Soldering/desoldering nozzles for SMD's

• US 5,579,979 A
• Filed: 03/16/1994
• Issued: 12/03/1996
• Est. Priority Date: 03/29/1993
• Status: Expired due to Term

• Current Assignee: Cooper Brands, Inc.
• Original Assignee: Cooper Industries, Inc. (Eaton Corporation PLC.)
• Inventors: Kurpiela, Gerhard
• Primary Examiner(s): Elpel, J.
• Application Number:
  US08/213,763
• Time in Patent Office: 993 Days
• Field of Search: 228/51, 228/264, 228/6.2, 228/180.21, 228/213
• US Class Current: 228/6.2
• CPC Class Codes: B23K 1/012 Soldering with the use of hot gas

Abstract

An apparatus for soldering/unsoldering SMD components comprising a heating nozzle which both permits direct heating of the component by contact with a hot nozzle bottom and directs a stream of hot gas onto the leads of the components. The nozzle bottom is preferably made of highly thermoconductive material and the hot gas stream is directed onto the leads by means of at least one outlet slot in the nozzle bottom adjacent the nozzle wall. The nozzle further comprises a centered suction means for positioning/removing the component.

Claims

1. A heating nozzle for soldering or unsoldering integrated circuits comprising:

a nozzle housing having an inlet port in fluid communication with an outlet port;

a heatable nozzle bottom disposed in the area of said outlet port and subjected to a stream of hot gas guided through the nozzle; and

a centrally disposed suction means in communication with said nozzle bottom and having at least one suction port extending through the nozzle bottom, said suction port having at least one replaceable suction insert sleeve having an upper edge that protrudes just beyond said nozzle bottom,

said nozzle heating a soldering joint by contact heat in addition to the hot gas of the nozzle.

2. A heating nozzle for soldering or unsoldering an integrated circuit comprising:

a nozzle housing having an inlet port in fluid communication with an outlet port and

a heatable nozzle bottom disposed in the area of said outlet port and directly subjected to a stream of hot gas guided through the nozzle, whereby solder is melted by heat transferred from the nozzle bottom to the top of a component to be soldered or unsoldered, as well as by hot gas flowing onto the component'"'"'s leads, said housing having a substantially rectangular outlet cross-section, the cross-sectional area of said inlet port being smaller than the cross-sectional area of said outlet port.

3. A heating nozzle for soldering or unsoldering an integrated circuit comprising:

a nozzle housing having a inlet port in fluid communication with an outlet port and

a heatable nozzle bottom disposed in the area of said outlet port and directly subjected to a stream of hot gas guided through the nozzle, whereby solder is melted by heat transferred from the nozzle bottom to the top of a component to be soldered or unsoldered, as well as by hot gas flowing onto the component'"'"'s leads; and

a centrally disused suction means and a tubular connecting piece attached to the inlet port, said connecting piece comprising a centering slot extending from the upper edge of said connecting piece.

4. A heating nozzle for soldering or unsoldering an integrated circuit comprising:

a nozzle housing having an inlet port in fluid communication with an outlet port and

a heatable nozzle bottom disposed in the area of said outlet port and directly subjected to a stream of hot gas guided through the nozzle, whereby solder is melted by heat transferred from the nozzle bottom to the top of a component to be soldered or unsoldered, as well as by hot gas flowing onto the component'"'"'s leads, said nozzle bottom being made of a thermoconducting material.

5. A heating nozzle for soldering or unsoldering an integrated circuit comprising:

a nozzle housing having an inlet port in fluid communication with an outlet port;

a heatable nozzle bottom disposed in the area of said outlet port and directly subjected to a stream of hot gas guided through the nozzle, whereby solder is melted by heat transferred from the nozzle bottom to the top of a component to be soldered or unsoldered, as well as by hot gas flowing onto the component'"'"'s leads; and

a centrally disposed suction means in communication with said nozzle bottom, said suction means comprising at least one suction port extending through the nozzle bottom and a suction connector extending through said inlet port, said suction port being in communication with said suction connector and having a cross-section that tapers toward said suction connector.

6. The nozzle of claim 5 wherein said suction means is detachably connected to the nozzle bottom.

7. The nozzle of claim 5 wherein said suction port comprises at least one replaceable insert sleeve having a flared end protruding through said nozzle bottom such that said nozzle bottom directly contacts the top of a component to be soldered or unsoldered.

8. The nozzle of claim 5 wherein said suction port comprises at least one replaceable insert sleeve having a flared end protruding through and slightly beyond said nozzle bottom whereby said insert flared end contacts the top of a component to be soldered or unsoldered.