Process for through-hole plating of two-layer printed circuit boards and multilayers
First Claim
1. Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, comprising the use of a microemulsion of a monomeric thiophene of the formula (I) to form the conductive polythiophene layer, ##STR7## in which X denotes oxygen or a single bond,R1 and R2 mutually independently denote hydrogen or a C1 -C4 alkyl group or together form an optionally substituted C1 -C4 alkylene residue or a 1,2-cyclohexylene residue, wherein the conductive layer of polythiophene is produced on the walls of the through-holes by subsequent or simultaneous treatment with acid and, finally, a metal is electro-deposited on this conductive layer.
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Accused Products
Abstract
Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a microemulsion of a monomeric thiophene of the formula (I) is used to form the conductive polythiophene layer, ##STR1## in which X denotes oxygen or a single bond,
R1 and R2 mutually independently denote hydrogen or a C1 -C4 alkyl group or together form an optionally substituted C1 -C4 alkylene residue or a 1,2-cyclohexylene residue,
and in that the conductive layer of polythiophene is produced on the walls of the through-holes by subsequent or simultaneous treatment with acid and, finally, a metal is electro-deposited on this conductive base.
75 Citations
12 Claims
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1. Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, comprising the use of a microemulsion of a monomeric thiophene of the formula (I) to form the conductive polythiophene layer, ##STR7## in which X denotes oxygen or a single bond,
R1 and R2 mutually independently denote hydrogen or a C1 -C4 alkyl group or together form an optionally substituted C1 -C4 alkylene residue or a 1,2-cyclohexylene residue, wherein the conductive layer of polythiophene is produced on the walls of the through-holes by subsequent or simultaneous treatment with acid and, finally, a metal is electro-deposited on this conductive layer.
Specification
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- Resources
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Current AssigneeHeraeus Clevios GmbH (Heraeus Holding GMBH)
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Original AssigneeBayer AG
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InventorsJonas, Friedrich, Schomacker, Reinhard, Wolf, Gerhard-Dieter
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Primary Examiner(s)Phasge, Arun S.
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Assistant Examiner(s)Wong, Edna
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Application NumberUS08/530,998Time in Patent Office426 DaysField of Search205/118, 205/125, 205/159, 205/162, 205/163, 205/164, 205/165, 205/166, 205/183, 174/266US Class Current205/125CPC Class CodesC25D 5/56 of plasticsH05K 2201/0329 Intrinsically conductive po...H05K 2203/0796 Oxidant in aqueous solution...H05K 3/424 by direct electroplatingH05K 3/427 initial plating of through-...
