Stamped and formed heat sink
First Claim
Patent Images
1. A heat sink for use with a fan to cool an electronic device comprising:
- a thermally conductive sheet body forming a base having a face for attachment to said electronic device;
heat dissipation elements bent from said sheet body and extending from opposed edges of said base perpendicular to said base;
openings stamped in said heat dissipation elements for the flow of air into said body;
said heat dissipating elements being spaced for an interference fit with said fan, said fan being snapped into said heat dissipating elements; and
detents formed by slots in said heat dissipating elements, said detents snapping over said fan when said fan is inserted into said heat sink apparatus.
4 Assignments
0 Petitions
Accused Products
Abstract
A stamped and formed heat sink has a thermally conductive body including a base having a face adapted for attachment to an electronic device package. Stamped and formed heat dissipation elements extend from the edges of the base perpendicular to the base. The heat sink is formed in a progressive punch and die press so that a heat sink is produced on every stroke.
-
Citations
10 Claims
-
1. A heat sink for use with a fan to cool an electronic device comprising:
-
a thermally conductive sheet body forming a base having a face for attachment to said electronic device; heat dissipation elements bent from said sheet body and extending from opposed edges of said base perpendicular to said base; openings stamped in said heat dissipation elements for the flow of air into said body; said heat dissipating elements being spaced for an interference fit with said fan, said fan being snapped into said heat dissipating elements; and detents formed by slots in said heat dissipating elements, said detents snapping over said fan when said fan is inserted into said heat sink apparatus. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
Specification