Device to monitor and control the temperature of electronic chips to enhance reliability

• US 5,569,950 A
• Filed: 11/28/1995
• Issued: 10/29/1996
• Est. Priority Date: 08/16/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Narayan, Chandrasekhar, Lewis, David A.
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US08/563,510
• Time in Patent Office: 336 Days
• Field of Search: 257/712, 257/713, 257/467, 257/469, 257/470, 257/930, 361/688, 361/717, 361/718, 361/719
• US Class Current: 257/467
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 257/93 Thermoelectric, e.g. peltier effect cooling

Abstract

Device to monitor and control the temperature of electronic chips to enhance reliability including a thermal electric cooling device in which the cold side is thermally secured to the chip and the hot side is attached to a heat sink. A thermocouple is sandwiched between the TEC device and the chip and a feedback control circuit is connected between the thermocouple and the voltage source which applies a potential to the TEC device to maintain the chip at the desired substantially constant temperature.

Claims

1. A device for maintaining the temperature of an electronic chip at a substantially constant temperature, comprising:

a thermal electric cooling (TEC) device having a hot side and a cold side, said cold side being secured to said electronic chip;

a temperature sensing means having top and bottom sides, said top side being attached to said cold side of said TEC device and said bottom side of said temperature sensing means being attached to said electronic chip for monitoring the temperature of said chip;

heat sink means secured to the hot side of said TEC device; and

feedback control circuit means coupled between said temperature sensing means and a voltage source, said feedback control circuit means controlling the level of voltage supplied to said TEC device in response to the temperature of said chip to reduce the temperature of said chip so as to maintain said chip at a substantially constant temperature.

2. The device of claim 1 wherein said temperature sensing device is a thin film thermocouple.

3. The device of claim 1 wherein said temperature sensing device is built into one of a group consisting of the chip and an electronic package to which the chip is attached.

4. The device of claim 1 wherein the TEC device is driven by circuitry built into one of a group consisting of the chip and an electronic package to which the chip is attached.

5. The device of claim 1 wherein said TEC device is driven by turning on and off clock pulses.

6. The device of claim 1 wherein the voltage to the TEC device is preset to a different value for different modes of chip usage.

7. The device of claim 1 wherein said TEC device is secured to said electronic chip and said heat sink by a thermally conductive paste.

8. The device of claim 1 wherein said heat sink means is a multiple fin metallic heat sink.

9. The device of claim 1 wherein said feedback control circuit means is further coupled to a variable speed fan to provide additional cooling in response to the temperature of said chip.

10. A method of maintaining the temperature of an electronic chip at a substantially constant temperature comprising the steps of:

measuring the temperature of said electronic chip by a temperature sensor attached to a top of said chip and to a cold side of a thermal electric cooling (TEC) device, at an interface of the TEC device and the chip;

monitoring the measured temperature of said electronic chip; and

controlling a voltage potential applied to said TEC device in response to the monitoring of the temperature of said electronic chip, said TEC device having said electronic chip attached to said cold side of said TEC device and a heat sink attached to a hot side of said TEC device to reduce the temperature of said chip so that the temperature of said chip is maintained at a substantially constant temperature.

11. The method of claim 10 wherein said step of monitoring the temperature of a chip includes feeding a signal from a thermocouple attached to the chip to a feedback control circuit.

12. The method of claim 11 wherein said step of controlling the voltage potential includes regulating a voltage source coupled to said feedback control circuit in response to said signal.

13. The method of claim 10 further including the step of controlling the speed of a variable speed fan in response to the temperature of the chip.

14. A method for maintaining the temperature of an electronic chip at a substantially constant temperature comprising the steps of:

applying a voltage potential to a TEC device based on signals from the chip indicating the level of electrical activity of the chip, where the applied voltage is set to a predetermined value depending on the level of electrical activity of the chip.