Process for extrusion

• US 5,575,965 A
• Filed: 05/19/1995
• Issued: 11/19/1996
• Est. Priority Date: 05/19/1995
• Status: Expired due to Term

• Current Assignee: Union Carbide Chemicals & Plastics Technology Corporation (Dow, Inc.)
• Original Assignee: Union Carbide Chemicals & Plastics Technology Corporation (Dow, Inc.)
• Inventors: Caronia, Paul J., Shurott, Salvatore F.
• Primary Examiner(s): THURLOW, JEFFERY
• Application Number:
  US08/445,140
• Time in Patent Office: 550 Days
• Field of Search: 264/171.17, 264/171.23, 264/331.17, 264/331.15, 264/1.28, 264/1.29, 264/171.16, 264/171.18, 425/113, 425/114, 425/133.1
• US Class Current: 264/171.17
• CPC Class Codes: B29C 48/05 Filamentary, e.g. strands
• CPC Class Codes: B29C 48/06 Rod-shaped
• CPC Class Codes: B29C 48/15 incorporating preformed parts or layers, e.g. extrusion moulding around inserts
• CPC Class Codes: B29C 48/17 the components having different colours
• CPC Class Codes: B29C 48/21 the layers being joined at their surfaces
• CPC Class Codes: C08L 2205/02 containing two or more polymers of the same C08L -group
• CPC Class Codes: C08L 2205/03 containing three or more polymers in a blend
• CPC Class Codes: C08L 23/06 Polyethene
• CPC Class Codes: C08L 23/0815 Copolymers of ethene with aliphatic 1-olefins
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 2666/06 Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
• CPC Class Codes: C08L 27/16 Homopolymers or copolymers or vinylidene fluoride
• CPC Class Codes: H01B 13/141 of two or more insulating layers

Abstract

A process for the co-extrusion of an inner layer around a conductive medium and an outer layer around the inner layer including:

(i) introducing into an extruder adapted for profile coextrusion, a preformed conductive medium; an inner layer formulation including a homogeneous polyethylene having a polydispersity in the range of about 1.5 to about 3.5 and an essentially uniform comonomer distribution, and an organic peroxide; and an outer layer formulation including (A) one of (a) a copolymer of ethylene and an unsaturated ester; (b) or a polyethylene having a polydispersity greater than about 4.0 and a density of at least 0.916 gram per cubic centimeter, said polymer made by a high pressure process; or (c) a heterogeneous copolymer of ethylene and one or more alpha-olefins having a density of less than 0.916 gram per cubic centimeter, a melt index of at least about 4 grams per 10 minutes, and a polydispersity greater than about 4.0, and, (B) optionally, an organic peroxide; and

(ii) co-extruding said formulations around the conductive medium at a temperature no higher than about 160 degrees C.

Claims

1. A process for the co-extrusion of an inner layer around a conductive medium and an outer layer around the inner layer comprising:

(i) introducing into an extruder adapted for profile co-extrusion, a preformed conductive medium;

an inner layer formulation comprising a homogeneous polyethylene having a polydispersity in the range of about 1.5 to about 3.5 and an essentially uniform comonomer distribution, and an organic peroxide; and

an outer layer formulation comprising (A) one of (a) a copolymer of ethylene and an unsaturated ester;

or (b) a polyethylene having a polydispersity greater than about 4.0 and a density of at least 0.916 gram per cubic centimeter, said polymer made by a high pressure process;

or (c) a heterogeneous copolymer of ethylene and one or more alpha-olefins having a density of less than 0.916 gram per cubic centimeter, a melt index of at least about 4 grams per 10 minutes, and a polydispersity greater than about 4.0, and (B) optionally, an organic peroxide; and

(ii) co-extruding said formulations around the conductive medium at a temperature no higher than about 160 degrees C.

2. The process defined in claim 1 wherein the homogeneous polyethylene is made with a metallocene catalyst.

3. The process defined in claim 2 wherein the homogeneous polyethylene is a copolymer of ethylene, one or more alpha-olefins, each having 3 to 8 carbon atoms, and, optionally, a diene, and has a melt index in the range of about 0.5 to about 30 grams per 10 minutes.

4. The process defined in claim 1 wherein the outer layer polymer is a copolymer of ethylene and vinyl acetate or a methyl or ethyl acrylate or methacrylate wherein the unsaturated ester is present in an amount of about 15 to about 38 percent by weight based on the weight of the copolymer, or an ethylene homopolymer.

5. A process for the co-extrusion of an inner layer around a conductive medium and an outer layer around the inner layer comprising:

(i) introducing into an extruder adapted for profile co-extrusion, a preformed conductive medium;

an inner layer formulation comprising a homogeneous copolymer of ethylene, one or more alpha-olefins, each having 3 to 8 carbon atoms, and, optionally, a diene, said copolymer having been made with a metallocene catalyst, and having a polydispersity in the range of about 1.5 to about 3.5, an essentially uniform comonomer distribution, and a melt index in the range of about 0.5 to about 30 grams per 10 minutes, and an organic peroxide; and

an outer layer formulation comprising one of (a) a copolymer of ethylene and vinyl acetate or a methyl or ethyl acrylate or methacrylate wherein the unsaturated ester is present in an amount of about 15 to about 38 percent by weight based on the weight of the copolymer;

or (b) an ethylene homopolymer having a polydispersity greater than about 4.5 and a density of at least 0.916 gram per cubic centimeter, said polymer made by a high pressure process;

or (c) a heterogeneous copolymer of ethylene and one or more alpha-olefins, each alpha-olefin having 3 to 8 carbon atoms, said copolymer having a density of less than 0.916 gram per cubic centimeter, a melt index of at least about 4 grams per 10 minutes, and a polydispersity greater than about 4.5; and

(ii) co-extruding said formulations around the conductive medium at a temperature no higher than about 160 degrees C.

6. The process defined in claim 5 wherein the outer layer formulation contains an organic peroxide.