Duplexer package
First Claim
Patent Images
1. A multilayer duplexer package comprising:
- two surface-acoustic-wave filter chips having different center pass band frequencies; and
at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip,said phase matching circuits respectively comprising strip lines stacked one above another, andsaid strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package.
2 Assignments
0 Petitions
Accused Products
Abstract
A multilayer duplexer package is provided, which includes: two surface-acoustic-wave filter chips having different center pass band frequencies; and at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip, said phase matching circuits respectively comprising strip lines stacked one above another, and said strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package.
-
Citations
9 Claims
-
1. A multilayer duplexer package comprising:
-
two surface-acoustic-wave filter chips having different center pass band frequencies; and at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip, said phase matching circuits respectively comprising strip lines stacked one above another, and said strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
Specification