Process for making a semiconductor sensor with a fusion bonded flexible structure

• US 5,576,251 A
• Filed: 02/22/1995
• Issued: 11/19/1996
• Est. Priority Date: 10/06/1994
• Status: Expired due to Term

• Current Assignee: Kavlico Corporation (Sensata Technologies Holding Plc)
• Original Assignee: Kavlico Corporation (Sensata Technologies Holding Plc)
• Inventors: Ismail, M. Salleh, Garabedian, Raffi M., Pashby, Gary J., Wong, Jeffrey K. K.
• Primary Examiner(s): Kunemund, Robert
• Assistant Examiner(s): WHIPPLE, MATTHEW LAVERNE
• Application Number:
  US08/395,397
• Time in Patent Office: 636 Days
• Field of Search: 437/901, 437/927, 437/228, 437/239
• US Class Current: 438/53
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2203/036 Fusion bonding
• CPC Class Codes: B81C 2203/038 Bonding techniques not provided for in B81C2203/031 - B81C2203/037
• CPC Class Codes: G01B 7/14 for measuring distance or clearance between spaced objects or spaced apertures G01B7/30 takes precedence
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01L 9/0098 using semiconductor body comprising at least one PN junction as detecting element
• CPC Class Codes: G01P 15/124 by semiconductor devices comprising at least one PN junction, e.g. transistors
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure

Abstract

Fabrication of semiconductor devices with movable structures includes local oxidation of a wafer and oxide removal to form a depression in an elevated bonding surface. A second wafer is fusion bonded to the elevated bonding surface and shaped to form a flexible membrane. An alternative fabrication technique forms a spacer having a depression on a first wafer and active regions on a second wafer, and fusion bonds the wafers together with the depression over the active regions. Devices formed are integrable with standard MOS devices and include FETs, capacitors, and sensors with movable membranes. An FET sensor has gate and drain coupled together and a drain-source voltage which depends on the gate'"'"'s deflection. Selected operating current, channel length, and channel width provide a drain-source voltage linearly related to gate deflection. Alternatively, two transistors subjected to the same gate deflection provide a differential voltage related to the square root of the deflection if channel currents or channel widths differ. Transistors subjected to the different gate deflections provide a differential signal that cancels effects that are independent of deflection. A capacitive sensor includes a doped region underlying the center of a flexible membrane. The doped region is isolated from a surrounding region which is biased at the voltage of the membrane.

Claims

1. A process for making a semiconductor device containing a flexible structure, comprising the steps of:

oxidizing a portion of a surface of a first semiconductor substrate to form a first oxide region and leave an unoxidized region on the surface;

removing the first oxide region to form a depression in the first substrate; and

bonding a second substrate to the unoxidized region of the first substrate so that a portion of the second substrate overlies the depression.

2. The process of claim 1, further comprising forming a second semiconductor device in and on the first substrate.

3. The process of claim 2, wherein forming the second semiconductor device comprises forming a field effect transistor.

4. The process of claim 2, wherein forming the second semiconductor device comprises forming a bipolar transistor.

5. The process of claim 1, further comprising the step of forming an active region in the depression.

6. The process of claim 5 wherein forming the active region comprises forming a channel region for the semiconductor device, and the portion of the second substrate that overlies the depression forms a gate for the semiconductor device.

7. The process of claim 5, wherein the step of forming the active region is performed before the oxidizing step.

8. The process of claim 7, wherein the step of forming the active region further comprises the step of forming a doped region to a depth in the first substrate greater than a depth of the depression.

9. The process of claim 1, further comprising the step of shaping the second substrate to form a membrane over the depression.

10. The process of claim 1, where bonding comprises fusion bonding the second substrate to the first substrate.

11. A process for making a semiconductor device containing a flexible structure, the process comprising:

oxidizing a portion of a surface of a first semiconductor substrate to form a first oxide region and leave an unoxidized region on the surface, wherein the unoxidized region encompasses the first oxide region;

removing the first oxide region to form in the first substrate a depression which is encompassed by the unoxidized region;

oxidizing the surface of the first substrate to form a second oxide region encompassing the unoxidized region of the surface;

removing the second oxide region to leave a mesa containing the depression, on the surface of the first substrate;

forming an active region in a portion of the first substrate defined by the depression; and

fusion bonding a second substrate to the unoxidized region of the first substrate so that a portion of the second substrate overlies the depression.

12. The process of claim 11, wherein removing the second oxide region is performed before forming and removing the first oxide region.

13. The process of claim 11, further comprising the step of shaping the second substrate to define a flexible structure overlying the depression.

14. The process of claim 13, wherein:

the second substrate includes an etch stop layer;

the fusion bonding step bonds a first surface of the second substrate to the surface of the first substrate; and

shaping the second substrate comprises etching the second substrate to remove a portion of the second substrate between a second surface and the etch stop layer.

15. The process of claim 13, wherein the shaping step comprises:

oxidizing a portion of the second substrate; and

removing an oxide region formed during oxidation of the second substrate.

16. The process of claim 11, wherein the steps of oxidizing to form the first and second oxide regions are performed simultaneously.

17. The process of claim 16, further comprising the steps of:

oxidizing the first substrate to form an oxide region in a bottom surface of the depression; and

removing the oxide region to leave a bump on the bottom surface of the depression.

18. The process of claim 17, wherein the step of forming an active region comprises forming a channel region for the semiconductor device in the bump on the bottom surface of the depression.

19. The process of claim 11, further comprising forming an electronic device in and on a portion of the first substrate surrounding the mesa.

20. A process for making a semiconductor device containing a flexible structure, the process comprising:

oxidizing a portion of a surface of a first semiconductor substrate to form a first oxide region and leave an unoxidized region on the surface;

removing the first oxide region to form a depression in the first substrate;

bonding a second substrate to the unoxidized region of the first substrate so that a portion of the second substrate overlies the depression; and

shaping the second substrate to form a cantilever over the depression.

21. The process of claim 20, wherein the first oxidized region encompasses the unoxidized region.

22. The process of claim 21, further comprising the step of forming an active region in the depression.

23. A process for making a semiconductor device having a flexible structure, comprising:

shaping a first semiconductor substrate to form a depression in a first surface of the first semiconductor substrate;

forming an active region in a second semiconductor substrate;

bonding the first surface of the first substrate to the second substrate so that the depression overlies the active region; and

shaping a second surface of the first substrate to form a flexible structure over the active region.

24. The process of claim 23, wherein the step of shaping the second surface of the first substrate comprises the step of etching from the second surface to an etch stop layer in the first substrate.

25. The process of claim 24, wherein the step of shaping a second surface of the first substrate further comprises the step of masking the second surface to expose only portions of the first substrate to the etching step.

26. The process of claim 23, further comprising the steps of:

oxidizing a portion of the second semiconductor substrate to form an oxide region and an unoxidized region on the second semiconductor substrate;

removing the oxide region to form a depression in the second substrate, wherein after the bonding step the depression in the first semiconductor substrate overlies at least a portion of the depression in the second semiconductor substrate and at least a portion of the unoxidized region in the second semiconductor substrate.

27. The process of claim 23, further comprising the step of forming a second semiconductor device in and on the second substrate.

28. The process of claim 27, wherein the step of forming the second semiconductor device comprises forming a field effect transistor.

29. The process of claim 27, wherein the step of forming the second semiconductor device comprises forming a bipolar transistor.

30. A process for making a semiconductor device having a flexible structure, comprising:

etching a first substrate to form a mesa;

oxidizing the first substrate to form an oxide region on the mesa;

removing the oxide region to form the depression in the mesa;

forming an active region in a second semiconductor substrate;

fusion bonding the first substrate to the second substrate so that the depression overlies the active region; and

shaping a second surface of the first substrate to form a flexible structure over the active region.

31. The process of claim 30, further comprising the step of forming a source and a drain in the second substrate, wherein the step of forming the active region comprises forming a channel between the source and the drain.

32. A process for making a semiconductor device containing a flexible structure, the process comprising:

shaping a first semiconductor substrate to form a mesa and a depression in a top surface of the mesa, wherein the top surface of the mesa is elevated relative to a surface that surrounds the mesa;

forming an active region in a portion of the first semiconductor substrate defined by the depression; and

bonding a second substrate to the top surface of the mesa so that a portion of the second substrate overlies the active region.

33. The process of claim 32, further comprising forming a second semiconductor device in and on the surface which surrounds the mesa.

34. The process of claim 32, further comprising shaping the second substrate to define a flexible structure overlying the depression.

35. The process of claim 32, where bonding comprises fusion bonding the second substrate to the first substrate.