Polymeric polishing pad containing hollow polymeric microelements

• US 5,578,362 A
• Filed: 07/12/1994
• Issued: 11/26/1996
• Est. Priority Date: 08/19/1992
• Status: Expired due to Term

• Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
• Original Assignee: Rodel Incorporated (Dow, Inc.)
• Inventors: McClain, Harry G., Roberts, John V. H., Reinhardt, Heinz F., Budinger, William D., Jensen, Elmer W.
• Primary Examiner(s): Watkins, III, William P.
• Application Number:
  US08/274,134
• Time in Patent Office: 868 Days
• Field of Search: 428/141, 428/143, 428/147, 428/323, 428/327, 428/402, 428/423.1, 428/425.1, 428/313.5, 428/305.5, 428/332, 428/338, 428/220, 428/152, 428/163, 428/167, 428/156 , 428/168, 428/908.8, 51/296, 51/298, 51/302, 51/303, 437/225, 437/228, 437/946, 437/974, 451/527, 451/530
• US Class Current: 428/147
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved
• CPC Class Codes: B24B 53/00 Devices or means for dressing or conditioning abrasive surfaces compensation for grinding wheel abrasion resulting from dressing B24B47/25
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24D 3/28 Resins or natural or synthetic macromolecular compounds B24D3/22 takes precedence
• CPC Class Codes: B24D 3/32 for porous or cellular structure
• CPC Class Codes: B29C 70/58 comprising fillers only , e.g. particles, powder, beads, flakes, spheres B29C70/025 takes precedence, agglomerating hollow spheres to produce synthetic foam B29C70/66; compounding ingredients per se C08K
• CPC Class Codes: B29C 70/66 the filler comprising hollow constituents, e.g. syntactic foam
• CPC Class Codes: B29L 2031/736 Grinding or polishing equipment
• CPC Class Codes: Y10S 438/959 Mechanical polishing of wafer
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/24372 Particulate matter
• CPC Class Codes: Y10T 428/24405 Polymer or resin [e.g., natural or synthetic rubber, etc.]
• CPC Class Codes: Y10T 428/24446 Wrinkled, creased, crinkled or creped
• CPC Class Codes: Y10T 428/24479 including variation in thickness
• CPC Class Codes: Y10T 428/24537 Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/2457 Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/24579 with particulate matter
• CPC Class Codes: Y10T 428/249924 Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
• CPC Class Codes: Y10T 428/249954 With chemically effective material or specified gas other than air, N, or carbon dioxide in void-containing component
• CPC Class Codes: Y10T 428/249972 Resin or rubber element
• CPC Class Codes: Y10T 428/25 : Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/254 : Polymeric or resinous material
• CPC Class Codes: Y10T 428/26 : Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• CPC Class Codes: Y10T 428/268 : Monolayer with structurally defined element
• CPC Class Codes: Y10T 428/2982 : Particulate matter [e.g., sphere, flake, etc.]
• CPC Class Codes: Y10T 428/31551 : Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
• CPC Class Codes: Y10T 428/31591 : Next to cellulosic

Abstract

The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface. The present invention also includes methods for decreasing the effective rigidity of polymeric microelements at the work surface of the article, regenerating the work surface of the article and planarizing a surface of a semiconductor device utilizing the article.

Claims

1. A polishing pad for polishing or planarizing a surface of an electronic substrate, said pad comprising a polymeric matrix impregnated with a plurality of hollow, flexible, organic polymeric microelements, said pad having a work surface and a subsurface proximate to said work surface, one portion of said polymeric microelements being at said work surface and exposed to a working environment including a polishing slurry, another portion of said polymeric microelements being embedded within said subsurface of said pad that is not exposed to said working environment, said work surface of said pad is relatively softer than said subsurface as a result of said exposure of said one portion of said polymeric microelements at said work surface to said working environment, and said subsurface becomes said relatively softer work surface during wear of said pad when said polymeric microelements are exposed to said working environment.

2. A pad according to claim 1, wherein said polymeric microelements are substantially uniformly distributed throughout said polymeric matrix.

3. A pad according to claim 1, wherein said polymeric matrix comprises a urethane polymer.

4. A pad according to claim 1, wherein at least a portion of said polymeric microelements located at said work surface soften upon exposure to said working environment.

5. A pad according to claim 1, wherein at least a portion of said polymeric microelements located at said work surface swell upon exposure to said working environment.

6. A pad according to claim 1, wherein at least some of said polymeric microelements contain a plurality of void spaces therein.

7. A pad according to claim 1, wherein said hollow polymeric microelements contain a gas at a pressure greater than atmospheric pressure.

8. A pad according to claim 1, wherein said polymeric microelements have a mean diameter less than about 150 μ

m.

9. A pad according to claim 8, wherein said mean diameter of said polymeric microelements is about 10 μ

m.

10. A pad according to claim 1, wherein said polymeric microelements are spaced apart by about 1 μ

m to about 100 μ

m.

11. A pad according to claim 1, wherein at least some of said polymeric microelements are generally spherical in shape.

12. A pad according to claim 1, wherein at least some of said polymeric microelements have permeable shells so that said hollow microelements may be rendered open to said working environment.

13. An article according to claim 1, wherein said polymeric microelements comprise at least one material selected from the group consisting of polyvinyl alcohol, pectin, polyvinyl pyrrolidone, hydroxyethylcellulose, methylcellulose, hydropropylmethylcellulose, carboxymethylcellulose, hydroxypropylcellulose, polyacrylic acids, polyacrylamide, polyethylene glycol, polyhydroxyetheracrylite, starch, maleic acid copolymer, polyethylene oxide, and polyurethane.

14. A pad according to claim 1, wherein said work surface is about 5 μ

m to about 60 μ

m thick.

15. A pad according to claim 1, wherein said work surface further comprises a microtexture integral with said pad, said microtexture including an artifact having a width less than about 1000 μ

m.

16. A pad according to claim 1, wherein said work surface further comprises a minitexture integral with said pad, said minitexture including an artifact having a width of about 1000 μ

m to about 5 mm.

17. A pad according to claim 1, wherein said work surface further comprises a macrotexture integral with said pad, said macrotexture including an artifact having a width greater than about 5 mm.

18. A pad according to claim 1, wherein said work surface further comprises a texture integral with said pad, said texture including a plurality of artifacts, each of said artifacts being spaced apart of about 0.1 mm to about 10 mm and having a depth of about 1 mm to about 10 mm.

19. A pad according to claim 1, wherein said work surface further comprises a texture integral with said pad, said texture including an artifact having a length in a first dimension less than about 1000 times a mean diameter of said polymeric microelements.

20. A pad according to claim 1, wherein said work surface further comprises a texture integral with said pad, said texture including an artifact having a depth less than about 2000 times a mean diameter of said polymeric microelements.

21. A polishing pad for polishing or planarizing a surface of an electronic substrate, said pad comprising a polymeric matrix impregnated with a plurality of hollow, flexible, organic polymeric microelements, said pad having a texturized work surface and a subsurface proximate to said work surface, one portion of said polymeric microelements being at said work surface and exposed to a working environment including a polishing slurry, another portion of said polymeric microelements being embedded within said subsurface of said pad that is not exposed to said working environment, said texturized work surface of said pad is relatively softer than said subsurface as a result of said exposure of said one portion of said polymeric microelements at said work surface to said working environment, and said subsurface becomes said relatively softer work surface during wear of said pad when said polymeric microelements are exposed to said working environment.