Chemical/mechanical planarization (CMP) apparatus and polish method

• US 5,575,706 A
• Filed: 01/11/1996
• Issued: 11/19/1996
• Est. Priority Date: 01/11/1996
• Status: Expired due to Term

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Tseng, Pin-Nan, Tsai, Chia S.
• Primary Examiner(s): Smith, James G.
• Assistant Examiner(s): EDWARDS, DONA
• Application Number:
  US08/585,068
• Time in Patent Office: 313 Days
• Field of Search: 451/41, 451/285, 451/287, 451/288, 451/289, 451/36, 451/37, 451/39, 451/93, 216/88, 216/89, 156/636.1
• US Class Current: 438/693
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

An improved and new apparatus and process for chemical/mechanical planarization (CMP) of a substrate surface, wherein the slurry concentration between the wafer and polishing pad is controlled through the application of an electric field between the wafer carrier and polishing platen, has been developed. The result is an increased polish removal rate and better uniformity of the planarization process.

Claims

1. An apparatus for planarizing semiconductor wafers comprising:

a rotatable platen and polishing pad for chemical/mechanical polishing (CMP) a surface of a semiconductor wafer;

a reservoir for a polishing slurry and means to dispense the slurry onto the polishing pad;

an electrode embedded in said rotatable platen;

a rotatable wafer carrier and means for holding the surface of the semiconductor wafer in juxtaposition relative to said rotating polishing pad with an applied pressure between the wafer carrier and the polishing pad;

at least one electrode embedded in said rotatable wafer carrier; and

a means to apply an electric field between said electrode embedded in said rotatable platen and said electrode embedded in said rotatable wafer carrier.

2. The apparatus of claim 1, wherein said polishing slurry comprises silica and H₂ O at a pH between about pH=10 to pH=11.

3. The apparatus of claim 1, wherein said rotatable platen is rotated at a speed between about 10 to 70 rpm.

4. The apparatus of claim 1, wherein said rotatable wafer carrier is rotated at a speed between about 25 to 90 rpm.

5. The apparatus of claim 1, wherein said applied pressure between the wafer carrier and the polishing pad is between about 2 to 12 psi.

6. The apparatus of claim 1, wherein said electric field between said electrode embedded in said rotatable platen and said electrode embedded in said rotatable wafer carrier is a result of an applied potential between about 1 to 10 volts, between said electrode in said rotatable platen and said electrode in said rotatable wafer carrier.

7. The apparatus of claim 1, wherein said electrode embedded in said rotatable platen has substantially the same diameter as the platen.

8. The apparatus of claim 1, wherein said electrode embedded in said rotatable wafer carrier has substantially the same diameter as the wafer carrier.

9. The apparatus of claim 1, wherein said electrode embedded in said rotatable wafer carrier has a diameter which is a fraction of the diameter of the wafer carrier.

10. An apparatus for planarizing semiconductor wafers comprising:

a rotatable platen and polishing pad for chemical/mechanical polishing (CMP) a surface of a semiconductor wafer;

a reservoir for a polishing slurry and means to dispense the slurry onto the polishing pad;

an electrode embedded in said rotatable platen;

a rotatable wafer carrier and means for holding the surface of the semiconductor wafer in juxtaposition relative to said rotating polishing pad with an applied pressure between the wafer carrier and the polishing pad;

at least two electrodes embedded in said rotatable wafer carrier; and

a means to apply bidirectional electric fields between said electrode embedded in said rotatable platen and said electrodes embedded in said rotatable wafer carrier.

11. The apparatus of claim 10, wherein said polishing slurry comprises silica and H₂ O at a pH between about pH=10 to pH=11.

12. The apparatus of claim 10, wherein said rotatable platen is rotated at a speed between about 10 to 70 rpm.

13. The apparatus of claim 10, wherein said rotatable wafer carrier is rotated at a speed between about 25 to 90 rpm.

14. The apparatus of claim 10, wherein said applied pressure between the wafer carrier and the polishing pad is between about 2 to 12 psi.

15. The apparatus of claim 10, wherein said electrode embedded in said rotatable platen has substantially the same diameter as the platen.

16. The apparatus of claim 10, wherein a first electrode embedded in said rotatable wafer carriers has a circular shape with a diameter which is a fraction of the diameter of the wafer carrier and a second electrode embedded in said rotatable wafer carrier has an annular shape with an outer diameter substantially the same as the diameter of said semiconductor wafer and an inner diameter greater than the diameter of said first electrode.

17. The apparatus of claim 10, wherein said bi-directional electric fields between said electrode embedded in said rotatable platen and said electrodes embedded in said rotatable wafer carrier are a result of an applied potential between about 1 to 10 volts, between said first electrode embedded in said rotatable wafer carrier and said second electrode embedded in said rotatable wafer carrier.

18. A method for fabricating a planarized layer of dielectric material on a semiconductor substrate containing a structure, comprising the steps of:

providing said structure on said semiconductor substrate;

depositing a layer of dielectric material onto said semiconductor substrate containing said structure;

planarizing said layer of dielectric material by holding said semiconductor substrate on a wafer carrier into which is embedded at least one electrode, and rotating the wafer carrier, in the presence of a polishing slurry, against a polishing pad attached to a rotating platen into which is embedded an electrode;

applying pressure between the rotating wafer carrier and rotating platen; and

applying an electric field between said electrode embedded in said rotatable platen and said electrode embedded in said rotatable wafer carrier.

19. The method of claim 18, wherein said structure is an active device.

20. The method of claim 18, wherein said structure is an interconnection pattern of conducting material.

21. The method of claim 18, wherein said structure comprises both active devices and an interconnection pattern of conducting material.

22. The method of claim 19, wherein said active device is a NFET or PFET MOS device.

23. The method of claim 20, wherein said interconnection pattern of conducting material, is aluminum having a thickness between about 4000 to 8080 Angstroms.

24. The method of claim 18, wherein said layer of dielectric material is silicon oxide deposited using LPCVD processing, at a temperature between about 300°

to 500°

C., to a thickness between about 8000 to 11,000 Angstroms, using TEOS at a flow between about 400 to 1600 sccm.

25. The method of claim 18, wherein said polishing slurry comprises silica and H₂ O, controlled in the temperature range between about 20°

to 30°

C.

26. The method of claim 18, wherein said rotating wafer carrier is rotated:

in a range between about 25 to 90 rpm.

27. The method of claim 18, wherein said rotating platen is rotated in a range between about 10 to 70 rpm.

28. The method of claim 18, wherein said applied pressure between the wafer carrier and platen is in a range between about 2 to 12 psi.

29. The method of claim 18, wherein said electric field between said electrode embedded in said rotatable platen and said electrode embedded in said rotatable wafer carrier is a result of an applied potential between about 1 to 10 volts, between said electrode in said rotatable platen and said electrode in said rotatable wafer carrier.

30. The method of claim 18, wherein said electrode embedded in said rotatable platen has substantially the same diameter as the platen.

31. The method of claim 18, wherein said electrode embedded in said rotatable wafer carrier has substantially the same diameter as the wafer carrier.

32. The method of claim 18, wherein said electrode embedded in said rotatable wafer carrier has a diameter which is a fraction of the diameter of the wafer carrier.

33. The method of claim 18, wherein a first electrode embedded in said rotatable wafer carrier has a circular shape with a diameter which is a fraction of the diameter of the wafer carrier and a second electrode embedded in said rotatable wafer carrier has an annular shape with an outer diameter substantially the same as the diameter of said semiconductor wafer and an inner diameter greater than the diameter of said first electrode.

34. The method of claim 33, wherein bi-directional electric fields are applied between said electrode embedded in said rotatable platen and said electrodes embedded in said rotatable wafer carrier.

35. The method of claim 34, wherein said bi-directional electric fields are a result of an applied potential between about 1 to 10 volts, between said first electrode embedded in said rotatable wafer carrier and said second electrode embedded in said rotatable wafer carrier.