Method of making ink-jet component
First Claim
Patent Images
1. A process for fabricating a thin-film structure, comprising:
- forming a first construct of a conductive material on a portion of a first surface of a transparent substrate byforming a layer of a conductive material on said first surface of said transparent substrate,forming a layer of photoresist superposing said layer of a conductive material,exposing and developing said layer of photoresist to form at least one annular structure portion encompassing a central pillar portion, andetching said layer of conductive material using said annular structure portion and said central pillar portion as an etch process mask such that at least one first construct comprising an annular structure portion encompassing a central pillar portion remains on said first surface of said transparent substrate;
defining a second construct of a photoresist material on said first construct by exposing a layer of photoresist material through said transparent substrate wherein said first construct functions as a mask during said exposing;
masking at least a portion of said second construct for direct exposure from above said first surface;
exposing said photoresist material by direct exposure from above said first surface; and
forming said second construct by developing said photoresist material thereby forming a pillar of said photoresist on said central pillar portion.
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Abstract
A process for fabricating a thin-film structure using a transparent substrate is disclosed. A first structure, such as a ring having a central pillar, is formed of a conductive material on a surface of the substrate. A photoresist material pillar is formed on top of the conductive material central pillar by exposure through the transparent material. Such structures are useful as mandrel structures in the forming of precision thin-film components such as nozzle plates, mesh filter screens, and the like, for ink-jet pens.
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Citations
18 Claims
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1. A process for fabricating a thin-film structure, comprising:
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forming a first construct of a conductive material on a portion of a first surface of a transparent substrate by forming a layer of a conductive material on said first surface of said transparent substrate, forming a layer of photoresist superposing said layer of a conductive material, exposing and developing said layer of photoresist to form at least one annular structure portion encompassing a central pillar portion, and etching said layer of conductive material using said annular structure portion and said central pillar portion as an etch process mask such that at least one first construct comprising an annular structure portion encompassing a central pillar portion remains on said first surface of said transparent substrate; defining a second construct of a photoresist material on said first construct by exposing a layer of photoresist material through said transparent substrate wherein said first construct functions as a mask during said exposing; masking at least a portion of said second construct for direct exposure from above said first surface; exposing said photoresist material by direct exposure from above said first surface; and forming said second construct by developing said photoresist material thereby forming a pillar of said photoresist on said central pillar portion. - View Dependent Claims (2, 3, 4, 5, 6, 12, 14, 15, 16, 17, 18)
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7. A method for fabricating a thin-film mandrel structure on a substrate having the property of transparency, comprising:
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forming regions of a mandrel first portion and second portion of a conductive material on a first surface of said substrate; depositing a layer of photoresist material superjacent said mandrel first portion and second portion and said first surface of said substrate not covered by said regions of said mandrel first portion and second portion; exposing said photoresist material through said transparent substrate whereby said mandrel first portion and second portion masks superjacent regions of said photoresist material leaving unexposed regions of said photoresist material superjacent said mandrel first portion and second portion; forming a mask on said unexposed region of said photoresist material superjacent said mandrel first portion; exposing said photoresist material such that said mask shields said unexposed region of said photoresist material superjacent said mandrel first portion; developing said photoresist material; and removing exposed photoresist material whereby a mandrel is formed of a layer of said unexposed region of said photoresist material superposing said mandrel first portion. - View Dependent Claims (8, 9, 10)
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11. A method for fabricating an ink-jet pen component having a plurality of orifices of shape and dimensions at a spacing on said pen component, comprising:
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providing a transparent substrate; forming a plurality of opaque constructs on said substrate having a pattern conforming to said shape and dimensions at a spacing for said pen component; forming a photoresist mandrel portion on said plurality of opaque constructs by; overlaying said opaque constructs and said substrate with a photoresist material, exposing said photoresist through said substrate using said opaque constructs to mask portions of said photoresist overlaying said opaque constructs, masking said photoresist over a subset of said opaque constructs in accordance with said pattern conforming to said shape and dimensions at a spacing for said pen component, exposing said photoresist material such that all unmasked regions are exposed, developing said photoresist material, and stripping all exposed photoresist material whereby a photoresist construct overlays said subset of said opaque constructs; forming said pen component using said opaque constructs and opaque constructs having said overlaying photoresist constructs as a mandrel structure to form said pen component.
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13. A method for fabricating a reusable thin-film mandrel structure, comprising:
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forming a layer of conductive material constructs on said substrate frontside surface such that said constructs form annular ring-shaped regions of substrate frontside surface, each construct having a pillar of conductive material centrally located therein; forming dielectric rings on said ring-shaped regions of substrate frontside surface; forming pillars of a photoresist material on each said pillar of conductive material by forming a layer of photoresist material on said frontside, exposing said photoresist through said backside such that said conductive material constructs function as a mask during said exposing, masking said photoresist material over said pillars of conductive material, exposing said photoresist material, and developing said photoresist material.
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Specification