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Polymeric polishing pad containing hollow polymeric microelements

  • US 5,578,362 A
  • Filed: 07/12/1994
  • Issued: 11/26/1996
  • Est. Priority Date: 08/19/1992
  • Status: Expired due to Term
First Claim
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1. A polishing pad for polishing or planarizing a surface of an electronic substrate, said pad comprising a polymeric matrix impregnated with a plurality of hollow, flexible, organic polymeric microelements, said pad having a work surface and a subsurface proximate to said work surface, one portion of said polymeric microelements being at said work surface and exposed to a working environment including a polishing slurry, another portion of said polymeric microelements being embedded within said subsurface of said pad that is not exposed to said working environment, said work surface of said pad is relatively softer than said subsurface as a result of said exposure of said one portion of said polymeric microelements at said work surface to said working environment, and said subsurface becomes said relatively softer work surface during wear of said pad when said polymeric microelements are exposed to said working environment.

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