Integrated circuit micromodule obtained by the continuous assembly of patterned strips

• US 5,569,879 A
• Filed: 03/30/1995
• Issued: 10/29/1996
• Est. Priority Date: 02/19/1991
• Status: Expired due to Term

• Current Assignee: Gemplus International SA (Thales SA)
• Original Assignee: Gemplus International SA (Thales SA)
• Inventors: Turin, Joel, Fallah, Michel, Laroche, Damien, Gloton, Jean-Pierre
• Primary Examiner(s): Kincaid, Kristine L.
• Assistant Examiner(s): DECKER, ROBERT
• Application Number:
  US08/413,379
• Time in Patent Office: 579 Days
• Field of Search: 174/52.1, 174/52.2, 174/52.3, 174/52.4, 257/678, 257/787, 257/788, 257/687, 257/700, 257/702, 257/729, 361/728, 29/841
• US Class Current: 361/782
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/14 Velocity, e.g. feed speeds
• CPC Class Codes: B32B 2309/72 For measuring or regulating, e.g. systems with feedback loops
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2429/00 Carriers for sound or information
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 38/1841 during laying up
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 : the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48245 : the item being metallic
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01044 : Ruthenium [Ru]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/01094 : Plutonium [Pu]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: Y10T 156/1712 : Indefinite or running length work
• CPC Class Codes: Y10T 156/1737 : Discontinuous, spaced area, and/or patterned pressing

Abstract

A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric strip and connected to the metal strip through the perforations in the dielectric strip. An insulating resin layer encapsulates the chip and is bonded to the dielectric strip. The micromodule may be used, for example, in a smart card, as a radiating antenna, or as an identification label.

Claims

1. A micromodule comprising a slotted metal strip bonded to a perforated dielectric strip having a thickness of less than 70 micrometers, and a chip bonded to one of the dielectric strip and the metal strip and connected to the metal strip through the perforations of the dielectric strip.

2. Micromodule according to claim 1, wherein the dielectric strip constitutes the dielectric of an electromagnetic antenna and the metal strip of which constitutes an active part of the antenna.

3. Micromodule according to claim 1, wherein the metal strip constitutes an inductor and the chip is connected to the ends of the inductor.

4. Micromodule according to claim 1, wherein the dielectric strip is made of a plastic material having an expansion coefficient of 20×

10^-6 /°

C.

5. Micromodule according to claim 1, wherein the dielectric strip is made of cardboard.

6. Micromodule according to claim 3, wherein said micromodule constitutes an identification label.

19. Micromodule according to claim 1, wherein said chip is bonded to said dielectric strip.

20. Micromodule according to claim 1, wherein said dielectric strip has a thickness of between 30 micrometers and 50 micrometers.

7. A micromodule comprising:

(A) a perforated dielectric strip having a thickness of less than 70 micrometers;

(B) a slotted metal strip bonded to said dielectric strip; and

(C) a chip bonded to one of said dielectric strip and said metal strip and connected to said metal strip through the perforations of said dielectric strip.

8. A micromodule as defined in claim 7, wherein said metal strip comprises an inductor and said chip is connected to opposed ends of said inductor.

9. A micromodule as defined in claim 8, wherein said micromodule forms a radiating antenna, wherein said dielectric strip defines a dielectric portion of said antenna, and wherein said metal strip defines an active portion of said antenna.

10. A micromodule as defined in claim 9, further comprising a ground plane provided on a side of said dielectric portion opposite said active portion.

11. A micromodule as defined in claim 10, wherein said ground plane comprises a second slotted metal strip bonded to said dielectric portion.

12. A micromodule as defined in claim 7, wherein said micromodule forms an identification label.

13. A micromodule as defined in claim 7, wherein said dielectric strip is made of a plastic material having an expansion coefficient of 20×

10^-6 /°

C.

14. A micromodule as defined in claim 7, wherein said dielectric strip is made of cardboard.

15. A micromodule as defined in claim 7, wherein said dielectric strip has a thickness of between 30 and 50 micrometers.

16. A micromodule as defined in claim 7, further comprising a layer of an insulating resin encapsulating said chip and bonded to said dielectric strip.

17. A micromodule as defined in claim 16, wherein said chip is bonded onto said dielectric strip and said dielectric strip overlies the slots in said metal strip and seals the slots in said metal strip from said insulating resin.

18. A micromodule comprising:

(A) a slotted metal strip;

(B) a perforated dielectric strip having a thickness of between 30 and 50 micrometers and being bonded to said metal strip so as to overly the slots in said metal strip;

(C) a chip bonded to said dielectric strip and connected to said metal strip through the perforations of said dielectric strip; and

(D) an insulating resin layer encapsulating said chip and bonded to said dielectric strip.