Reusable carrier for burn-in/testing on non packaged die

• US 5,572,140 A
• Filed: 11/05/1993
• Issued: 11/05/1996
• Est. Priority Date: 08/25/1993
• Status: Expired due to Fees

• Current Assignee: Sunright Ltd.
• Original Assignee: Sunright Ltd.
• Inventors: Tan, Siew K., Lim, Samuel S. S.
• Primary Examiner(s): Nguyen, Vinh P.
• Application Number:
  US08/147,945
• Time in Patent Office: 1,096 Days
• Field of Search: 324/72.5, 324/754, 324/765, 324/158.1, 324/755, 174/52.4, 361/751, 29/840, 29/827, 439/70, 439/68, 439/69, 437/8
• US Class Current: 324/750.05
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433

Abstract

A re-usable carrier having a cavity for receiving unpackaged die with molded metallized probe heads to establish contact with the bond pads of the die, enabling the die to be functionally tested through the existing test systems. The novel carrier has metallized contacts for making electrical connection between the bare die and the perimeter of the carrier. The circuitry for electrically connecting the die and the perimeter of the carrier can be molded and plated into the base or printed on polymeric film. The base or integrated cover-base of the carrier may be from injection or press molded thermoplastic or press molded from ceramic to conform to any intended package for the die. The object is to adapt the carrier to the existing test equipment for burn-in stress and electrical tests for the intended package design without having to modify the hardware. The carrier may be plugged into a burn-in socket for burn-in stress testing and inserted onto an automatic test handler for electrical testing. Following burn-in stress and electrical tests, the die is removed and the carrier may be re-used.

Claims

1. A re-usable carrier for mounting a non-packaged die for burn-in and testing comprising

a molded base having a configuration and outer perimeter conforming to a standard integrated circuit package design, said base including integrally formed terminals positioned on the outer perimeter and having a shape conforming to the terminals of the standard integrated circuit package design,

a thin layer electrically conductive material coated on the integrally formed terminals of the base to form outer circuitry for enabling electrical contact of the terminals with test equipment, said thin layer electrically conductive material extending along said base adjacent said formed terminals to form electrical contacts on the base,

a thin layer film construct received on the molded plastic base, said film construct including means for receiving and positioning a non-packaged die with bond pads, and including a printed circuit positioned on the film and engaging the electrical contacts on the base for enabling electrical connection between the outer circuitry positioned on the formed terminals and the bond pads of a received non-packaged die,

a cover removably mounted on the molded base for holding the non-packaged die to the film construct and imparting sufficient pressure for maintaining connection between the bond pads of the non-packaged die and the printed circuit on the film, and

cover holding means for detachably holding the cover to the molded base, wherein said cover, molded base, film construct and cover holding means form a carrier having a shape and dimension substantially conforming to a standard integrated circuit package design so as to allow use with existing test equipment.

2. A re-usable carrier according to claim 1 wherein said base includes a recessed portion for receiving said film construct and wherein said electrical contacts of said base are positioned in said recessed portion for engaging the printed circuit on the film construct.

3. A re-usable carrier according to claim 1 wherein said film construct comprises

a first film containing a well for receiving a non-packaged die, and

a second film bonded to the first film, said second film including said printed circuit.

4. A re-useable carrier according to claim 3, wherein said first film has a thickness corresponding to the thickness of a non-packaged die to be tested.

5. A re-useable carrier according to claim 3 wherein said first film is secured to said second film by ultrasonically induced welds.

6. A re-useable carrier according to claim 3 wherein said printed circuit on said second film includes contact pads for engaging bond pads of a non-packaged die and bond pads for engaging said electrical contacts on the base.

7. A re-useable carrier according to claim 6 wherein said contact pads are positioned on a single side of said second film.

8. A re-useable carrier according to claim 6 wherein said second film has the printed circuit positioned on one side, and the contact pads are positioned on the other side of the film, and including means electrically connecting the bond pads and printed circuit.

9. A re-useable carrier according to claim 8 wherein the means electrically connecting the bond pads and printed circuit comprise a through hole within the film, said through hole including electrically conducting material coated on the sides of the through hole and interconnecting the printed circuit and the bond pads.