Stimulation Electrode

• US 5,571,158 A
• Filed: 06/23/1994
• Issued: 11/05/1996
• Est. Priority Date: 08/06/1991
• Status: Expired due to Term

• Current Assignee: Biotronik Mess-Und Therapiegeraete GmbH & Company Ingenieurbuero Berlin (Biotronik SE & Company KG)
• Original Assignee: Biotronik Mess-Und Therapiegeraete GmbH & Company Ingenieurbuero Berlin (Biotronik SE & Company KG)
• Inventors: Schaldach, Max, Bolz, Armin
• Primary Examiner(s): Kamm, William E.
• Application Number:
  US08/193,042
• Time in Patent Office: 866 Days
• Field of Search: 607/119-129, 128/642
• US Class Current: 607/121
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence

Abstract

A stimulation electrode having a porous surface coating whose active surface area is significantly greater than the surface area defined by the geometric shape of the electrode, wherein the surface coating comprises an inert material, i.e. a material having no or only a very slight oxidation tendency, wherein the material of the surface coating is formed from an inert element, an inert chemical compound and/or an inert alloy, and the active surface area, by virtue of its fractal-like geometry, is greater by a factor of at least one thousand than the surface area defined by the basic geometric shape of the electrode.

Claims

1. A stimulation electrode, comprising:

an electrode base body which has a basic geometric shape and a surface area; and

a porous surface coating which is provided on at least a portion of the electrode base body, which is comprised of an inert material having a low oxidation tendency effective to render the material substantially inert and being selected from the group consisting of a element, a chemical compound, and an alloy, which is porous and has a fractal spatial geometry, and which has an active surface area which is greater by a factor of at least one thousand times than the surface area of the electrode base body.

2. The stimulation electrode as defined in claim 1, wherein the inert material is selected from the group consisting of (a) an element selected from the group consisting of gold, iridium, platinum and carbon, (b) a chemical compound which is one of a nitride, a carbide or a carbon nitride of an element selected from the group consisting of gold, iridium, platinum and carbon, and (c) an alloy of at least two elements selected from the group consisting of gold, iridium, platinum and carbon.

3. The stimulation electrode as defined in claim 2, wherein the porous surface coating is composed of iridium nitride.

4. The stimulation electrode as defined in claim 1, wherein the electrode base body is composed of titanium.

5. The stimulation electrode as defined in claim 1, further comprising means for connecting the stimulation electrode to an anode terminal, and wherein the porous surface coating has an active surface area which is effective for anodic operation of the stimulation electrode.

6. A bipolar stimulation system, comprising:

a reference electrode which is a stimulation electrode according to claim 1; and

means for connecting the reference electrode to a reference terminal.

7. A stimulation electrode, comprising:

an electrode base body which has a basic geometric shape and a surface area; and

a porous surface coating which is a thin film applied to the electrode by a thin-layer technology process, which is provided on at least a portion of the electrode base body, which is comprised of an inert material having a low oxidation tendency effective to render the material substantially inert and being selected from the group consisting of a element, a chemical compound, and an alloy, which is porous and has a fractal spatial geometry, and which has an active surface area which is greater by a factor of at least one thousand times than the surface area of the electrode base body.

8. The stimulation electrode as defined in claim 7, wherein the thin film is a vacuum deposited thin film, and wherein the thin-layer technology process is a vacuum coating method selected from the group consisting of reactive cathodic sputtering and ion-plating.