Integrated circuit card comprising means for the protection of the integrated circuit

• US 5,574,309 A
• Filed: 08/15/1994
• Issued: 11/12/1996
• Est. Priority Date: 11/25/1991
• Status: Expired due to Fees

• Current Assignee: Gemplus International SA (Thales SA)
• Original Assignee: Gemplus International SA (Thales SA)
• Inventors: Fidalgo, Jean-Christophe, Turin, Jel, Papapietro, Michel
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US08/244,364
• Time in Patent Office: 820 Days
• Field of Search: 257/679, 257/698
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A system for protecting integrated circuits on smart cards is described. The circuit (103) is placed in a cavity (102) in a ceramic package (101). Standard contacts (104) are deposited on the side of the package opposite to the cavity opening and connected to the chip (103) via feed-through conductors (106) extending into the cavity (102) and connected therein to wires (105) which are welded to the chip (103). The cavity (102) is either sealed by a lead (108) or filled with a protective material (208). Smart cards with a lifetime of over ten years may thus be obtained.

Claims

1. An integrated circuit card comprising:

an integrated circuit;

a card body; and

a package, the package being housed in the card body, the package housing the integrated circuit, the package being formed of a ceramic material, the package having a cavity formed therein to hold the integrated circuit, the cavity opening out on a first face of the package to receive the integrated circuit, and the package further comprising means for connecting the integrated circuit with the exterior, the connection means further comprising

metallizations positioned on a second face of the package, the second face being opposed to the first face,

feed-through conductors connected to the metallizations and connecting the metallizations electrically to the interior of the cavity, and

connection wires connected to the integrated circuit and to the feed-through conductors;

wherein the package has a lid fixed to the package to close the cavity and the lid is formed out of a metallic material.

5. An integrated circuit card according to claim 1, characterized in that the cavity is filled with a protective material.

6. An integrated circuit card according to claim 1, characterized in that it further comprises a conductive wire that is connected to the integrated circuit and is embedded in the thickness of the body of the card to form an induction coil designed for transmission without contacts.

7. An integrated circuit card according to claim 1, characterized in that the package has a ceramic base.

8. An integrated circuit card according to claim 7, characterized in that the ceramic base supports a resin molding of the integrated circuit.

10. An integrated circuit card according to claim 7, characterized in that the base is surrounded by a small wall made of ceramic.

11. An integrated circuit card according to claim 1, wherein the integrated circuit card is a smart card.

2. An integrated circuit card comprising:

an integrated circuit;

a card body;

a package, the package being housed in the card body, the package housing the integrated circuit, the package being formed of a ceramic material, the package having a cavity formed therein to hold the integrated circuit, the cavity opening out on a first face of the package to receive the integrated circuit, and the package further comprising means for connecting the integrated circuit with the exterior, the connection means further including

metallizations positioned on a second face of the package, the second face being opposed to the first face,

feed-through conductors connected to the metallizations and connecting the metallizations electrically to the interior of the cavity, and

connection wires connected to the integrated circuit and to the feed-through conductors; and

an elastic layer forming the junction between the body of the card and the package.

3. An integrated circuit card according to claim 2, characterized in that the package has a lid fixed to the package to close the cavity.

4. An integrated circuit card according to claim 3, characterized in that the lid is formed out of the same material as the package.

9. An integrated circuit card comprising:

an integrated circuit;

a card body;

a package, the package being housed in the card body, the package housing the integrated circuit, the package being formed of a ceramic material, the package having a cavity formed therein to hold the integrated circuit, the cavity opening out on a first face of the package to receive the integrated circuit, and the package further comprising means for connecting the integrated circuit with the exterior, the connection means further including

metallizations positioned on a second face of the package, the second face being opposed to the first face,

feed-through conductors connected to the metallizations and connecting the metallizations electrically to the interior of the cavity,

connection wires connected to the integrated circuit and to the feed-through conductors, and

a ceramic base, the base being provided with a polarization means to recognize its orientation.

14. A package for housing an integrated circuit, the package being capable of being housed in a card body of an integrated circuit card, the package being formed of a ceramic material, the package having a cavity formed therein to hold the integrated circuit, the cavity opening out on a first face of the package to receive the integrated circuit, and the package further comprising

means for connecting the integrated circuit with the exterior, the connection means further comprising

metallizations positioned on a second face of the package, the second face being opposed to the first face,

feed-through conductors connected to the metallizations and enabling the metallizations to be electrically connected to the interior of the cavity

a ceramic base, the ceramic base being provided with a polarization means to recognize its orientation.

12. A package according to claim 14, characterized in that the cavity is filled with a protective material.

13. A package according to claim 14, characterized in that the ceramic base supports a resin molding of the integrated circuit.

15. A package according to claim 14, characterized in that the base is surrounded by a small wall made of ceramic.