Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board

• US 5,576,934 A
• Filed: 12/09/1995
• Issued: 11/19/1996
• Est. Priority Date: 07/09/1992
• Status: Expired due to Fees

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Goebels, Ulrich, Roethlingshoefer, Walter
• Primary Examiner(s): Sparks, Donald A.
• Application Number:
  US08/367,181
• Time in Patent Office: 346 Days
• Field of Search: 174/51, 174/250, 174/252, 174/255, 174/256, 174/257, 174/258, 174/259, 174/260, 174/261, 257/705, 257/709, 257/710, 257/711, 257/712, 257/717, 257/723, 257/724, 257/728, 333/246, 333/247, 361/767, 361/770, 361/771, 361/782, 361/783, 361/705, 361/761, 361/792-795, 361/719-721, 361/763, 361/764, 439/68, 439/485, 428/209, 428/901
• US Class Current: 361/761
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01034 Selenium [Se]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H05K 1/021 : Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/182 : associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 3/328 : by welding
• CPC Class Codes: H05K 3/4084 : by deforming at least one of the conductive layers

Abstract

A mounting unit for a multilayer hybrid circuit having power components provides improved heat dissipation from the power components. The mounting unit includes a thermally conductive substrate board on which the multilayer hybrid circuit is mounted, the substrate board including a ceramic board that is coated with copper film.

Claims

1. A mounting unit for a multilayer hybrid circuit having at least one integrated circuit semiconductor power component, comprising:

a substrate board, having a thickness in the range of 0.3 mm to 2.0 mm, including a ceramic center board, the center board being coated on a first side and a second side with a copper film, at least one recess portion being formed in the center board between the first side and the second side,

wherein the at least one recess portion receives the at least one integrated circuit semiconductor power component, and the copper film conforms to a chip thickness of the at least one integrated semiconductor power component.

2. The mounting unit according to claim 1, wherein the multilayer hybrid circuit is bonded to the substrate board, the at least one integrated circuit semiconductor power component being arranged on a side of the multilayer hybrid circuit facing towards the substrate board.

3. The mounting unit according to claim 2, wherein the multilayer hybrid circuit is bonded to the substrate board via a heat-conductive paste.

4. The mounting unit according to claim 1, wherein the copper film includes a conductor track pattern.

5. The mounting unit according to claim 1, wherein the copper film includes a lead frame portion for providing an electrical connection.