Implantable capacitive absolute pressure and temperature sensor

• US 5,564,434 A
• Filed: 02/27/1995
• Issued: 10/15/1996
• Est. Priority Date: 02/27/1995
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Patrick, Timothy, Svensk, James R., Hassler, Beth A., Miesel, Keith A., Varrichio, Anthony J., Ufford, Keith A., Halperin, Louis E.
• Primary Examiner(s): Hindenberg, Max
• Assistant Examiner(s): WINGOOD, PAMELA LYNN
• Application Number:
  US08/394,870
• Time in Patent Office: 596 Days
• Field of Search: 128/675, 128/673, 128/736, 128/748, 128/722, 73/724
• US Class Current: 600/488
• CPC Class Codes: A61B 2560/0257 using atmospheric pressure
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/7217 of noise originating from a therapeutic or surgical apparatus, e.g. from a pacemaker
• CPC Class Codes: A61N 1/3655 controlled by body or blood temperature
• CPC Class Codes: A61N 1/36564 controlled by blood pressure
• CPC Class Codes: Y10S 977/90 having step or means utilizing mechanical or thermal property, e.g. pressure, heat
• CPC Class Codes: Y10S 977/905 Specially adapted for travel through blood circulatory system

Abstract

An endocardial lead for implantation in a right heart chamber for responding to blood pressure and temperature and providing modulated pressure and temperature related signals to an implanted or external hemodynamic monitor and/or cardiac pacemaker or pacemaker/cardioverter/defibrillator. The lead has a sensor module formed in its distal end and is coupled to a monitor that powers a sensor circuit in the sensor module. The sensor module is formed with a pickoff capacitor that changes capacitance with pressure changes and a reference capacitor that is relatively insensitive to pressure changes. The sensor circuit provides charge current that changes with temperature variation at the implant site, alternately charges and discharges the two capacitors, and provides timing pulses having distinguishable parameters at the end of each charge cycle that are transmitted to the demodulator. The demodulator detects and synchronizes the timing pulses and derives pressure and temperature analog voltage values representative of the intervals between the timing pulses which are digitized and stored in the monitor. The monitor may also be coupled with other sensors for measuring and storing related patient body parameters, e.g. blood gas, EGM, and patient activity.

Claims

1. An implantable lead having a capacitive pressure sensor module for providing signals representative of the magnitude of body fluid pressure at a selected site and ambient operating conditions, including body temperature, at the site, said lead comprising:

an elongated implantable lead body having proximal and distal end sections and having first and second electrical conductors extending from the proximal end section to the distal end section, said proximal end adapted to be coupled to a biasing signal source, and said distal end section adapted to be implanted in a body position for measuring a varying body fluid pressure; and

a pressure sensor module formed in the distal end section of the lead body and coupled to said first and second electrical conductors, the pressure sensor module of said lead comprising;

a module housing attached to said lead body adapted to be positioned in a body cavity and enclosing a hermetically sealed chamber;

pressure deformable pickoff capacitor means for varying in capacitance in response to variations in fluid pressure having a first plate formed of a pressure deformable diaphragm of said module housing and a second plate spaced apart therefrom;

reference capacitor means having a first plate formed of a relatively non-deformable portion of said diaphragm of said module housing and a second plate spaced apart therefrom;

a substrate supported within said module housing for supporting said second plates; and

pressure and temperature signal modulating circuit means supported on said substrate within said hermetically sealed chamber and electrically coupled to said first and second electrical conductors.

2. The implantable lead of claim 1 wherein:

said first plate of said pickoff capacitor means is formed of a pressure deformable, substantially planar diaphragm having a first predetermined surface area formed by a plane of said module housing having an exterior substantially planar surface and a parallel interior substantially planar surface within said hermetically sealed chamber at least said interior planar surface comprising conductive material, said planar diaphragm adapted to be deformed in said first predetermined surface area by variations in fluid pressure outside the module housing; and

said first plate of said reference capacitor means is formed of a second predetermined substantially planar surface area of said interior surface spaced apart from and co-planar with said first predetermined surface area and located so as to be on a relatively non-deformable area of said substantially planar diaphragm by variations in fluid pressure outside the module housing.

3. The implantable lead of claim 2 further comprising:

disposition of said second plates of said pickoff and reference capacitor means on a first surface of said substrate opposite said first plate'"'"'s locations on said diaphragm so as to form capacitors thereby; and

means for spacing said second plates of said pickoff and reference capacitor means a fixed distance from said first plates of said pickoff and reference capacitor means.

4. The implantable lead of claim 3 wherein:

said second plates of said pickoff and reference capacitor means further comprise pickoff and reference capacitor platings of a first thickness formed on said first surface of said substrate conforming to said pickoff and reference capacitor plate patterns, respectively; and

said spacing means further comprises;

a plurality of standoffs of a second thickness greater than said first thickness formed on said first surface of said substrate; and

means for urging said standoffs against said interior surface for spacing said second plates of said pickoff and reference capacitor means from said first plates of said pickoff and reference capacitor means by a predetermined gap establishing the same capacitance for both the pickoff and reference capacitors in the absence of deformation of said diaphragm.

5. The implantable lead of claim 3 wherein said standoffs are formed of standoff platings of said second thickness formed on said first surface of said substrate in areas outside said pickoff and reference capacitor platings and electrically isolated therefrom.

6. The implantable lead of claim 4 wherein said pressure and temperature signal modulating circuit means is supported on a second surface of said substrate within said hermetically sealed chamber and electrically coupled to said first and second electrical conductors and to said pickoff and reference capacitor platings.

7. The implantable lead of claim 1 further comprising:

means for supporting said second plates of said pickoff and reference capacitor means on a first surface of said substrate; and

means for spacing said second plates of said pickoff and reference capacitor means a fixed distance from said first plates of said pickoff and reference capacitor means whereby a predetermined gap establishes the same capacitance for both the pickoff and reference capacitors in the absence of deformation of said diaphragm.

8. The implantable lead of claim 7 wherein said pressure and temperature signal modulating circuit means is supported on a second surface of said substrate within said hermetically sealed chamber and electrically coupled to said first and second electrical conductors and to said second plates.

9. The implantable lead of claim 1 wherein:

said module housing is formed of a conductive material having an exterior planar surface and an interior planar surface shaped to form said planar diaphragm having a fixed thickness and perimeter boundary in a planar section thereof to form said first deformable plate of said pickoff capacitor in a pickoff capacitor plate pattern, said interior planar surface extending beyond the boundary of said planar diaphragm to form said first plate of said reference capacitor in a reference capacitor plate pattern adjacent to said first deformable plate.

10. The implantable lead of claim 9 further comprising:

disposition of said second plate of said pickoff capacitor means on a first surface of said substrate, said second plate of said pickoff capacitor means shaped to correspond to said pickoff capacitor plate pattern opposite said first pick off plate'"'"'s location on said diaphragm;

disposition of said second plate of said reference capacitor means on a first surface of said substrate, said second plate of said reference capacitor shaped to correspond to said reference capacitor plate pattern opposite said first reference plate'"'"'s location on said diaphragm; and

means for spacing said second plates of said pickoff and reference capacitor means a fixed distance from said first plates of said pickoff and reference capacitor means.

11. The implantable lead of claim 10 wherein:

said second plates of said pickoff and reference capacitor means further comprise pickoff and reference capacitor platings of a first thickness formed on said first surface of said substrate conforming to said pickoff and reference capacitor plate patterns, respectively; and

said spacing means further comprises;

a plurality of standoffs of a second thickness greater than said first thickness formed on said first surface of said substrate; and

means for urging said standoffs against said interior surface for spacing said second plates of said pickoff and reference capacitor means from said first plates of said pickoff and reference capacitor means by a predetermined gap establishing the same capacitance for both the pickoff and reference capacitors.

12. The implantable lead of claim 11 wherein said standoffs are formed of standoff platings of said second thickness formed on said first surface of said substrate in areas outside said pickoff and reference capacitor platings and electrically isolated therefrom.

13. The implantable lead of claim 10 wherein said pressure and temperature signal modulating circuit means is supported on a second surface of said substrate within said hermetically sealed chamber and electrically coupled to said first and second electrical conductors and to said pickoff and reference capacitor platings.

14. The implantable lead of claim 1 wherein said module housing is fabricated of a conductive metal and further comprising:

insulative body compatible sheath means for electrically isolating said module housing from body fluids and tissue.

15. The implantable lead of claim 14 wherein said sheath means further comprises an insulative, uniform thickness coating of an adhering body compatible material overlying said diaphragm.

16. The implantable lead of claim 14 wherein said sheath means further comprises a tubular sheath fitting over said module housing and coupled to said insulative, uniform thickness coating of an adhering body compatible material overlying said diaphragm.

17. The implantable lead of claim 1 wherein said pressure and temperature signal modulating circuit means further comprises:

means for receiving an externally applied biasing signal on said first and second conductors and for generating charging and discharging currents therefrom which vary in magnitude with ambient temperature;

means for alternately charging and discharging said pickoff and reference capacitor means with said charging and discharging currents; and

timing pulse generating means for generating pickoff and reference timing pulses on one of said electrical conductors, the timing pulses separating the alternate charging time intervals of the pickoff and reference capacitor means.

18. The implantable lead of claim 17 wherein said timing pulse generating means further comprises:

means for establishing a charge threshold voltage;

means for detecting the charging of said reference capacitor means to said charge threshold voltage and for generating a pickoff timing pulse on said first electrical conductor in response thereto, said pickoff timing pulse having a first predetermined characteristic;

means for detecting the charging of said pickoff capacitor means to said charge threshold voltage and for generating a reference timing pulse in response thereto, said reference timing pulse having a second predetermined characteristic distinguishable from said first predetermined characteristic.

19. An implantable capacitive implantable lead for providing signals representative of the magnitude of body fluid pressure at a selected site and ambient operating conditions, including body temperature, at the site comprising:

an elongated implantable lead body having proximal and distal end sections and having first and second electrical conductors extending from the proximal end section to the distal end section, said proximal end adapted to be coupled to a biasing signal source, and said distal end section adapted to be implanted in a body position for measuring a varying body fluid pressure; and

a implantable module formed in the distal end section of the lead body and coupled to said first and second electrical conductors, the implantable module further comprising;

a module housing attached to said lead body adapted to be positioned in a body cavity and enclosing a hermetically sealed chamber;

pressure deformable pickoff capacitor means for varying in capacitance in response to variations in fluid pressure having a first plate formed of a pressure deformable diaphragm of said module housing and a second plate spaced apart therefrom;

reference capacitor means having a first plate formed of a non-deformable portion of said module housing and a second plate spaced apart therefrom; and

pressure and temperature signal modulating circuit means within said hermetically sealed chamber and electrically coupled to said first and second electrical conductors.

20. The implantable capacitive pressure sensor lead of claim 19 wherein said pressure and temperature signal modulating circuit means further comprises:

means for receiving an externally applied biasing signal on said first and second conductors and for generating charging and discharging currents therefrom which vary in magnitude with ambient temperature;

means for alternately charging and discharging said pickoff and reference capacitor means with said charging and discharging currents; and

timing pulse generating means for generating pickoff and reference timing pulses on one of said electrical conductors, the timing pulses separating the alternate charging time intervals of the pickoff and reference capacitor means.

21. The implantable capacitive pressure sensor lead of claim 20 wherein said timing pulse generating means further comprises:

means for establishing a charge threshold voltage;

means for detecting the charging of said reference capacitor means to said charge threshold voltage and for generating a pickoff timing pulse on said first electrical conductor in response thereto, said pickoff timing pulse having a first predetermined characteristic;

means for detecting the charging of said pickoff capacitor means to said charge threshold voltage and for generating a reference timing pulse in response thereto, said reference timing pulse having a second predetermined characteristic distinguishable from said first predetermined characteristic.

22. The pressure and temperature sensing lead of claim 21 wherein:

said first predetermined characteristic comprises a first pulse width, pulse amplitude and pulse leading edge slope; and

said second predetermined characteristic comprises a stepped pulse having leading and trailing steps, said leading step corresponding to said first pulse width, pulse amplitude an pulse leading edge slope, and said trailing step having a second pulse amplitude and pulse width.

23. A pressure sensor module having a housing enclosing a hermetically sealed chamber for implantation into a living body, said housing for attachment to an implantable device such that the housing is adapted to be positioned in a body so as to sense pressure therein and;

pressure deformable pickoff capacitor means for varying in capacitance in response to variations in pressure exterior to said chamber having a first pressure deformable, substantially flat, diaphragm element with an interior surface and an exterior surface, said diaphragm element disposed on said housing so as to have said exterior surface thereof exposed to said body and the interior surface thereof facing interior to said chamber, said interior surface disposed to substantially parallel alignment with a second plate member spaced apart from the interior surface of said diaphragm and within said chamber, and having a conductive pickoff capacitor member lining or formed of a portion of said interior surface of said diaphragm element and having a second capacitor conductive member lining or formed of a portion of said second plate member spaced from said first conductive member;

reference capacitor pressure sensing means having a first conductive capacitor member lining a relatively non-deformable portion of said diaphragm element of said interior surface and being electrically isolated from and non coincident with said pickoff capacitor first conductive member, and a second conductive capacitor member on said second plate spaced apart from said reference capacitor conductive member;

pressure and temperature signal modulating circuit electrically coupled to said first and second electrical conductors.

24. A pressure sensor module as set forth in claim 23 wherein said second conductive capacitor member of said capacitive and said pickoff capacitors are electrically coextensive.

25. The pressure sensor module of claim 23 wherein said pressure and temperature signal modulating circuit means further comprises:

means for receiving an externally applied biasing signal on said first and second conductors and for generating charging and discharging currents therefrom which vary in magnitude with ambient temperature;

means for alternately charging and discharging said pickoff and reference capacitor means with said charging and discharging currents; and

timing pulse generating means for generating pickoff and reference timing pulses on one of said electrical conductors, the timing pulses separating the alternate charging time intervals of the pickoff and reference capacitor means.

26. The pressure sensor module of claim 25 wherein said timing pulse generating means further comprises:

means for establishing a charge threshold voltage;

means for detecting the charging of said reference capacitor means to said charge threshold voltage and for generating a pickoff timing pulse on said first electrical conductor in response thereto, said pickoff timing pulse having a first predetermined characteristic;

means for detecting the charging of said pickoff capacitor means to said charge threshold voltage and for generating a reference timing pulse in response thereto, said reference timing pulse having a second predetermined characteristic distinguishable from said first predetermined characteristic.

27. The pressure and temperature sensing module of claim 26 wherein:

said first predetermined characteristic comprises a first pulse width, pulse amplitude and pulse leading edge slope; and

said second predetermined characteristic comprises a stepped pulse having leading and trailing steps, said leading step corresponding to said first pulse width, pulse amplitude an pulse leading edge slope, and said trailing step having a second pulse amplitude and pulse width.