Method and apparatus for assembling multichip modules

• US 5,564,617 A
• Filed: 06/07/1995
• Issued: 10/15/1996
• Est. Priority Date: 09/03/1992
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Tai, King L., Degani, Yinon, Dudderar, Thomas D.
• Primary Examiner(s): Bradley, P. Austin
• Assistant Examiner(s): Knapp, Jeffrey T.
• Application Number:
  US08/479,587
• Time in Patent Office: 496 Days
• Field of Search: 228/6.2, 228/33, 228/180.22, 228/254
• US Class Current: 228/6.2
• CPC Class Codes: H01L 21/4867 Applying pastes or inks, e.g. screen printing H01L21/486 takes precedence
• CPC Class Codes: H01L 2224/1132 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/742 Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81192 wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01051 Antimony [Sb]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2203/048 : Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
• CPC Class Codes: H05K 3/1216 : by screen printing or stencil printing
• CPC Class Codes: H05K 3/3431 : Leadless components
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3463 : Solder compositions in relation to features of the printed circuit board or the mounting process
• CPC Class Codes: H05K 3/3485 : Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12

Abstract

A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such a multichip module. The disclosed assembly process makes the heretofore difficult and expensive flip chip bonding technique achievable at low cost. The flip chip bonding technique is simplified by use of a solder paste which includes desirable reflow alignment, fluxing and printability characteristics. These desirable characteristics allow the assembly process to be further economically achieved by permitting the use of standard surface mount equipment in the process. High volume production of standard inexpensive modules are thus possible through this process while also achieving the advantage of high density interconnections afforded through the flip-chip bonding technology.

Claims

1. An apparatus for assembling a multichip module having an array of high density contact pads on a substrate and a matching array of contact pads on an unpackaged device, the apparatus comprising:

a solder paste, and wherein said solder paste includes

a) a solder,

b) a removing agent for metal oxides,

c) a low temperature component that substantially evaporates below or at said reflow temperature but does not substantially evaporate at room temperature,

d) a high temperature component that evaporates slowly at the reflow temperature,

e) a rheological modifier that allows said printing, and

f) a flux mixture consisting of diphenic acid, propyl-4-hydroxy benzoate, ethyl cellulose, castor oil, rosin gum and poly-propylene glycol;

means for printing the solder paste selectively onto the contact pads of the substrate for forming a solder paste pattern;

means for positioning in opposed alignment and in contact the contact pads on the device and the solder paste that forms the pattern; and

means for heating the solder paste at a reflow temperature for forming solder joints between the contact pads on the substrate and the contact pads on the device.

2. The apparatus as in claim 1 wherein said removing agent comprises diphenic acid.

3. The apparatus as in claim 1 wherein said low temperature component comprises propyl-4-hydroxybenzoate.

4. The apparatus as in claim 1 wherein said high temperature component comprises poly-propylene glycol of average molecular weight ≧

425 grams/mole.

5. The apparatus as in claim 1 wherein said rheological modifier component comprises ethyl cellulose.

6. The apparatus as in claim 1 wherein said solder comprises a tin/antimony alloy.

7. The apparatus as in claim 1 wherein the flux mixture is combined of approximately 6 weight % of diphenic acid, 24 weight % of propyl-4-hydroxy benzoate, 5 weight % of ethyl cellulose, 2 weight % of castor oil, 10 weight % of rosin gum and 53 weight % of poly-propylene glycol.

8. The apparatus as in claim 7 wherein said solder paste includes a solder powder consisting of tin and antimony.

9. The apparatus as in claim 8 wherein the solder powder is combined in proportions of 95% tin and 5% antimony.

10. The apparatus as in claim 9 wherein the solder powder has a powder size of -500 mesh.

11. The apparatus as in claim 9 wherein the flux mixture and solder powder are combined of 12.5 weight % of flux mixture and 87.5 weight % of solder powder.

12. An apparatus for assembling a multichip module having an array of high density contact pads on a silicon substrate and a matching array of contact pads on an unpackaged integrated circuit chip, the apparatus comprising:

means for printing with automated surface mount equipment a solder paste selectively onto the contact pads of the substrate to form a solder paste pattern, the solder paste comprising a solder, a removing agent for metal oxides, a low temperature component that substantially evaporates below or at said reflow temperature but does not substantially evaporate at room temperature, a high temperature component that evaporates slowly at the reflow temperature, and a rheological modifier that allows said printing;

means for positioning said unpackaged integrated circuit chip with said automated surface mount equipment, by said positioning means, the contact pads on the unpackaged integrated circuit chip being positioned in opposed alignment and in contact with the solder paste that forms the solder paste pattern; and

means for heating with said surface mount equipment the solder paste at a reflow temperature to form solder joints between the contact pads on the substrate and the contact pads on the unpackaged integrated circuit chip.

13. The apparatus as in claim 12 wherein said solder paste includes a flux mixture consisting of diphenic acid, propyl-4-hydroxy benzoate, ethyl cellulose, castor oil, rosin gum and poly-propylene glycol.

14. The apparatus as in claim 12 wherein the printing means employs a patterned stencil having openings for printing the patterned solder paste onto the contact pads of the substrate.

15. The apparatus as in claim 14 wherein the openings in the stencil are between 5 and 15 mils in diameter.

16. The apparatus as in claim 15 wherein the stencil comprises between a 1 to 7 mil thickness sheet for printing on an area array of 4 to 15 mil contact pads.

17. The apparatus as in claim 16 wherein the solder paste is printed onto the contact pads of the substrate in a layer having a thickness of between 1 and 8 mils.

18. The apparatus as in claim 17 wherein the array of high density contact pads on the substrate and the matching array of contact pads on the device are configured as area arrays.

19. The apparatus as in claim 18 further including the step of rerouting the contact pads on the integrated circuit chip from a perimeter array to an area array when the array of contact pads on said integrated circuit is configured in a perimeter array.