Image sensor having a multi-layered printed circuit board with increased parallel-plate capacitance and method for manufacturing the same

• US 5,569,390 A
• Filed: 06/01/1995
• Issued: 10/29/1996
• Est. Priority Date: 06/16/1994
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Endo, Takafumi
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/457,319
• Time in Patent Office: 516 Days
• Field of Search: 216/13, 216/17, 216/18, 216/20, 216/33, 216/41, 358/471, 437/7, 437/180, 437/205, 437/209, 361/380, 361/395, 361/397, 361/398
• US Class Current: 250/208.1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A multi-layered printed circuit board forms a base of a sensor board. Sensor chips are mounted on the multi-layered printed circuit board. The multi-layered printed circuit board is composed of a substrate, a first conductor layer, an internal insulator layer, a second conductor layer, and a surface insulator layer. An analog ground line is formed of the electrolytic copper foil of the first conductor layer by chemical etching. A signal line is formed of the electrolytic copper foil of the second conductor layer by chemical etching. Insulator layers are formed between the first conductor layer and the second conductor layer to generate a distributed capacitance between the signal line and the analog ground line for filtering out noise and improving performance.

Claims

1. An image sensor comprising:

a plurality of sensor chips for sensing an image and outputting a signal to form a part of a parallel signal, wherein each of the sensor chips has a plurality of photoelectric conversion devices, an internal signal line coupled to the plurality of photoelectric conversion devices, an internal ground line coupled to the plurality of photoelectric conversion devices and a plurality of switches for coupling the signal line and the ground line;

a printed circuit board for mounting the plurality of sensor chips thereon and for forming a signal circuit wherein the signal circuit receives the parallel signal from the plurality of sensor chips, converts the parallel signal to a serial signal, and outputs the serial signal;

wherein the printed circuit board has a substrate as a base, a first conductor layer placed on one side of the substrate, having an external ground line coupled to the internal signal line, a second conductor layer having an external signal line coupled to the internal signal line, and an insulator layer between the first and the second conductor layers for creating a capacitance between the external signal line and the external ground line.

2. The image sensor of claim 1, wherein the second conductor layer includes a power line for supplying power.

3. The image sensor of claim 1, further comprising other circuit parts, wherein the other circuit parts are mounted on the printed circuit board in an area spaced apart from the power line and the ground line.

4. The image sensor of claim 1, wherein the insulator layer has first and second insulator layers formed of different compositions of materials.

5. The image sensor of claim 4, wherein the first insulator layer includes a resin which has a high permittivity.

6. A multi-layered printed circuit board comprising:

a substrate;

a first conductor layer placed on one side of the substrate for providing a ground;

a second conductor layer for providing a signal line;

an insulator layer located between the first and the second conductor layers for creating a capacitance between the signal line and the ground;

a surface insulator layer; and

a circuit mounted on the surface insulator layer having a plurality of chips electrically coupled to the signal line and the ground.

7. The multi-layered printed circuit board of claim 6, wherein the second conductor layer includes a power line for supplying power.

8. The multi-layered printed circuit board of claim 7, wherein the insulator layer includes a plurality of sub-insulator layers.

9. The multi-layered printed circuit board of claim 8, wherein each of the plurality of sub-insulator layers is formed of a different composition of material.

10. The multi-layered printed circuit board of claim 9, wherein the circuit is connected to the signal line on the second conductor layer with a wire, and wherein one of the sub-insulator layers adjacent to the second conductor layer includes a substance which improves a characteristic of a wire bounding with the signal line.

11. The multi-layered printed circuit board of claim 10, wherein the substance comprises an acrylic resin.

12. The multi-layered printed circuit board of claim 6, wherein the insulator layer includes a high permittivity substance.

13. The multi-layered printed circuit board of claim 12, wherein the high permittivity substance includes barium titanate.

14. The multi-layered printed circuit board of claim 7, wherein the signal line and the power line face to the ground across the insulator layer, and

wherein the facing area between the power line and the ground is larger than the facing area between the signal line and the ground.

15. The multi-layered printed circuit board of claim 7, wherein the power line has a constant width.

16. The multi-layered printed circuit board of claim 6, wherein the circuit includes a photosensor, and wherein the multi-layered printed circuit board functions as an image sensor.

17. The multi-layered printed circuit board of claim 6, wherein the second conductor layer includes a ground line coupled to the ground.

18. A method for manufacturing a board, comprising the steps of:

forming a first conductor layer;

forming a ground on the first conductor layer by chemical etching;

forming an internal insulator layer next to the first conductor layer;

forming a second conductor layer next to the insulator layer;

forming a signal line on the second conduct layer by chemical etching;

forming a surface insulator layer next to the second conductor layer;

mounting chips on the surface insulator layer; and

electrically coupling the chips to the signal line and ground.

19. The method of claim 18, wherein the internal insulator layer forming step includes the steps of forming a first insulator layer, and forming a second insulator layer having a material composition different from that of the first insulator layer.

20. The method of claim 19, wherein the first insulator layer forming step includes the step of mixing a high permittivity substance and a resin.

21. The method of claim 19, wherein the second insulator layer is formed of an acrylic resin.

22. The method of claim 18, wherein the second conductor layer forming step includes the step of forming a power line on the second conduct layer.