Surface mountable electronic component and method of making same

• US 5,569,880 A
• Filed: 12/02/1994
• Issued: 10/29/1996
• Est. Priority Date: 12/02/1994
• Status: Expired due to Fees

• Current Assignee: AVX Corporation (Kyocera Corporation)
• Original Assignee: AVX Corporation (Kyocera Corporation)
• Inventors: Randall, Sara P. E., Galvagni, John
• Primary Examiner(s): Kincaid, Kristine L.
• Assistant Examiner(s): DECKER, ROBERT
• Application Number:
  US08/348,293
• Time in Patent Office: 697 Days
• Field of Search: 174/52.2, 174/52.4, 174/52.6, 257/666, 257/678, 257/685, 257/686, 257/787, 338/334, 338/315, 361/301.4, 361/735, 361/743, 361/766, 361/782, 361/773, 361/790, 361/820, 437/208, 437/209, 437/915, 439/72, 439/74, 439/83
• US Class Current: 174/527
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/2081 Compound repelling a metal, e.g. solder
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A miniaturized surface mountable tombstoning resistant electronic component is disclosed. The terminals of the component are respectively L and J shaped conductive metal portions. The portions of the terminations covering the ends of the components are formed of a non-solder, wettable conductive metal, whereas the portions of the terminations underlying the bottom surface of the component are comprised of solder wettable metal. The disclosure further relates to a method of manufacturing the described termination structures.

Claims

1. A tombstoning resistant surface mount electronic component in the configuration of a right parallelepiped, said component including top and bottom surfaces, side surfaces and parallel end surfaces, conductive termination means exiting at said end surfaces and a conductive termination coating overlying said end surfaces and abutting portions of at least one of said top and bottom surfaces, the portions of said termination coating overlying said top and bottom surfaces defining spaced terminal pads formed of a metal wettable by solder, the outermost portions of said coating overlying said end surfaces having a further coating of a non-solder wettable conductive metal.

2. The electronic component of claim 1, wherein said outermost portions of said further coating is formed of one or more metals selected from the group consisting of chromium, tungsten, aluminum and titanium.

3. The component of claim 2 wherein said terminal pads only are coated with a solder layer.