Complementary LVTSCR ESD protection circuit for sub-micron CMOS integrated circuits

• US 5,576,557 A
• Filed: 04/14/1995
• Issued: 11/19/1996
• Est. Priority Date: 04/14/1995
• Status: Expired due to Term

• Current Assignee: United Microelectronics Corporation
• Original Assignee: United Microelectronics Corporation
• Inventors: Lee, Chung-Yuan, Ker, Ming-Dou, Wu, Chung-Yu, Chang, Hun-Hsien, Ko, Joe
• Primary Examiner(s): Jackson, Jerome
• Assistant Examiner(s): GUAY, JOHN FRANCIS
• Application Number:
  US08/422,225
• Time in Patent Office: 585 Days
• Field of Search: 257/173, 257/175, 257/141, 257/146, 257/157, 257/362, 257/361, 361/90, 361/100, 361/111, 327/582
• US Class Current: 257/173
• CPC Class Codes: H01L 27/0251 for MOS devices
• CPC Class Codes: H01L 27/0259 using bipolar transistors as protective elements

Abstract

An electrostatic discharge (ESD) circuit for protecting a semiconductor integrated circuit (IC) device is disclosed. One ESD circuit is located between each I/O buffering pad that connects to one lead pin and the internal circuitry of IC. The ESD circuit is connected to both power terminals. The ESD circuit comprises first and second low-voltage-trigger SCRs (LVTSCRs), each having an anode, a cathode, an anode gate and a cathode gate. The anode and anode gate of the first SCR are connected to a first power terminal, the cathode of the first SCR is connected to its I/O buffering pad, and the cathode gate of the first SCR is connected to the second power terminal. The ESD circuit further comprises a PMOS transistor having drain, source, gate, and bulk terminals. The PMOS transistor'"'"'s gate, source and bulk terminals are connected to the first power terminal, the PMOS transistor drain terminal is connected to the cathode gate of the first SCR. The cathode and cathode gate of the second SCR are connected to the second power terminals. The anode of the second SCR is connected to its associated I/O buffering pads. The anode gate of the second SCR is connected to the first power terminal. The ESD circuit also comprises an NMOS transistor having drain, source, gate, and bulk terminals. The NMOS transistor'"'"'s gate, source and bulk terminals are connected to the second power terminals. The NMOS transistor'"'"'s drain terminal is connected to the anode gate of the second SCR.

Claims

1. A circuit arrangement for electrostatic discharge protection of a semiconductor integrated circuit (IC) device, one said circuit being located between each I/O buffering pad that connects to one lead pin with internal circuitry of said IC, said circuit arrangement being connected to both of a pair of power terminals and a conductor connecting said I/O buffering pad and said internal circuitry, said circuit arrangement comprising:

a first SCR having an anode, a cathode, an anode gate and a cathode gate, said anode and anode gate of said first SCR being connected to the first of said pair of power terminals, said cathode of said first SCR being connected to its associated buffering pad, and said cathode gate of said first SCR being connected to the second of said pair of power terminals;

a PMOS transistor having drain, source, gate, and bulk terminals, said gate, source and bulk terminals of said PMOS transistor being connected to the first of said pair of power terminals, said drain terminal of said PMOS transistor being connected to said cathode gate of said first SCR;

a second SCR having an anode, a cathode, an anode gate and a cathode gate, said cathode and cathode gate of said second SCR being connected to the second of said pair of power terminals, said anode of said second SCR being connected to its associated I/O buffering pad, and said anode gate of said second SCR being connected to the first of said pair of power terminals; and

an NMOS transistor having drain, source, gate, and bulk terminals, said gate, source and bulk terminals of said NMOS transistor being connected to the second of said pair of power terminals, said drain terminal of said NMOS transistor being connected to said anode gate of said second SCR.

2. A circuit arrangement according to claim 1,

wherein said first SCR comprises a first PNP bipolar junction transistor and a first NPN bipolar junction transistor,

each of said first PNP and NPN bipolar junction transistors having a collector, a base and an emitter terminal,

the base of said first PNP transistor and the collector of said first NPN transistor being connected together to form said anode gate of said first SCR,

the collector of said first PNP transistor and the base of said first NPN transistor being connected together to form said cathode gate of said first SCR,

the emitter of said first PNP transistor forming said anode of said first SCR, and

the emitter of said first NPN transistor forming said cathode of said first SCR.

3. A circuit arrangement according to claim 2, wherein a base-emitter junction of said first NPN bipolar junction transistor forms a first equivalent diode.

4. A circuit arrangement according to claim 1,

wherein said second SCR comprises a second PNP bipolar junction transistor and a second NPN bipolar junction transistor,

each of said second PNP and NPN bipolar junction transistors having a collector, a base and an emitter terminal,

the base of said second PNP transistor and the collector of said second NPN transistor being connected together to form said anode gate of said second SCR,

the collector of said second PNP transistor and the base of said second NPN transistor being connected together to form said cathode gate of said first SCR,

the emitter of said second PNP transistor forming said anode of said second SCR, and

the emitter of said second NPN transistor forming said cathode of said second SCR.

5. A circuit arrangement according to claim 4 wherein a emitter-base junction of said second PNP bipolar junction transistor forms a second equivalent diode.

6. A circuit arrangement according to claim 1, wherein said circuit arrangement is fabricated on a semiconductor substrate of a first conductivity type, said semiconductor substrate comprising:

a pair of neighboring first and second well regions and another pair of neighboring third and fourth well regions formed on said substrate, wherein said four well regions are doped with impurities of a second conductivity type;

a first heavily-doped region of the first conductivity type formed in said first well region, a second heavily-doped region of the first conductivity type formed in the boundary of said first well region and said substrate, and a third heavily-doped region of the first conductivity type formed in said third well region;

a first heavily-doped region of the second conductivity type formed in the side of said third well region and extending toward said fourth well region and into said substrate, and a second heavily-doped region of the second conductivity type formed in said fourth well region and extending toward said third well region and into said substrate;

a first thin oxide layer formed on said first well region between said first heavily-doped region of the first conductivity type and the second heavily-doped region of the first conductivity type, and a first gate oxide layer formed on said first thin oxide layer; and

a second thin oxide layer formed on said substrate between said first heavily-doped region of the second conductivity type and the second heavily-doped region of the second conductivity type, and a second gate polycrystalline layer formed on said second thin oxide layer.

7. A circuit arrangement according to claim 6, wherein said first heavily-doped region of the first conductivity type, said first well region of the second conductivity type, and said substrate of the first conductivity type form the emitter, base and collector of a bipolar junction transistor, respectively.

8. A circuit arrangement according to claim 6, wherein said second well region of the second conductivity type, said substrate and said first well region of the second conductivity type form the emitter, base and collector of a bipolar junction transistor, respectively.

9. A circuit arrangement according to claim 6, wherein said first heavily-doped region of the first conductivity type, said second heavily-doped region of the first conductivity type, said first gate oxide layer and said first well region of the second conductivity type form the source, drain, gate and bulk terminals of a MOS transistor respectively.

10. A circuit arrangement according to claim 6, wherein said third heavily-doped region of the first conductivity type, said third well region of the second conductivity type and said substrate of the first conductivity type form the emitter, base and collector of a bipolar junction transistor respectively.

11. A circuit arrangement according to claim 6, wherein said fourth well region of the second conductivity type, said substrate and said third well region of the second conductivity type forming the emitter, base and collector of a bipolar junction transistor respectively.

12. A circuit arrangement according to claim 6, wherein said first heavily-doped region of the second conductivity type, said second heavily-doped region of the second conductivity type, said second gate oxide layer and said substrate form the drain, source, gate and bulk terminals of a MOS transistor respectively.

13. A circuit arrangement according to claim 6, wherein said first conductivity type is P-type and said second conductivity type is N-type.

14. A circuit arrangement according to claim 6, wherein said first conductivity type is N-type and said second conductivity type is P-type.