Contact stepper printed lithography method

• US 5,580,687 A
• Filed: 06/07/1995
• Issued: 12/03/1996
• Est. Priority Date: 04/08/1992
• Status: Expired due to Term

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: ELM TECHNOLOGY CORPORATION
• Inventors: Leedy, Glenn J.
• Primary Examiner(s): ROSASCO, STEPHEN D
• Application Number:
  US08/478,476
• Time in Patent Office: 545 Days
• Field of Search: 430/5, 430/311, 430/312, 430/313
• US Class Current: 430/5
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/136281 having a transmissive semiconductor substrate
• CPC Class Codes: G03F 7/70658 Electrical testing
• CPC Class Codes: G11C 29/006 at wafer scale level, i.e. wafer scale integration [WSI]
• CPC Class Codes: H01L 21/762 Dielectric regions , e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
• CPC Class Codes: H01L 21/76264 SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
• CPC Class Codes: H01L 21/76289 Lateral isolation by air gap
• CPC Class Codes: H01L 21/764 Air gaps H01L21/76264 takes precedence
• CPC Class Codes: H01L 21/8221 Three dimensional integrated circuits stacked in different levels
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13009 Bump connector integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/80001 by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
• CPC Class Codes: H01L 23/538 the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866
• CPC Class Codes: H01L 23/5381 Crossover interconnections, e.g. bridge stepovers
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5386 Geometry or layout of the interconnection structure
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/0207 : Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15312 : being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10S 148/135 : Removal of substrate
• CPC Class Codes: Y10S 438/928 : Front and rear surface processing
• CPC Class Codes: Y10S 438/938 : Lattice strain control or utilization
• CPC Class Codes: Y10S 438/942 : Masking
• CPC Class Codes: Y10S 438/967 : Semiconductor on specified insulator
• CPC Class Codes: Y10S 438/977 : Thinning or removal of substrate
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49162 : by using wire as conductive path
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49171 : with encapsulating
• CPC Class Codes: Y10T 29/4921 : with bonding

Abstract

General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as support and electrical interconnect for conventional integrated circuit die bonded thereto, with the interconnect formed in multiple layers in the membrane. Multiple die can be connected to one such membrane, which is then packaged as a multi-chip module. Other applications are based on (circuit) membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.

Claims

1. A contact stepper printed lithography method comprising:

providing a mask structure formed of a flexible membrane;

bringing the mask structure within a predetermined distance adjacent to a first portion of a substrate to be patterned;

exposing the first portion of the substrate to a source of radiation propagating through the mask structure;

moving the mask structure within a predetermined distance adjacent to a second portion of the substrate; and

exposing the second portion to the source of radiation propagating through the mask structure.

2. The method of claim 1, wherein the predetermined distance is zero.

3. The method of claim 1, further comprising the steps of:

providing a first conductive coil pattern on a surface of the substrate;

applying electrical current to the first coil pattern;

providing a second conductive coil pattern on a surface of the mask structure capable of sensing an electro-magnetic field; and

aligning the mask structure to the substrate by sensing an electro-magnetic field generated by the first coil pattern in the second coil pattern.

4. The method of claim 3, further comprising:

providing piezoelectric motion control for aligning the substrate relative to the mask structure in response to the sensed electro-magnetic field.

5. The method of claim 1, wherein the step of bringing the mask structure within a predetermined distance adjacent to the substrate further comprises the step of providing pressure against a backside of the mask structure.

6. The method of claim 5, wherein the pressure applied is less than 100 g/cm².

7. The method of claim 1, wherein the membrane is formed of dielectric material.

8. The method of claim 7, wherein a fixed photonic mask is formed on the membrane.

9. The method of claim 8, wherein the fixed photonic mask is one of an optical mask, an X-ray mask, and a stencil mask.

10. The method of claim 1, wherein the mask structure further comprises a cell array of radiation sources coupled to the membrane.

11. The method of claim 10, wherein the cell array is one of a Source-Integrated-Light-Valve, a Source-External-Particle-Valve, and a Mechanical-Light-Valve.

12. The method of claim 1, wherein the membrane has a thickness of less than 50 μ

m.

13. The method of claim 1, wherein the mask structure comprises a dielectric layer adjacent to a layer of semiconductor material in which is formed circuit devices.

14. A method of forming a lithographic fixed mask comprising the steps of:

providing a membrane including a semiconductor layer on a first low stress dielectric layer;

forming a metal layer on the semiconductor layer;

patterning the metal layer, thereby removing portions thereof;

selectively etching portions of the semiconductor layer underlying the removed portions of the metal layer;

depositing a second low stress dielectric layer over the patterned semiconductor layer; and

removing the first low stress dielectric layer.

15. A method of forming a fixed stencil lithographic mask comprising the steps of:

providing a membrane including a semiconductor layer on a low stress dielectric layer;

patterning the dielectric layer by etching away portions thereof; and

patterning the semiconductor layer by etching away portions thereof.

16. The method of claim 15, wherein the semiconductor layer is patterned by selective wet-etching.