×

Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging

  • US 5,567,654 A
  • Filed: 09/28/1994
  • Issued: 10/22/1996
  • Est. Priority Date: 09/28/1994
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method for establishing a thin-film layer on a semiconductor structure having a planar surface, said thin-film layer comprising a metallization layer, said semiconductor structure comprising a plurality of stacked integrated circuit (IC) chips having a plurality of edge surfaces that at least partially define said planar surface of said semiconductor structure, said method comprising the steps of:

  • (a) forming the metallization layer in association with a temporary support separate from the semiconductor structure;

    (b) electrically coupling the metallization layer to the planar surface of the semiconductor structure such that said metallization layer physically bonds to said planar surface and said temporary support is coupled to said semiconductor structure, wherein said metallization layer electrically connects to said semiconductor structure; and

    (c) decoupling the temporary support from said semiconductor structure, said metallization layer remaining electrically coupled and physically bonded to said planar surface of the semiconductor structure.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×