Polymeric adhesion promoter and latexes; and polymeric adhesion promoter, epoxy resins and latexes are used to improve adherence between various substrates

• US 5,569,686 A
• Filed: 03/19/1990
• Issued: 10/29/1996
• Est. Priority Date: 05/15/1987
• Status: Expired due to Fees

• Current Assignee: The Dow Chemical Company (Dow, Inc.)
• Original Assignee: The Dow Chemical Company (Dow, Inc.)
• Inventors: Kan, Charles S., Makati, Ashok C., Iwamasa, Robert T., Lee, Do I.
• Primary Examiner(s): Mulcahy, Peter D.
• Application Number:
  US07/495,504
• Time in Patent Office: 2,416 Days
• Field of Search: 156/330, 523/409, 523/411, 523/412, 524/217, 524/523, 524/525
• US Class Current: 523/409
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 79/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
• CPC Class Codes: C09J 113/02 Latex
• CPC Class Codes: C09J 133/08 Homopolymers or copolymers of acrylic acid esters
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Abstract

The adhesive of the present invention includes latexes with an adhesion promoter which is preferably polyamidoamine. The addition of the polyamidoamine improves the adhesive strength between substrates such as between two plastic films or between a plastic film and paperboard. The present invention also provides for an adhesive prepared from a latex which is neutralized with a particular base and a hydrophobic polyamidoamine having particular amine values and viscosity whereby the strength of the adhesive bond is increased in humid conditions. The present invention also provides for adhesives primarily for use in laminate structures which are exposed to highly humid conditions. The adhesive is a polymeric latex based system to which a polymeric adhesion promoter like polyamidoamine and an epoxy emulsion are added. The adhesive retains bond strength when exposed to humidity. The scope of the invention also includes laminate structures prepared with the present adhesive and other substrate layered structures which utilize the adhesive.

Claims

1. An adhesive formulation for substrates which provides a bond between a substrate and a same or different substrate which consists essentially of:

(i) a polymeric carboxylated styrene/butadiene latex;

(ii) at least one polymeric adhesion promoter present in an amount sufficient to promote adherence of the surface of a first substrate to the surface of the same or different substrate, and (iii) an epoxy emulsion in an amount sufficient to improve adherence of the surface of the first substrate to the surface of the same or different substrate under humid conditions;

whereby the adhesive formulation comprising (i), (ii) and (iii) provides an increase in percent retention between dry strength and wet strength of the bond over an adhesive formulation which does not comprise (i), (ii) and (iii).

2. The adhesive of claim 1 wherein the polymeric adhesion promoter is present in an amount of at least about 1 weight percent and no more than about 15 weight percent based upon the weight of the total polymeric latex adhesive.

3. The adhesive of claim 1 wherein the epoxy resin emulsion is present in an amount of from about 2 to about 25 weight percent based on the total weight of the polymeric latex.

4. The adhesive of claim 1 wherein the epoxy resin emulsion is present in an amount of from about 4 to about 15 weight percent based on the total weight of the polymeric latex.

8. The adhesive of claim 1 wherein the polymeric adhesion promoter is selected from the group consisting of:

polyamidoamine;

polyamines;

polydiallylamine;

polyurea;

polyurethane;

hydrolyzed polyoxazoline;

polymers from condensation reactions of epichlorohydrin and polyamines;

copolymers of acrylamide;

or poly(N-vinylpyrrolidone).

9. The adhesive of claim 1 wherein the polymeric adhesion promoter is selected from the group consisting of:

polyamidoamine or polyamines.

10. The adhesive of claim 1 wherein the epoxy resin is selected from the group consisting of the polyglycidyl ethers of bisphenol compounds;

the polyglycidyl ethers of a novolac emulsion; and

the polyglycidyl ethers of a polyglycol.

5. An adhesive formulation for substrates which provides a bond between a substrate and a same or different substrate which consists essentially of:

(i) a polymeric carboxylated styrene/butadiene latex;

(ii) at least one polymeric adhesion promoter present in an amount sufficient to promote adherence of the surface of a first substrate to the surface of the same or different substrate and (iii) an epoxy emulsion in an amount sufficient to improve adherence of the surface of the first substrate to the surface of the same or different substrate under humid conditions, whereby the adhesive formulation comprising (i), (ii) and (iii) provides an increase in percent retention between dry strength and wet strength of the bond over an adhesive formulation which does not comprise (i), (ii) and (iii) and a surfactant whereby coagulation of the adhesive in water containing ions is inhibited.

6. The adhesive of claim 5 wherein the surfactant is present in an amount of from about 0.5 to about 5.0 weight percent of latex solids.

7. The adhesive of claim 6 wherein the surfactant is selected from the group consisting of a mixture of hexadecyl(sulfophenoxy) benzenesulfonic acid, disodium salt and oxybis (hexadecylbenzenesulfonic acid), disodium salt, a potassium salt of oligomers made from several functional monomers and containing a nonfunctional hydrocarbon end group;

and a nonylphenoxypoly (ethyleneoxy) ethanol.