Method of making ink-jet component

• US 5,560,837 A
• Filed: 11/08/1994
• Issued: 10/01/1996
• Est. Priority Date: 11/08/1994
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Trueba, Kenneth E.
• Primary Examiner(s): Fourson, George
• Assistant Examiner(s): Kirkpatrick, Scott
• Application Number:
  US08/336,405
• Time in Patent Office: 693 Days
• Field of Search: 430/326, 430/394, 430/312, 29/890.1, 216/27, 205/135, 205/75, 205/127
• US Class Current: 216/27
• CPC Class Codes: B41J 2/162 Manufacturing of the nozzle plates
• CPC Class Codes: B41J 2/1625 electroforming
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet

Abstract

A process for fabricating a thin-film structure using a transparent substrate is disclosed. A first structure, such as a ring having a central pillar, is formed of a conductive material on a surface of the substrate. A photoresist material pillar is formed on top of the conductive material central pillar by exposure through the transparent material. Such structures are useful as mandrel structures in the forming of precision thin-film components such as nozzle plates, mesh filter screens, and the like, for ink-jet pens.

Claims

1. A process for fabricating a thin-film structure, comprising:

forming a first construct of a conductive material on a portion of a first surface of a transparent substrate by

forming a layer of a conductive material on said first surface of said transparent substrate,

forming a layer of photoresist superposing said layer of a conductive material,

exposing and developing said layer of photoresist to form at least one annular structure portion encompassing a central pillar portion, and

etching said layer of conductive material using said annular structure portion and said central pillar portion as an etch process mask such that at least one first construct comprising an annular structure portion encompassing a central pillar portion remains on said first surface of said transparent substrate;

defining a second construct of a photoresist material on said first construct by exposing a layer of photoresist material through said transparent substrate wherein said first construct functions as a mask during said exposing;

masking at least a portion of said second construct for direct exposure from above said first surface;

exposing said photoresist material by direct exposure from above said first surface; and

forming said second construct by developing said photoresist material thereby forming a pillar of said photoresist on said central pillar portion.

2. The process as set forth in claim 1, wherein said step of forming a second construct further comprises:

forming a plurality of said second constructs on said surface of said substrate to function as mandrels for fabricating ink-jet pen nozzle plates.

3. The process as set forth in claim 1, wherein said step of forming a second construct further comprises:

forming a plurality of said second constructs on said surface of said substrate to function as mandrels for fabricating ink-jet pen filter screens.

4. The process as set forth in claim 1, wherein said step of forming a first construct comprises:

forming a set of conductive material constructs on said transparent substrate; and

further comprises filling spaces between said conductive material constructs with a dielectric material.

5. The process as set forth in claim 4, wherein said step of forming a set of conductive material constructs comprises:

depositing a metal layer to adhere to said transparent substrate;

processing said metal layer to form metal layer constructs.

6. The process as set forth in claim 5, wherein said step of filling spaces between said conductive material constructs with a dielectric material further comprises:

covering said metal layer with a dielectric material layer;

covering said dielectric layer with a negative photoresist;

exposing said photoresist through said transparent substrate;

developing said photoresist; and

etching said dielectric layer,

whereby dielectric material remains on said substrate only in said spaces between said metal layer constructs.

12. The method as set forth in claim 1, wherein said step of forming said pen component further comprises:

electroforming a pen component onto said substrate and said opaque constructs such that said subset of opaque constructs having said overlaying photoresist constructs act as orifice mandrels; and

peeling said pen component from said substrate and said constructs.

14. The method as set forth in claim 3, wherein said step of forming a layer of conductive material constructs on said substrate frontside surface comprises:

depositing a metal layer having relatively strong adhesion with said substrate frontside surface; and

processing said metal layer to form metal layer constructs.

15. The process as set forth in claim 4, wherein said step of

forming dielectric rings on said ring-shaped regions of substrate frontside surface comprises:

covering said metal layer with a dielectric material layer;

covering said dielectric layer with a negative photoresist;

exposing said photoresist through said backside surface;

developing said photoresist; and

etching said dielectric layer,

whereby dielectric material remains on said substrate only in said spaces between said metal layer constructs.

16. The method as set forth in claim 3, wherein said step of forming pillars of a photoresist material on each said pillar of conductive material further comprises:

forming a plurality of said pillars of a photoresist material in a pattern to function as mandrels for electroforming ink-jet pen components thereon.

17. The method as set forth in claim 6, wherein said step of forming a plurality of said pillars of a photoresist material in a pattern further comprises:

forming said pillars of a photoresist material in a pattern to electroform an ink-jet orifice plate thereon.

18. The method as set forth in claim 6, wherein said step of forming a plurality of said pillars of a photoresist material in a pattern further comprises:

forming said pillars of a photoresist material in a pattern to electroform an ink-jet ink mesh filter screen thereon.

7. A method for fabricating a thin-film mandrel structure on a substrate having the property of transparency, comprising:

forming regions of a mandrel first portion and second portion of a conductive material on a first surface of said substrate;

depositing a layer of photoresist material superjacent said mandrel first portion and second portion and said first surface of said substrate not covered by said regions of said mandrel first portion and second portion;

exposing said photoresist material through said transparent substrate whereby said mandrel first portion and second portion masks superjacent regions of said photoresist material leaving unexposed regions of said photoresist material superjacent said mandrel first portion and second portion;

forming a mask on said unexposed region of said photoresist material superjacent said mandrel first portion;

exposing said photoresist material such that said mask shields said unexposed region of said photoresist material superjacent said mandrel first portion;

developing said photoresist material; and

removing exposed photoresist material whereby a mandrel is formed of a layer of said unexposed region of said photoresist material superposing said mandrel first portion.

8. The method as set forth in claim 7, wherein said step of forming regions of a mandrel first portion and second portion of a conductive material on a first surface of said substrate comprises:

providing a glass substrate;

depositing a layer of metal on said first surface of said substrate;

forming a layer of photoresist on said layer of metal;

masking said layer of photoresist with a first pattern for forming a plurality of mandrels on said first surface of said substrate;

exposing unmasked regions of said photoresist;

developing said photoresist;

stripping said unmasked regions of said photoresist whereby masked regions of said photoresist remain on regions of said layer of metal as an etching mask;

etching unmasked regions of said metal layer down to said first surface of said substrate; and

stripping said etching mask, whereby a plurality of mandrel first portions and second portions remain on said first surface of said substrate.

9. The method as set forth in claim 8, further comprising:

forming a plurality of said thin-film mandrel structures on said substrate having a shape, dimensions and spacing for forming an ink-jet pen nozzle plate thereon.

10. The method as set forth in claim 8, further comprising:

forming a plurality of said thin-film mandrel structures on said substrate having a shape, dimensions and spacing for forming an ink-jet pen ink filter screen thereon.

11. A method for fabricating an ink-jet pen component having a plurality of orifices of shape and dimensions at a spacing on said pen component, comprising:

providing a transparent substrate;

forming a plurality of opaque constructs on said substrate having a pattern conforming to said shape and dimensions at a spacing for said pen component;

forming a photoresist mandrel portion on said plurality of opaque constructs by;

overlaying said opaque constructs and said substrate with a photoresist material,

exposing said photoresist through said substrate using said opaque constructs to mask portions of said photoresist overlaying said opaque constructs,

masking said photoresist over a subset of said opaque constructs in accordance with said pattern conforming to said shape and dimensions at a spacing for said pen component,

exposing said photoresist material such that all unmasked regions are exposed,

developing said photoresist material, and

stripping all exposed photoresist material whereby a photoresist construct overlays said subset of said opaque constructs;

forming said pen component using said opaque constructs and opaque constructs having said overlaying photoresist constructs as a mandrel structure to form said pen component.

13. A method for fabricating a reusable thin-film mandrel structure, comprising:

forming a layer of conductive material constructs on said substrate frontside surface such that said constructs form annular ring-shaped regions of substrate frontside surface, each construct having a pillar of conductive material centrally located therein;

forming dielectric rings on said ring-shaped regions of substrate frontside surface;

forming pillars of a photoresist material on each said pillar of conductive material by

forming a layer of photoresist material on said frontside,

exposing said photoresist through said backside such that said conductive material constructs function as a mask during said exposing,

masking said photoresist material over said pillars of conductive material,

exposing said photoresist material, and

developing said photoresist material.