Surface mount crystal package with receptacle mounting

• US 5,568,006 A
• Filed: 04/28/1995
• Issued: 10/22/1996
• Est. Priority Date: 04/28/1995
• Status: Expired due to Fees

• Current Assignee: CTS Corporation
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Skoda, William, Kiscellus, William, Luff, Marlin
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US08/431,169
• Time in Patent Office: 543 Days
• Field of Search: 310/340, 310/344, 310/348, 310/354
• US Class Current: 310/348
• CPC Class Codes: H03H 9/1021 the BAW device being of the cantilever type
• CPC Class Codes: H05K 1/181 associated with surface mounted components

Abstract

A surface mount crystal package (10) receptacle mounting adapted to canti-leverably receive a piezoelectric element. The surface mount crystal package (10) is configured to hermetically enclose a crystal resonator (19) or crystal filter mounted in a proximal base (12) in a cantilever fashion. This package (10) is hermetically sealed in the proximal base 12, a distal cap (14) and sleeve (16). The package (10) is adapted to improve and faciliate surface mounting, provide a low cost and automatable assembly, and provide a low-stress mounting of a piezoelectric element in a simplified and portable design.

Claims

1. A surface mountable crystal package, comprising:

a proximal base including an inner, middle and outer section having connecting metalization for providing an electrical path;

the inner section comprises a dielectric material and has a substantially oblong receptacle defined by two aperture sections connected with a channel being substantially complementarily configured to receive at least a proximal portion of a crystal resonator;

a distal cap having an inner face, an outer face and a distal conductive portion;

a sleeve having a distal portion and a proximal portion, the distal portion being connected to the distal cap and the proximal portion being connected to the proximal base; and

the inner section of the proximal base being configured to at least partially be received in the sleeve.

2. The surface mountable crystal package of claim 1, wherein:

the middle section comprises a dielectric material including inner and outer surfaces;

the inner surface including at least one via and having selective metalization substantially adjacent to an outer periphery; and

the metalization adjacent to the outer periphery is configured to abut and be connected to the sleeve.

3. The surface mountable crystal package of claim 2, wherein the middle section includes at least one centrally located conductive contact pad being connected to the selective metalization.

4. The surface mountable crystal package of claim 3, wherein:

the outer section comprises a dielectric material including an interior face and at least one outer edge adapted for surface mountability; and

the interior face being selectively metalized to provide at least one metalized pad connecting to at least one of a plurality of metalized connections on the outer edge.

5. The surface mountable crystal package of claim 1, wherein the outer section comprises a conductive material.

6. The surface mountable crystal package of claim 5, wherein the outer section comprises a metal.

7. The surface mountable crystal package of claim 4, wherein the outer edge of the outer section has a plurality of castellations, the metalized connections on the outer edge being located substantially within the plurality of castellations.

8. The surface mountable crystal package of claim 3, wherein the at least one aperture of the inner section is aligned with the at least one contact pad of the middle section.

9. The surface mountable crystal package of claim 4, wherein the at least one aperture of the inner section is aligned with the at least one via of the middle section and the at least one metalized pad of the outer section.

10. The surface mountable crystal package of claim 1, wherein the inner, middle and outer sections are integrally connected, whereby a hermetic environment is providable.

11. A surface mountable crystal package having at least two terminals, comprising:

a proximal base including an inner, middle and outer section having connecting metalization for providing at least one electrical path;

the inner section comprises a dielectric material and has a substantially oblong receptacle adapted to receive a crystal resonator, the inner section being configured to at least partially be received in the sleeve;

a crystal resonator having first and second sides;

the receptacle being substantially complementarily configured to receive at least a proximal portion of the crystal resonator;

a distal cap having an inner face, an outer face, and a distal conductive portion;

a sleeve having a distal portion and a proximal portion, the proximal portion being adhesively attached to the proximal base, and the distal portion being adhesively attached to the inner face of the distal cap; and

the outer section includes an outer edge, the outer edge having a plurality of metalized castellations, at least one of the castellations being electrically coupled through connecting metalization of the proximal base of the first side of the crystal resonator.

12. The surface mountable crystal package of claim 11, wherein the sleeve has at least one electrically conductive path substantially along its length, the second side of the crystal resonator being electrically connected to the distal conductive portion through the conductive path.

13. A surface mountable crystal package, comprising:

a proximal base comprising a dielectric material and having inner, middle and outer sections being integrally connected;

the inner section having a receptacle including at least two outer apertures connected by a channel, the receptacle being substantially complementary configured to receive at least a portion of a crystal resonator, and the inner section being partially received in a sleeve;

the middle section having inner and outer surfaces, the inner surface including at least one via and having selective metalization substantially adjacent to an outer periphery, whereby the metalization adjacent to the outer periphery is configured to abut the sleeve;

the outer section having an interior face and an outer edge adapted for surface mountability, the interior face is selectively metalized providing at least one metalized pad connected to at least one metalized castellation on the outer edge;

at least one aperture of the inner section is substantially aligned with at least one via of the middle section and at least one metalized pad of the outer section;

a distal cap having an inner face, an outer face, and a distal conductive portion adapted for surface mountability;

the sleeve having a distal portion and a proximal portion, the proximal portion being adhesively attached to the inwardly facing portion of the proximal base, and the distal portion being adhesively attached to the inner face of the distal cap; and

a crystal resonator substantially cantileverably coupled and at least partially received in the receptacle.

14. The surface mountable crystal package of claim 13, wherein at least one contact pad being connected to the selective metalization of the middle section, and having at least one aperture of the inner section being aligned with at least one contact pad, the sleeve having at least one electrically conductive path substantially along its length.

15. The surface mountable crystal package of claim 13, wherein the crystal resonator is enclosed in a hermetic environment.

16. The surface mountable crystal package of claim 13, wherein the crystal resonator is a filter with three electrical connections, at least two connections are provided by at least two castillations on the outer edge of the proximal base.