Built-in self test indicator for an integrated circuit package

• US 5,570,035 A
• Filed: 01/31/1995
• Issued: 10/29/1996
• Est. Priority Date: 01/31/1995
• Status: Expired due to Fees

• Current Assignee: United States Department of the Army
• Original Assignee: The United States Of America As Represented By The Secretary Of The Army
• Inventors: Dukes, Michael A., Michael, Gerald T.
• Primary Examiner(s): Wieder, Kenneth A.
• Assistant Examiner(s): BOWSER, BARRY
• Application Number:
  US08/426,261
• Time in Patent Office: 637 Days
• Field of Search: 324/96, 324/501, 324/537, 328/763, 340/514, 340/534, 340/595, 362/800, 358/106
• US Class Current: 324/750.3
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G06F 11/321 Display for diagnostics, e.g. diagnostic result display, self-test user interface
• CPC Class Codes: G06F 11/326 for error or online/offline status

Abstract

Apparatus for providing a direct indication of the failure of an electronicircuit including a built-in self test circuit which performs an initial test on the electronic circuit and having a visual indicator coupled thereto which becomes activated when the self test circuit senses a failure of the electronic circuit upon power being supplied thereto or during operation. The electronic circuit with the built-in test feature consists of an integrated circuit chip or a multi-chip module encapsulated in a package with the indicator means visible therethrough. The indicator consists either of a light emitting diode or fusible material which changes its appearance and becomes visible through the package upon being activated by the built-in self test circuit.

Claims

1. A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising:

an integrated circuit chip;

a built-in self test circuit integrally formed within said integrated circuit chip, said built-in self test circuit performing an operational test on said integrated circuit chip; and

visible indicator means coupled to said built-in self test circuit which becomes activated when said built-in self test circuit senses a failure of said intergrated circuit when power is supplied thereto, said visible indicator means being formed as an integral part of a packaging for said intergrated circuit chip.

2. The apparatus as defined by claim 1 wherein said built-in self test circuit generates an electrical output signal upon sensing said failure and wherein said visible indicator means is responsive to and becomes activated by said output signal.

3. The apparatus as defined by claim 2 wherein said visible indicator means comprises a light emitting device producing visible emissions.

4. The apparatus as defined by claim 3 wherein said light emitting device comprises a light emitting diode producing visible emissions.

5. The apparatus as defined by claim 2 wherein said visible indicator means includes material which permanently changes appearance upon being activated in response to said output signal.

6. A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising:

an integrated circuit chip;

a built-in self test circuit integrally formed within said integrated circuit chip, said built-in self test circuit performing an operational test on said integrated circuit chip and generating an electrical output signal upon sensing a failure of said integrated circuit chip; and

visible indicator means, coupled to said built-in self test circuit and responsive to said electrical output signal, for indicating the failure of said integrated circuit chip when power is supplied thereto, said visible indicator means including fusible material which becomes activated and changes appearance in response to said electrical output signal, said fusible material being formed as an integral part of a packaging for said integrated circuit chip.

7. A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising:

a multi-intergrated circuit chip module having a plurality of intergrated circuit chips;

a built-in self test circuit integrally formed within said multi-chip module, said built-in self test circuit performing an operational test on said integrated circuit chips; and

visible indicator means coupled to said built-in self test circuit which becomes activated when said built-in self test circuit senses a failure of said intergrated circuit chips when power is supplied thereto, said visible indicator means being formed as an integral part of a packaging for said multi-chip module.

8. The apparatus as defined by claim 7 wherein said built-in self test circuit generates an electrical output signal upon sensing said failure and wherein said visible indicator means is responsive to and becomes activated by said output signal.

9. The apparatus as defined by claim 8 wherein said visible indicator means comprises a light emitting device producing visible emissions.

10. The apparatus as defined by claim 9 wherein said light emitting device comprises a light emitting diode producing visible emissions.

11. The apparatus as defined by claim 8 wherein said visible indicator means includes material which permanently changes appearance upon being activated in response to said output signal.

12. A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising:

a multi-chip module having a plurality of integrated circuit chips;

a built-in self test circuit integrally formed within said multi-chip module, said built-in self test circuit performing an operational test on said integrated circuit chips and generating an electrical output signal upon sensing a failure of said integrated circuit chips; and

visible indicator means, coupled to said built-in self test circuit and responsive to said electrical output signal, for indicating the failure of said integrated circuit chips when power is supplied thereto, said visible indicator means including fusible material which becomes activated and changes appearance in response to said electrical output signal said fusible material being formed as an integral part of a packaging for said multi-chip module.