surface of said polymeric dielectric material to protect said polymeric dielectric material from attack by chemicals used in processing said semiconductor wafer.

22. The apparatus of claim 21 wherein said polymeric dielectric material comprises a polyimide material.

23. The apparatus of claim 21 wherein said protective coating comprises aluminum oxide formed over the entire surface of said polymeric dielectric material.

24. In a semiconductor wafer processing apparatus wherein an aluminum wafer support has formed thereon a polyimide dielectric material with an electrode embedded therein comprising an electrostatic clamping structure to permit clamping of a semiconductor wafer to said wafer support by electrostatic charges, the improvement which comprises:

a protective coating of uniform thickness of aluminum oxide formed over at least portions of the surface of said polyimide dielectric material to protect said polyimide dielectric material from attack by chemicals used in processing said semiconductor wafer.