Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

• US 5,582,858 A
• Filed: 06/07/1995
• Issued: 12/10/1996
• Est. Priority Date: 10/07/1991
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Purushothaman, Sampath, Lee, Kang-Wook, Ritsko, John J., Adamopoulos, Eleftherios, Walker, George F., O'Toole, Terrence R., Shaw, Jane M., Viehbeck, Alfred, Oh, Tae S., Kim, Jungihl
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): CAMERON, ERMA C
• Application Number:
  US08/474,985
• Time in Patent Office: 552 Days
• Field of Search: 427/96, 427/208.8, 427/409
• US Class Current: 156/281
• CPC Class Codes: C08G 73/1003 Preparatory processes
• CPC Class Codes: C08G 73/1007 from tetracarboxylic acids or derivatives and diamines
• CPC Class Codes: C08G 73/101 containing chain terminating or branching agents
• CPC Class Codes: C08G 73/1089 Polyisoimides
• CPC Class Codes: H01B 3/306 Polyimides or polyesterimides
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31721 Of polyimide

Abstract

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.

In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.

A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

Claims

1. A process for manufacturing a multilayer article of manufacture comprising:

combining a substrate with a terminally unsaturated adhesive polyimide having the structure;

##STR6## wherein I is selected from the group consisting of an imide, isoimide, amic acid and an ester of said amic acid with an organo hydroxy compound having from one to six carbon atoms, and wherein I is based on a condensation product of a cyclic tetracarboxylic acid anhydride and a cyclic diamine, wherein said cyclic diamine is substituted completely or partially with an unsaturated heterocyclic diamine, a diamino organo phosphine, or a mixture thereof,

n is from about one to about 100,

R₁ is an imide of an amino organo phosphine, an imide of an unsaturated heterocyclic amine or an imide of an unsaturated heterocyclic dicarboxylic acid,

R₂ is R₁, an imide of an acetylene amine or an imide of a vinyl amine; and

adhering a surface of said adhesive polyimide opposite said substrate to a polyimide.

2. The process of claim 1 comprising applying at least a plasma or a silane coupling agent to said substrate on which said adhesive polyimide is applied or to the surface of said adhesive polyimide, so that said substrate has adhered one set or a plurality of alternating layers of said adhesive polyimide and said polyimide.

3. The process of claim 2 where said silane coupling agent contains a Si--O-alkyl group and said plasma comprises a plasma based on oxygen, nitroso oxide or argon.

4. The process of claim 2 where at least one said adhesive polyimide is adhered to an electrical circuit component, as said substrate.

5. The process of claim 4 where said circuit component comprises an integrated circuit.

6. The process of claim 4 where said circuit component comprises means for forming electrical connections in an electrical circuit.

7. The process of claim 6 where said electrical circuit component comprises a wiring network in a ceramic substrate or a polymer dielectric based electronic structure.

8. The process of claim 2 where said adhesive polyimide comprises the condensation product of benzophenone tetracarboxylic acid dianhydride (BTDA) and 1,3-bis(aminophenoxy)benzene (APB) or bis(phenylene dicarboxylic acid)dianhydride (BPDA) and oxydianiline (ODA) with an acetylene amine or a vinyl amine so that said adhesive polyimide has acetylene or vinyl end groups.

9. The process of claim 8 where said adhesive polyimide is made from a terminally unsaturated polyisoimide from about 0.1 μ

m to about 5 μ

m in thickness.

10. The process of claim 9 where said adhesive polyimide is a completely imidized terminally unsaturated polyimide from about 0.1 μ

m to about 5 μ

in thickness.

11. The process of claim 8 where said adhesive polyimide is made from a terminally unsaturated polyamic ester from about 0.1 μ

m to about 5 μ

m in thickness.

12. The process of claim 8 where at least one said adhesive polyimide is bonded to an electrical circuit comprising an integrated circuit and said adhesive polyimide is from about 0.1 μ

m to about 5.0 μ

m in thickness.

13. The process of claim 2 where said substrate is a metal and said combining is effected by coating said metal on said adhesive polyimide.

14. The process of claim 2 where said substrate is a metal and said combining is effected by coating said adhesive polyimide on said metal.