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Method of making ink-jet component

  • US 5,560,837 A
  • Filed: 11/08/1994
  • Issued: 10/01/1996
  • Est. Priority Date: 11/08/1994
  • Status: Expired due to Term
First Claim
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1. A process for fabricating a thin-film structure, comprising:

  • forming a first construct of a conductive material on a portion of a first surface of a transparent substrate byforming a layer of a conductive material on said first surface of said transparent substrate,forming a layer of photoresist superposing said layer of a conductive material,exposing and developing said layer of photoresist to form at least one annular structure portion encompassing a central pillar portion, andetching said layer of conductive material using said annular structure portion and said central pillar portion as an etch process mask such that at least one first construct comprising an annular structure portion encompassing a central pillar portion remains on said first surface of said transparent substrate;

    defining a second construct of a photoresist material on said first construct by exposing a layer of photoresist material through said transparent substrate wherein said first construct functions as a mask during said exposing;

    masking at least a portion of said second construct for direct exposure from above said first surface;

    exposing said photoresist material by direct exposure from above said first surface; and

    forming said second construct by developing said photoresist material thereby forming a pillar of said photoresist on said central pillar portion.

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