Apparatus and method for measuring ball grid arrays
DCFirst Claim
1. A ball grid array measurement apparatus for inspecting a ball grid array comprising:
- (a) a base;
(b) fixture means, connected to the base, for holding the ball grid array;
(c) actuating means, connected to the base, for moving a stage in at least one axis in response to a motion control signal;
(d) position sensing means, connected to the stage, for sensing a position of the stage, wherein the position sensing means has a position output;
(e) touch sensor means, connected to the stage, for sensing contact with the ball grid array when the actuating means moves the stage toward the ball grid array, wherein the touch sensor means further comprises a plurality of gas pressure backed contact switches, each in a predetermined position, and each having a contact signal; and
(f) computer processor means, connected to receive the contact signal and position signal, for storing the position of the stage at a time of contact to measure the ball grid array at the predetermined position.
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Abstract
An array of touch sensors are brought in contact with a ball grid array. A linear actuator moves the array of touch sensors. The position of the linear actuator is known very precisely. As the touch sensors encounter the ball grid array, they provide a signal to a computer system that an element on the ball grid array has been encountered. The computer notes the position of the linear actuator and the particular sensor in the touch sensor array that is providing the signal. Initially, each touch sensor rests against a printed circuit board circuit with a conductive disk connecting the circuit in an unactuated position. In an actuated position, the circuit is broken by the touch sensor being forced away from the printed circuit board by the object encountered. Positive air pressure is provided against one side of the disk to press it against the contact points on the printed circuit board. An alignment plate helps prevent tilting of a touch sensor. A circular cartridge is loaded by a chip handler and multiple array sensors are used to test for board warpage and various ball grid configurations.
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Citations
20 Claims
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1. A ball grid array measurement apparatus for inspecting a ball grid array comprising:
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(a) a base; (b) fixture means, connected to the base, for holding the ball grid array; (c) actuating means, connected to the base, for moving a stage in at least one axis in response to a motion control signal; (d) position sensing means, connected to the stage, for sensing a position of the stage, wherein the position sensing means has a position output; (e) touch sensor means, connected to the stage, for sensing contact with the ball grid array when the actuating means moves the stage toward the ball grid array, wherein the touch sensor means further comprises a plurality of gas pressure backed contact switches, each in a predetermined position, and each having a contact signal; and (f) computer processor means, connected to receive the contact signal and position signal, for storing the position of the stage at a time of contact to measure the ball grid array at the predetermined position. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A ball grid array touch sensor grid for sensing a ball grid array, the ball grid array touch sensor grid comprising:
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(a) a positive gas pressure container, having a container bottom; (b) a first flat mount, connected and position in the positive gas pressure container, having a first plurality of holes, wherein each hole has a first electrical contact and a second electrical contact disposed on an edge of each hole; (c) a second flat mount, connected and positioned at the container bottom, having a second plurality of holes disposed relative to the first plurality of holes; and (d) a plurality of flat conductive plates with projecting insulating pins, wherein a first pin end protrudes through one of the first plurality of holes and protrudes through a corresponding one of the second plurality of holes out past the container bottom for contact with the ball grid array.
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18. A method of measuring a ball grid array comprising the steps of:
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(a) mounting the ball grid array on a test mount; (b) moving a ball grid array touch sensor array toward the ball grid array, wherein the ball grid array touch sensor array comprises a plurality of touch sensors at predetermined positions; (c) scanning each touch sensor on the ball grid array touch sensor array; and (d) noting the position of the test mount when any one of the touch sensors activate; and (e) measuring a corresponding position on the ball grid array.
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19. A ball grid array measurement apparatus comprising:
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(a) a conveyor; (b) a means for containing a plurality of ball grid arrays; (c) a first means for transporting a ball grid array from the means for containing a plurality of ball grid arrays to the conveyor; (d) a plurality of ball grid array testers, wherein each of the plurality of ball grid array testers tests a portion of the ball grid array and provides ball data, and the conveyor conveys the ball grid array to each of the plurality of ball grid array testers; (e) a means for imaging, wherein the imaging means determines a location of balls on the ball grid array and provides location data; (f) a means for computing connected to receive the ball data and the location data and provides pass or fail data; (g) a second means for transporting the ball grid array from the conveyor and connected to receive the pass or fail data; (h) a first storing means for storing ball grid arrays, wherein the first storing means receives ball grid arrays having pass data from the conveyor; and (i) a second storing means for storing ball grid arrays, wherein the second storing means receives ball grid arrays having fail data from the conveyor. - View Dependent Claims (20)
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Specification