Medical circuit forming process

• US 5,567,328 A
• Filed: 06/08/1995
• Issued: 10/22/1996
• Est. Priority Date: 06/08/1995
• Status: Expired due to Term

• Current Assignee: The Whitaker Corporation (Meggitt PLC)
• Original Assignee: The Whitaker Corporation (Meggitt PLC)
• Inventors: Lynch, Thomas J., Banks, Roger T., Engle, Paul F.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/482,244
• Time in Patent Office: 502 Days
• Field of Search: 216/13, 216/20, 216/33, 216/41, 216/36, 29/846, 427/96, 128/642
• US Class Current: 216/13
• CPC Class Codes: A61B 1/273 for the upper alimentary canal, e.g. oesophagoscopes, gastroscopes
• CPC Class Codes: A61B 8/12 in body cavities or body tracts, e.g. by using catheters catheters per se A61M25/00
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/0079 characterised by the method of application or removal of the mask H05K3/0091 takes precedence
• CPC Class Codes: H05K 3/062 consisting of metals or alloys or metallic inorganic compounds H05K3/065 takes precedence
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/125 by ink-jet printing
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer

Abstract

A process to manufacture disposable medical flat flexible printed circuits 10. The process entails depositing conductive metal in the range of 1000 to 2500 Angstroms thick onto a flexible film having a thickness in the range of 0.1 to 10 mils. The first portions of the conductive metal are covered with a resist material arranged in a pattern. Metal circuit material is deposited onto second portions of the conductive metal. Overplating the metal circuit material with a corrosion resistant metal. Lastly, removing the resist material and the first portions of the metal and laminating the circuit.

Claims

1. A process to manufacture disposable medical flat flexible printed circuits 10 comprising

depositing conductive metal in the range of 1000 to 2500 Angstroms thick onto a flexible film having a thickness in the range of 0.1 to 10 mils.,

covering first portions of the metal with a resist material arranged in a pattern,

depositing metal circuit material onto second portions of the metal,

overplating the metal circuit material with a corrosion resistant metal,

removing the resist material and the first portions of the metal and

laminating the circuit with a polymeric material.

2. A method as recited in claim 1, wherein the resist material pattern has at least two depths, at the edges of the second portions of the metal the resist material is equal or greater than the desired depth of the metal circuit material and the remaining first portions of the metal is coated sufficiently with the resist material to prevent electrochemical growth of the metal circuit material.

3. A method as recited in claim 1, and further comprising:

removing the resist material with a solvent.

4. A method as recited in claim 1, and further comprising:

removing the first portions of the metal with a metal enchant.

5. A method as recited in claim 1, wherein the resist material is a foamed material.

6. A method as recited in claim 1, wherein the first few 100 Å

of conductive metal is sputtered and the remaining conductive metal is evaporated onto the flexible film.

7. A method as recited in claim 1, wherein the conductive material is selected from a group consisting essentially of Nickel and oxides thereof, the circuit material is selected from a group consisting essentially of Nickel and oxides thereof, and the corrosion resistant metal is a Gold layer.

8. A method as recited in claim 7, wherein the Nickel layer is about 100 microns and the Gold layer is 30 microns.

9. In a method to manufacture disposable medical flat flexible printed circuits 10 by ink jet printing, wherein a pattern of ink is applied by an ink jet, the improvement comprising:

applying a pattern of an ink resistant to basic chemical baths by ink jet onto a composite sheet constructed of a first metal covering a polyester,

depositing metal circuit material onto the metal without depositing the metal onto the ink,

overplating the metal circuit material with a corrosion resistant metal,

removing the ink and the first metal to provide a circuit on the sheet, and

laminating a second layer of polyester to protect the circuit;

wherein the ink resistant has at least two depths, at the edges of the pattern the ink resistant is equal or greater than the desired depth of the metal circuit material and the remaining pattern is coated sufficiently with ink resistant to prevent electrochemical growth of the metal circuit material.

10. A method as recited in claim 9, wherein the conductive material is selected from a group consisting essentially of Nickel and oxides thereof, the circuit material is selected from a group consisting essentially of Nickel and oxides thereof, and the corrosion resistant metal is a Gold layer.

11. A method as recited in claim 10, wherein the Nickel layer is about 100 microns and the Gold layer is 30 microns.

12. A method as recited in claim 9, wherein the resist material is a foamed material.

13. A method to manufacture disposable medical flat flexible printed circuits 10 comprising the steps of:

Sputtering 100 to 300 Angstroms and evaporating 2700 Angstroms thick conductive layer onto polyester film having a range of thickness from 0.001 inch (0.0025 cm.) to 0.10 inch;

Applying circuit masks,

Plating a Nickel onto circuit patterns circumscribed by the masks to produce a circuit having a desired thickness;

Plating a Gold layer to the desired thickness onto the Nickel;

Removing the masks to expose the Copper film; and

Removing the Copper film exposed by removal of the masks with the Nickel circuit being protected by the Gold;

Cleaning and drying the circuit and the polyester film, and laminating a second layer of polyester on the circuit to protect the circuit.

14. A method as recited in claim 13, wherein the circuit mask has at least two depths, at the edges of the circuit pattern the mask is equal or greater than the desired depth of the metal circuit material and the remaining masked area is coated sufficiently to prevent electrochemical growth of the metal circuit material.

15. A method as recited in claim 13, wherein the circuit masks is a foamed material.

16. A method as recited in claim 13, wherein the conductive material is selected from a group consisting essentially of Nickel and oxides thereof, the circuit material is selected from a group consisting essentially of Nickel and oxides thereof, and the corrosion resistant metal is a Gold layer.

17. A method as recited in claim 13, wherein the conductive material is selected from a group consisting essentially of Copper and oxides thereof, the circuit material is selected from a group consisting essentially of Nickel and oxides thereof, and the corrosion resistant metal is a Gold layer.

18. In a method to manufacture disposable medical flat flexible printed circuits 10, wherein a pattern of ink is applied by a seamless rotary screen, the improvement comprising:

pre-conditioning the polyester by exposing it to a temperature that is equal to or greater the maximum temperature the film or circuit will experience in later processing or in final service life;

applying a pattern of an ink resistant to basic chemical baths by a seamless rotary screen onto a composite sheet constructed of a first metal covering a flexible film,

depositing metal circuit material onto the metal without depositing the metal onto the ink, and

removing the ink and the first metal to provide a circuit on the sheet.

19. In a method as recited in claim 18, wherein the ink resistant has at least two depths, at the edges of the pattern the ink resistant is equal or greater than the desired depth of the metal circuit material and the remaining pattern is coated sufficiently with ink resistant to prevent electrochemical growth of the metal circuit material.

20. In a method as recited in claim 18, the improvement comprising the step of:

laminating a second layer of polyester to protect the circuit.

21. In a method as recited in claim 18, the improvement comprising the step of:

laminating a second layer of polyester to protect the circuit, and providing holes in the second film to permit access to the circuit.

22. A method as recited in claim 18, wherein the resist material is a foamed material.