Method and apparatus for providing optical coupling between optical components

• US 5,574,811 A
• Filed: 07/26/1995
• Issued: 11/12/1996
• Est. Priority Date: 09/07/1994
• Status: Expired due to Fees

• Current Assignee: Nortel Networks UK Limited (Nortel Networks Corporation)
• Original Assignee: Northern Telecom Limited (Nortel Networks Corporation)
• Inventors: Parker, James W., Bricheno, Terry
• Primary Examiner(s): Healy, Brian
• Application Number:
  US08/507,613
• Time in Patent Office: 475 Days
• Field of Search: 385/14, 385/15, 385/27, 385/31, 385/49, 385/50, 385/51, 385/52, 385/59, 385/65, 385/71, 385/80, 385/83, 385/88, 385/89, 385/129, 385/131, 385/132, 385/137, 385/130
• US Class Current: 385/52
• CPC Class Codes: G02B 6/2746 comprising non-reciprocal devices, e.g. isolators, FRM, circulators, quasi-isolators magneto-optic non-reciprocal devices G02F1/093
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02F 1/093 used as non-reciprocal devices, e.g. optical isolators, circulators G02F1/0955 takes precedence

Abstract

Optical coupling between the end of a laser (10) mounted on a silica motherboard (12) and an optical fibre (11) is effected with the aid of a silicon platform (14) to which the end of the fibre (11) is secured. The motherboard (12) and fibre platform (11) are crystallographically etched to provide complementary mating profiles with a clearance of less than 10 μm when alignment is established. While that alignment is maintained, resin (23) is introduced between motherboard and the fibre platform, and is cured. The minimal thickness of the cured resin minimises misalignments caused by resin shrinkage.

Claims

1. A method of mounting first and second optical components in optically coupled relationship, wherein the first optical component comprises an optical waveguide formed in or mounted on a first substrate and the second optical component is formed in or mounted on a second substrate, wherein the first and second substrates are provided with at least one pair of substantially complementary profile mating surfaces, and wherein the first and second optical components are positioned with respect to their respective substrates with a precision that ensures that a maximum value of optical coupling between said components occurs with a relative positioning of each of said mating surfaces with respect to its pair providing a non-zero spacing therebetween of not substantially more than 101μ

m, in which method said relative positioning is substantially established and is held while a bonding medium between each of said mating surfaces and its pair is solidified.

2. A method as claimed in claim 1, wherein the bonding medium is introduced in liquid form between each of said mating surfaces and its pair after said establishment of said relative positioning.

3. A method as claimed in claim 2, wherein the mating surfaces are configured to provide an interlocking arrangement having the property that direct contact between each of said mating surfaces and its pair serves to establish substantially optimised orientational relative alignment of said components, and wherein orientational relative alignment of said components is substantially optimised by brining each of said mating surfaces into direct contact with its pair prior to the employment of translational movements to establish said relative positioning.

4. A method as claimed in claim 3, wherein said relative positioning is established using a jig having first and second parts to which the first and second substrates are temporarily secured, wherein the temporary securing of one of the substrates to its associated part of the jig is by way of a soldered connection which is rendered fluid while said substantially optimised orientation relative alignment of said components is established, and which is then solidified while that orientational relative alignment is maintained.

5. A method as claimed in claim 1, wherein the bonding medium is applied to a member of the or each pair of mating surfaces prior to said establishment of said relative positioning.

6. A method as claimed in claim 5, wherein the mating surfaces are configured to provide an interlocking arrangement having the property that contact between each of one or more bonding medium coated mating surfaces and its pair serves to establish substantially optimised orientational relative alignment of said components, and wherein orientational relative alignment of said components is substantially optimised by bringing the or each said bonding medium coated mating surface into contact with its pair prior to the employment of translational movements to establish said relative positioning.

7. A method as claimed in claim 6, wherein said relative positioning is established using a jig having first and second parts to which the first and second substrates are temporarily secured, wherein the temporary securing of one of the substrates to its associated part of the jig is by way of a soldered connection which is rendered fluid while said substantially optimised orientation relative alignment of said components is established, and which is then solidified while that orientational relative alignment is maintained.

8. A method as claimed in claim 1, wherein said first optical component is one of a set of first optical components formed in or mounted on said first substrate, and said second optical component is one of a set of second optical components formed in or mounted on said second substrate.

14. An optical package having a housing containing a plurality of the component parts of an optical amplifier, the housing including a plurality of optical fibre ports optically coupled within the housing with optical fibre pigtails the inboard end of each of which is mounted in an associated one of a set of first substrates that are individually mounted on a common second substrate by the method claimed in claim 1.

9. A device having a first optical component comprising a first optical waveguide formed in or mounted on a first substrate and a second optical component comprising a second optical waveguide formed in or mounted on a second substrate, wherein the first and second substrates are provided with at least one pair of substantially complementary profile mating surfaces, wherein the first and second components are held positioned relative to each other so as to provide a substantially maximised value of optical coupling therebetween by a bonding medium that provides a bond between said at least one pair of substantially complementary profile mating surfaces, the bonding medium of said bond having a non-zero thickness of not substantially more than 10μ

m.

10. A device as claimed in claim 9, wherein the first optical component is an optical fibre.

11. A device as claimed in claim 10, wherein the second optical component is an injection laser.

12. A device as claimed in claim 9 wherein the first optical component is one of a set of first optical components which are optical fibres in the form of an optical fibre ribbon.

13. A device as claimed in claim 12 wherein the second optical component is one of a set of second optical components is one of a set of second optical components which are injection lasers in the form of an injection laser array.