Integrated circuit packaging

• US 5,561,265 A
• Filed: 10/04/1994
• Issued: 10/01/1996
• Est. Priority Date: 03/24/1993
• Status: Expired due to Term

• Current Assignee: Rockstar Consortium US LP (Rockstar Consortium Inc.)
• Original Assignee: Northern Telecom Limited (Nortel Networks Corporation)
• Inventors: Livshits, Boris I., Harpell, Kevin E.
• Primary Examiner(s): Kincaid, Kristine L.
• Assistant Examiner(s): Horgan, Christopher
• Application Number:
  US08/318,063
• Time in Patent Office: 728 Days
• Field of Search: 174/32, 174/35 R, 174/35 MS, 174/35 GC, 174/52.1-52.4, 361/816, 361/818, 257/659, 250/505.1, 250/506.1, 250/515.1
• US Class Current: 174/386
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/10162 with a square active surface
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1617 : Cavity coating
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A package is provided for an integrated circuit comprising a dielectric body enclosing the integrated circuit chip having a plurality of conductive terminal members extend through the dielectric body. The dielectric body includes a magnetic shielding layer for shielding electromagnetic radiation from the integrated circuit. The magnetic shielding layer comprises a material having a high magnetic permeability and a high resistivity, so that the dielectric body absorbs electromagnetic radiation at frequencies generated by the integrated circuit and thereby attenuates electromagnetic emissions from the integrated circuit. Suitable materials having a high dielectric constant and high magnetic permeability include ferrites. Conveniently a shielding layer of ferrimagnetic material comprising a ferrite plate may be applied to surfaces of a conventional plastic or ceramic packaging material. Alternatively, ferrite particles may be incorporated into binder to form a composite material suitable for forming into an IC package. The magnetic nature of the shielding provides that a non-conductive dielectric package may significantly attenuate and suppress electromagnetic interference generated by an enclosed IC. Further to provide effective electromagnetic shielding for a large apparatus, individual packages may be customized to provided shielding to particular integrated circuit chips with higher emissions, thereby reducing the total cost of shielding an electronic system or apparatus.

Claims

1. An assembly of a microelectronic device and a package, the package comprising a dielectric body enclosing the microelectronic device, with a plurality of electrically conductive members extending through the dielectric body to an exterior of the package and electrically connected with the microelectronic device, and

the dielectric body comprising means for shielding electromagnetic radiation consisting of a non-conductive layer of a magnetic material forming at least part of the dielectric body, the non-conductive layer of magnetic material having a high magnetic permeability at selected frequencies of radiation generated by operation of the microelectronic device, and the non-conductive layer of magnetic material extending over the microelectronic device for attenuating electromagnetic emission through the dielectric body radiated from the microelectronic device.

2. An assembly according to claim 1 wherein the microelectronic device comprises an integrated cirtuit.

3. An assembly according to claim 1 wherein the non-conductive layer of magnetic material comprises a ferrite.

4. An assembly according to claim 1 wherein the non-conductive layer of magnetic material comprises a layer of ferrimagnetic material.

5. An assembly according to claim 1 wherein the non-conductive layer of magnetic material comprises a plate of ferrite material forming an exterior cladding of the dielectric body.

6. An assembly according to claim 1 wherein the non-conductive layer of magnetic material comprises particles of ferrimagnetic material supported in a matrix of a dielectric material forming the dielectric body.

7. An assembly according to claim 1 wherein the non-conductive layer of magnetic material comprises particles of ferromagnetic material dispersed in a matrix of a dielectric material forming the dielectric body.

8. A packaged integrated circuit comprising:

an integrated circuit chip and a package comprising a dielectric body enclosing the integrated circuit chip, and electrically conductive terminal members electrically connected to the integrated circuit chip and extending through the dielectric body to an exterior of the dielectric body,

the dielectric body comprising means for shielding electromagnetic radiation consisting of a non-conductive layer of a magnetic material forming at least part of the dielectric body, the non-conductive layer of magnetic material having a high magnetic permeability at selected frequencies of radiation generated by operation of the integrated circuit chip and the non-conductive layer of magnetic material extending over the integrated circuit chip for attenuating electromagnetic emission through the dielectric body radiated from the integrated circuit chip.

9. A packaged integrated circuit according to claim 8 wherein the dielectric body comprises a substrate member supporting the integrated circuit chip and a cover member, and the non-conductive layer of magnetic material is provided by a cladding of a ferrite material laminated on an exterior surface of at least one of the cover member and the substrate member.

10. A packaged integrated circuit according to claim 9 wherein the cover member and substrate member define a chamber enclosing the integrated circuit chip.

11. A method of attenuating electromagnetic emission from an electronic apparatus including a plurality of packaged integrated circuits, comprising:

selectively shielding an individual integrated circuit of the plurality of integrated circuits with a package including a dielectric body by providing at least part of the dielectric body with magnetic means for shielding electromagnetic radiation consisting of a non-conductive layer of magnetic material having a high resistivity and a high magnetic permeability at frequencies generated by operation of the enclosed individual integrated circuit, electromagnetic emission through the dielectric body radiated from the individual integrated circuit being attenuated by the non-conductive layer of magnetic material extending over the integrated circuit.

12. A method according to claim 11 wherein the non-conductive layer of magnetic material comprises a ferrite material and said ferrite material is provided as a covering of the dielectric body.

13. A package for an integrated circuit, comprising:

a dielectric body cooperable with a substrate for enclosing therein an integrated circuit with electrically conductive terminal members extending from the integrated circuit to an exterior of the dielectric body,

and the dielectric body comprising electromagnetic radiation shielding means consisting of a non-conductive layer of a magnetic material forming at least part of the dielectric body, the non-conductive layer of magnetic material having a high magnetic permeability to electromagnetic radiation at frequencies generated by operation of the integrated circuit and the non-conductive layer of magnetic material extending over the integrated circuit for attenuating electromagnetic emission through the dielectric body radiated from the integrated circuit.

14. A package according to claim 13 wherein the non-conductive layer of magnetic material forms an exterior cladding layer of the dielectric body.

15. A package according to claim 13 wherein the non-conductive layer of magnetic material comprises a ferrite and forms an exterior cladding layer of the dielectric body.

16. A package according to claim 13 wherein the non-conductive layer of magnetic material comprises a ferrimagnetic material having a high resistivity and the dielectric body is formed from said ferrimagnetic material.

17. A package according to claim 16 wherein the ferrimagnetic material comprises ferrite particles dispersed in an organic resin matrix.

18. A package according to claim 16 wherein the ferrimagnetic material comprises ferrite particles dispersed in a ceramic matrix.