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Integrated sputtering target assembly

  • US 5,565,071 A
  • Filed: 05/24/1995
  • Issued: 10/15/1996
  • Est. Priority Date: 11/24/1993
  • Status: Expired due to Term
First Claim
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1. A sputtering assembly comprising:

  • a sputtering target in intimate contact with a first side of a target backing plate assembly;

    said target backing plate assembly having a first side configured to cover an opening of a sputtering chamber so as to seal the opening;

    a top chamber having a bottom opening sealed against a second side of said target backing plate assembly opposite from said first side such that said target backing plate assembly acts as a wall between said sputtering chamber and said top chamber;

    wherein said target backing plate assembly is disposed between said bottom opening of said top chamber and said opening of said sputtering chamber so that a pressure load on said target plate assembly due to differential pressure between the chambers is reduced as the pressure in said top chamber and the pressure in said sputtering chamber approach one another,a top chamber pressure control system to control the pressure in said top chamber to be different from the pressure in said sputtering chamber,wherein a portion of said target backing plate assembly and sputtering target are configured to bow as the differential pressure between the top chamber and the sputtering chamber changes,wherein the pressure in at least one of the two chambers is adjustable to control the bow in a portion of the target assembly and a portion of the sputtering target to change the distance between said portion of said sputtering target and a portion of said object being sputter deposited so as to improve the uniformity of film thickness sputter deposited on the object being sputter deposited.

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