Embeddable device for contactless interrogation of sensors for smart structures
First Claim
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1. Sensing device for a sensor embeddable in a structure, said sensing device comprising:
- an insulative substrate, a circuit pattern disposed on said substrate for interconnecting a number of electronic components, said circuit pattern comprising an inductive coil, said coil comprising a plurality of windings disposed on one surface of said substrate and a plurality of windings disposed on another surface of said substrate, said substrate having pads for disposing said number of electronic components on said substrate and coupling the device to the sensor.
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Abstract
Sensing device for a sensor embeddable in a structure comprising: an insulative substrate, a circuit pattern disposed on the substrate for interconnecting a plurality of electronic components, the circuit pattern comprising an inductive coil, the circuit pattern including pads for disposing components on the substrate and coupling the device to the sensor.
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Citations
23 Claims
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1. Sensing device for a sensor embeddable in a structure, said sensing device comprising:
- an insulative substrate, a circuit pattern disposed on said substrate for interconnecting a number of electronic components, said circuit pattern comprising an inductive coil, said coil comprising a plurality of windings disposed on one surface of said substrate and a plurality of windings disposed on another surface of said substrate, said substrate having pads for disposing said number of electronic components on said substrate and coupling the device to the sensor.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. Sensing device for a sensor embeddable in a structure, said sensing device comprising:
- first and second insulative substrates, a circuit pattern disposed on said first substrate for interconnecting a number of electronic components, said circuit pattern comprising an inductive coil, said first substrate having pads for disposing said number of electronic components on said substrate and coupling the device to the sensor, said second substrate having a second coil disposed thereon that is magnetically alignable with said first coil by overlaying said first and second substrates.
- View Dependent Claims (10, 11, 12)
- 13. Apparatus for contactless interrogation of a sensor embeddable in a structure comprising a pair of substrates, circuit patterns respectively disposed on said substrates, each of said circuit patterns comprising a multiturn coil, said coils being of substantially identical configuration and concentrically overlayed during use to magnetically couple said coils, at least one of said substrates including surface mounted components comprising a resonant circuit connected to the sensor, said sensor connectable circuit substrate being embeddable in the structure.
Specification