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Soldering/desoldering nozzles for SMD's

  • US 5,579,979 A
  • Filed: 03/16/1994
  • Issued: 12/03/1996
  • Est. Priority Date: 03/29/1993
  • Status: Expired due to Term
First Claim
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1. A heating nozzle for soldering or unsoldering integrated circuits comprising:

  • a nozzle housing having an inlet port in fluid communication with an outlet port;

    a heatable nozzle bottom disposed in the area of said outlet port and subjected to a stream of hot gas guided through the nozzle; and

    a centrally disposed suction means in communication with said nozzle bottom and having at least one suction port extending through the nozzle bottom, said suction port having at least one replaceable suction insert sleeve having an upper edge that protrudes just beyond said nozzle bottom,said nozzle heating a soldering joint by contact heat in addition to the hot gas of the nozzle.

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