Capacitive accelerometer sensor and method for its manufacture

• US 5,569,852 A
• Filed: 12/14/1994
• Issued: 10/29/1996
• Est. Priority Date: 01/05/1994
• Status: Expired due to Term

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Offenberg, Michael, Muenzel, Horst, Marek, Jiri, Bantien, Frank
• Primary Examiner(s): Williams, Hezron E.
• Assistant Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US08/355,760
• Time in Patent Office: 685 Days
• Field of Search: 73/514.32, 73/514.16, 73/514.17, 73/514.18, 361/280, 361/281, 361/290
• US Class Current: 73/514.32
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

A contacting of a capacitive accelerometer sensor of monocrystalline material is achieved by a capacitive accelerometer sensor having a structure etched out of a monocrystalline layer arranged on a substrate, including a seismic mass that is only joined to the substrate by suspension segments and executing a movement in its longitudinal direction in response to the occurrence of an acceleration of parallel, plate-like first fingers extending out from this mass at right angles to their longitudinal direction and of plate-like second fingers running parallel to the first fingers and anchored to the substrate. The first and second fingers form a capacitor arrangement. The suspension segments, which are anchored with their end region that is distant from the seismic mass to the substrate, and second fingers are electrically isolated, by an isolation strip, from the other remaining layer of monocrystalline material. A passivation layer extends over the isolation strip, and at least partially over the remaining layer. Conductors arranged on the passivation layer and serving as connecting leads for the capacitor arrangement extend across the isolation strip up to the connections of the capacitor arrangement, and are contacted there.

Claims

1. A capacitive accelerometer sensor having a structure etched out of a conductive monocrystalline layer arranged on a substrate, comprising:

a seismic mass movable in a longitudinal direction in a plane of the seismic mass in response to an occurrence of an acceleration;

suspension segments coupling the seismic mass to the substrate, the suspension segments being coupled at first ends to the seismic mass and at second ends to the substrate, the suspension segments being coupled such that the seismic mass is movable in the longitudinal direction;

parallel, plate-like first fingers extending from the seismic mass at substantially right angles to the longitudinal direction;

plate-like second fingers, running parallel and opposed to the first fingers, and being coupled at first ends to the substrate;

an isolation strip electrically isolating the second fingers and the suspension segments from a surrounding layer of the conductive monocrystalline layer;

a passivation layer extending over the isolation strip and at least partially over the surrounding layer; and

conductors arranged on the passivation layer and running across the isolation strip, the conductors being coupled to the second fingers and the suspension segments.

2. The sensor according to claim 1, wherein the isolation strip is formed from a p-diffusion in a layer including n-type silicon.

3. The sensor according to claim 1, wherein the isolation strip is formed by an at least partially filled trench, the trench being at least one of isotropically and anisotropically etched.

4. The sensor according to claim 3, wherein the trench is provided with an insulating layer prior to filling.

5. The sensor according to claim 4, wherein the filling is composed of polycrystalline material.

6. The sensor according to claim 5, wherein the polycrystalline material is polysilicon.

7. The sensor according to claim 1, further comprising:

at least one cross bar, for coupling the first ends of the second fingers, the at least one cross bar being formed as a first connection for the capacitor arrangement.

8. The sensor according to claim 1, wherein the substrate is etched away on a rear side in a middle region, such that a remaining frame area of the substrate is provided for retaining the second ends of the suspension segments and the first ends of the second fingers.

9. The sensor according to claim 1, wherein the substrate is composed of p-type silicon, and the surrounding layer and the sensor structure are composed of n-type silicon.