Methods and apparatus for treating a work surface
First Claim
1. A method of plasma machining or treating a work surface, comprising generating a plasma jet at substantially atmospheric pressure by mixing a plasma-generating gas with a working material, supplying the plasma jet at substantially atmospheric pressure to the work surface while the work surface and the plasma jet move relative to each other so the work surface moves into and out of a machining zone, surrounding the plasma jet with a shaped jet-type shielding gas screen flowing from a pipe or duct through a slot surrounding the plasma jet and facing towards the machining zone so a volume defined by the walls of the pipe or duct is covered by a gas-tight partition, and positioning the work holder and the slot so they are spaced from each other by a distance that is no greater than
whereV=the velocity of the shielding gas jet;
R=the width of the slot in the pipe or duct; and
D=the coefficient of diffusion of atoms and molecules of an ambient medium into the shielding gas jet.
1 Assignment
0 Petitions
Accused Products
Abstract
A work surface, e.g. an integrated circuit, is treated with a plasma jet. The work surface is shielded from an ambient medium by a shielding gas jet directed to create a shielded zone around the work surface, or which is blown over the work surface so it intersects the plasma jet on the work surface.
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Citations
22 Claims
- 1. A method of plasma machining or treating a work surface, comprising generating a plasma jet at substantially atmospheric pressure by mixing a plasma-generating gas with a working material, supplying the plasma jet at substantially atmospheric pressure to the work surface while the work surface and the plasma jet move relative to each other so the work surface moves into and out of a machining zone, surrounding the plasma jet with a shaped jet-type shielding gas screen flowing from a pipe or duct through a slot surrounding the plasma jet and facing towards the machining zone so a volume defined by the walls of the pipe or duct is covered by a gas-tight partition, and positioning the work holder and the slot so they are spaced from each other by a distance that is no greater than
- space="preserve" listing-type="equation">L=R.sup.2 V/D
where V=the velocity of the shielding gas jet; R=the width of the slot in the pipe or duct; and D=the coefficient of diffusion of atoms and molecules of an ambient medium into the shielding gas jet. - View Dependent Claims (2, 3, 4, 5)
- 6. A method of plasma treating a workpiece surface comprising generating a directed plasma jet to form an operative or treatment zone, the plasma jet, as it emerges from an opening, having a transverse dimension R and a forward velocity Vp, forming an additional stream of a shielding or protective gas at the operative or treatment zone, bringing the workpiece surface into the operative or treatment zone, continuously displacing the workpiece surface in the operative or treatment zone so the workpiece surface is brought into and removed from said zone more than once, blowing the additional stream of shielding or protective gas across the workpiece surface being treated before the workpiece is brought into or removed from the operative or treatment zone, and placing the workpiece surface being treated at a predetermined distance (L1) from the opening for the plasma jet,
wherein - space="preserve" listing-type="equation">L.sub.1 =V.sub.p R.sup.2 /D.sub.2
where D2 =coefficient of diffusion of ambient material into the plasma jet. - View Dependent Claims (7, 8, 9)
- 8. A method as claimed in claim 6 wherein the protective gas jet flows through a gas-permeable nozzle mounted in the second opening.
- 9. A method as claimed in claim 6, wherein an opening through which the protective gas jet flows and a remote end of a holder for the workpiece are positioned so S3 <
- Vg R2 /D where;
Vg is the forward velocity of the protective gas jet.
- 10. A method of protecting an ultra-clean surface from an ambient medium comprising forming a jet having an interior portion of an ultra-pure gaseous medium surrounded by a mixture of the ultra-pure gaseous medium and the ambient medium, the interior portion of the jet having a length L,
- space="preserve" listing-type="equation">L=VZ.sup.2 /D
where V=velocity of gas jet; Z=transverse dimension of the shielding gas jet at its origin; and D=coefficient of diffusion of the ambient medium into the ultra-pure gaseous medium; blowing the jet over the surface to be protected; and positioning the surface and the origin of the gas jet so the jet as it blows over the surface is no farther from the origin than L.
- 11. A method of treating a workpiece surface in a generally open environment including ambient materials comprising directing a plasma treating jet toward the surface in a direction generally normal to the surface, the plasma treating jet including an interior portion containing only gases in the plasma and no ambient materials, the interior portion being surrounded by a portion including a mixture of the plasma gases and the ambient materials, directing a shielding jet toward the surface from a direction that is not generally normal to the surface while the treating jet is being directed toward the surface, the shielding jet including an interior portion including only gases of the shielding jet surrounded by a portion including a mixture of the shielding jet gases and the ambient materials, and positioning the workpiece surface and the treating jet and the shielding jet so the interior portions of the treating jet and the shielding jet are simultaneously incident on the same portion of workpiece surface.
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15. A method of treating a workpiece surface in a generally open environment including ambient materials comprising directing a plasma treating jet toward the surface in a direction generally normal to the surface, directing a shielding jet toward the surface while the treating jet is being directed toward the surface, the shielding jet including an interior portion including only gases of the shielding jet surrounded by a portion including a mixture of the shielding jet gases and the ambient materials, and positioning the workpiece surface and the treating jet and the shielding jet so the interior portion of the shielding jet is incident on the workpiece surface simultaneously with the treating jet being incident on the workpiece surface so the interior portion of the shielding jet prevents ambient materials from flowing into the portion of the workpiece surface on which the treating jet is incident.
- View Dependent Claims (16, 18)
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18. The method of claim 15 wherein the treating and shielding jets are arranged so the interior portion of the shielding jet intersects the treating jet on the workpiece surface.
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17. The method of claim wherein the treating and shielding jets are arranged so the interior portion of the shielding jet surrounds the treating jet.
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19. A method of treating a portion of an integrated circuit workpiece substrate surface in a generally open environment including ambient materials comprising
(a) removing impurities from the surface position by applying to the surface portion a plasma jet including at least one of excited atoms and ions that remove the impurities from the surface portion, (b) then, after the impurities have been removed by step (a) applying to the surface portion a plasma jet including a material that treats the surface portion, and (c) while steps (a) and (b) are being performed preventing the ambient materials from being incident on the surface portion by applying to the surface a shielding jet having an interior portion including only gases of the shielding jet surrounded by a portion including a mixture of the shielding jet gases and the ambient materials, and (d) positioning the workpiece surface and the treating jet and the shielding jet so the interior portion is incident on the surface portion.
Specification