Gel-forming silicone composition

• US 5,571,853 A
• Filed: 07/20/1995
• Issued: 11/05/1996
• Est. Priority Date: 02/09/1993
• Status: Expired due to Term

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Fujiki, Hironao, Ikeno, Masayuki
• Primary Examiner(s): Sweet, Mark D.
• Application Number:
  US08/504,489
• Time in Patent Office: 474 Days
• Field of Search: 524/268, 524/588, 525/478, 528/15, 528/31, 528/32
• US Class Current: 524/268
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08G 77/24 halogen-containing groups
• CPC Class Codes: C08G 77/70 Siloxanes defined by use of the MDTQ nomenclature
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes

Abstract

A gel-forming silicone composition comprising (A) an organopolysiloxane containing a silicon-bonded alkenyl group or groups in an average amount of from 0.15 to 0.35 mol % based on all silicon-bonded organic groups contained per molecule, (B) a non-functional organopolysiloxane, (C) an organohydrogenpolysiloxane containing an average of 2 silicon-bonded hydrogen atoms per molecule, and (D) an addition reaction catalyst. The silicone composition is able to give a gel-like cured silicone product with low modulus of elasticity while retaining flexibility.

Claims

1. A gel-forming silicone composition comprising:

(A) an organopolysiloxane containing a silicon-bonded vinyl group in an average amount of from 0.15 to 0.35 mol % based on the amount of all the silicon-bonded organic groups contained in its molecule;

(B) from 10 to 150 parts by weight per 100 parts by weight of the component (A), a non-functional organopolysiloxane other than (C) having the following average composition formula (2);

space="preserve" listing-type="equation">(R.sup.3).sub.c Sio.sub.(4-c)/2 (

     2)

wherein R³ is a substituted or unsubstituted non-functional monovalent hydrocarbon group, and c has a value of from 2.0 to 2.2, component (B) having a viscosity at 25°

C. not higher than the viscosity at 25°

C. of the component (A);

(C) an organohydrogenpolysiloxane containing an average of from 1 to 3 silicon-bonded hydrogen atoms per molecule present in an amount such that the amount of the silicon-bonded hydrogen atoms in the component (C) is from 0.8 to 2.0 moles per mole of the vinyl groups in the component (A); and

(D) an addition reaction catalyst.

2. The composition of claim 1, wherein the component (A) has the following average composition formula (1):

space="preserve" listing-type="equation">(R.sup.1).sub.a (R.sup.2).sub.b SiO.sub.(4-a-b)/2 (

     1)

wherein R¹ is a vinyl group, R² is a substituted or unsubstituted monovalent hydrocarbon group, and a and b have values such that 0<

b<

3 and 0.0015≦

a/(a+b)≦

0.0035.

3. The composition of claim 1, wherein the component (A) has a viscosity of from 400 to 3000 cP at 25°

C.

4. The composition of claim 1, wherein the component (C) has the following average composition formula (3):

space="preserve" listing-type="equation">(R.sup.4).sub.d H.sub.e SiO.sub.(4-d-e)/2 (3)

wherein R⁴ is a substituted or unsubstituted monovalent hydrocarbon group, and d and e have values such that 0<

d<

3, 0<

e≦

2, and 1≦

d+e≦

3.

5. A gel-like cured product obtained by curing the gel-forming silicone composition as claimed in claim 1.

6. The composition of claim 1, wherein the silicon-bonded organic groups, other than vinyl, in (A) and (C) are alkyl, cycloalkyl, aryl or aralkyl groups, or these groups substituted by halogen or cyano, or two organic groups together forming a lower alkylene group.