Micromechanical apparatus with limited actuation bandwidth

• US 5,583,290 A
• Filed: 12/20/1994
• Issued: 12/10/1996
• Est. Priority Date: 12/20/1994
• Status: Expired due to Term

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Lewis, Stephen R.
• Primary Examiner(s): Williams, Hezron E.
• Assistant Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US08/359,520
• Time in Patent Office: 721 Days
• Field of Search: 73/517 B, 73/517 R, 73/862.61, 73/701, 73/1 D, 73/1 DV, 73/514.18, 73/514.32, 324/661, 324/662, 324/678, 361/280, 361/283.1
• US Class Current: 73/514.18
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/131 with electrostatic counterbalancing means
• CPC Class Codes: G01P 21/00 Testing or calibrating of apparatus or devices covered by the preceding groups

Abstract

A micromechanical sensing apparatus includes a micromechanical sensor having a stationary element and a movable element which are electrically conductive, and a sensing circuit responsive to the micromechanical sensor for generating an output indicative of a sensed quantity. The sensing circuit may have a closed loop configuration or an open loop configuration. The sensing apparatus further includes an actuation circuit for applying to the micromechanical sensor an actuation signal, such as a test signal, for electrostatically deflecting the movable element relative to stationary element. The actuation circuit includes circuitry for limiting the bandwidth of the actuation signal such that the deflection of the movable element does not exceed maximum deflection limits. In the closed loop configuration, the bandwidth of the actuation signal is preferably limited to less than or equal to the closed loop bandwidth of the sensing circuit. As a result, electrostatic capture and/or contact between the movable element and the stationary element is prevented.

Claims

1. A micromechanical sensing apparatus, comprising:

a micromechanical sensor including a stationary element and a movable element which are electrically conductive;

a force balance loop coupled to said micromechanical sensor for generating an output indicative of a sensed quantity and for electrostatically controlling a position of said movable element relative to said stationary element, said force balance loop having a prescribed closed loop bandwidth; and

a circuit coupled to said micromechanical sensor for applying to the sensor an actuation signal for electrostatically deflecting said movable element relative to said stationary element, said actuation signal having a maximum amplitude, said circuit including circuitry for limiting the bandwidth of said actuation signal such that said force balance loop controls deflection of said movable element within maximum deflection limits selected to avoid electrostatic capture or contact between said movable element and said stationary element.

2. A micromechanical sensing apparatus as defined in claim 1 wherein said circuitry limits the bandwidth of said actuation signal to less than or equal to the closed loop bandwidth of said force balance loop.

3. A micromechanical sensing apparatus as defined in claim 1 wherein said stationary element and said movable element define a first capacitor and a second capacitor having a differential configuration such that as said movable element is deflected, one of said capacitors increases and the other of said capacitors decreases.

4. A micromechanical sensing apparatus as defined in claim 3 wherein said circuitry for limiting said signal bandwidth includes a timing capacitor and a charging circuit for charging said timing capacitor at a controlled rate.

5. A micromechanical sensing apparatus as defined in claim 3 wherein said force balance loop comprises:

means for generating first and second sinusoidal signals of equivalent amplitude and frequency and 180°

out of phase with each other,

means for supplying said first sinusoidal signal to said first capacitor,

means for supplying said second sinusoidal signal to said second capacitor,

a buffer amplifier having an input coupled to said first and second capacitor, and an output, and

a demodulator having an input coupled to the output of said buffer amplifier and an output coupled to the input of said buffer amplifier, whereby the output of said demodulator is fed back to the input of said buffer amplifier.

6. A micromechanical sensing apparatus as defined in claim 3 wherein the closed loop bandwidth of said force balance loop is about 1 kHz.

7. A micromechanical sensing apparatus as defined in claim 1 wherein said micromechanical sensor comprises:

a semiconductor substrate having a surface,

a plurality of posts extending from the surface of said substrate,

a polysilicon bridge suspended from said posts, said bridge comprising a plurality of movable fingers which constitute said movable element, and

a plurality of electrically conductive, substantially stationary fingers which constitute said stationary element, each of said substantially stationary fingers corresponding to one of said movable fingers and being positioned relative to said corresponding movable fingers such that said movable finger and said corresponding substantially stationary finger form a capacitor,

whereby movement of said bridge causes said movable fingers to move relative to said substantially stationary fingers and alter the capacitance between said movable fingers and said corresponding substantially stationary fingers.

8. A micromechanical sensing apparatus defined in claim 7 wherein said micromechanical sensor, said force balance loop and said circuit are fabricated on said substrate, whereby said micromechanical sensing device has a monolithic construction.

9. A micromechanical sensing apparatus as defined in claim 1 wherein said micromechanical sensor comprises an acceleration sensor.

10. A micromechanical sensing apparatus as defined in claim 1 wherein said actuation signal is applied to the movable element of said micromechanical sensor.

11. A micromechanical sensing apparatus as defined in claim 1 wherein said actuation signal is applied to the stationary element of said micromechanical sensor.

12. A micromechanical sensing apparatus as defined in claim 1 wherein said actuation signal comprises a test signal.

13. A micromechanical sensing apparatus comprising:

a micromechanical sensor including a stationary element and a movable element which are electrically conductive, said micromechanical sensor having a mechanical resonance frequency;

a sensing circuit coupled to said micromechanical sensor for generating a signal indicative of a sensed quantity; and

an actuation circuit coupled to said micromechanical sensor for applying to said sensor an actuation signal for electrostatically deflecting said movable element relative to said stationary element, said actuation circuit including circuitry for limiting the bandwidth of said actuation signal to prevent contact between said movable element and said stationary element.

14. A micromechanical sensing apparatus as defined in claim 13 wherein said actuation circuit limits the bandwidth of said actuation signal to about one tenth of said mechanical resonance frequency.

15. A micromechanical sensing apparatus as defined in claim 13 wherein said stationary element and said movable element define a first capacitor and a second capacitor having a differential configuration such that as said movable element is deflected, one of said capacitors increases and the other of said capacitors decreases.

16. A micromechanical sensing apparatus as defined in claim 13 wherein said micromechanical sensor comprises:

a semiconductor substrate having a surface,

a plurality of posts extending from the surface of said substrate,

a polysilicon bridge suspended from said posts, said bridge comprising a plurality of movable fingers which constitute said movable element, and

a plurality of electrically conductive, substantially stationary fingers which constitute said stationary element, each of said substantially stationary fingers corresponding to one of said movable fingers and being positioned relative to said corresponding movable fingers such that said movable finger and said corresponding substantially stationary finger form a capacitor,

whereby movement of said bridge causes said movable fingers to move relative to said substantially stationary fingers and alter the capacitance between said movable fingers and said corresponding substantially stationary fingers.

17. A micromechanical sensing apparatus as defined in claim 13 wherein said micromechanical sensor comprises an acceleration sensor.

18. A micromechanical sensing apparatus as defined in claim 13 wherein said actuation signal is applied to the movable element of said micromechanical sensor.

19. A micromechanical sensing apparatus as defined in claim 13 wherein said actuation signal is applied to the stationary element of said micromechanical sensor.

20. A micromechanical sensing apparatus as defined in claim 13 wherein said actuation signal comprises a test signal.

21. In micromechanical sensing apparatus comprising a micromechanical sensor including a stationary element and a movable element which are electrically conductive, and a force balance loop coupled to said micromechanical sensor for generating an output indicative of a sensed quantity and for electrostatically controlling a position of said movable element relative to said stationary element, a method for actuating said micromechanical sensing device, comprising:

applying to the micromechanical sensor an actuation signal for electrostatically deflecting said movable element relative to said stationary element, said actuation signal having a maximum amplitude; and

limiting the bandwidth of said actuation signal such that said force balance loop controls deflection of said movable element within maximum deflection limits selected to avoid electrostatic capture or contact between said movable element and said stationary element.

22. A method as defined in claim 21 wherein said force balance loop has a prescribed closed loop bandwidth and wherein the step of limiting the bandwidth of the actuation signal includes limiting the bandwidth to less than or equal to the closed loop bandwidth of said force balance loop.

23. A micromechanical apparatus comprising:

a micromechanical device including a stationary element and a movable element which are electrically conductive, said micromechanical device having a mechanical resonance frequency; and

an actuation circuit coupled to said micromechanical device for applying to said device an actuation signal for electrostatically deflecting said movable element relative to said stationary element, said actuation circuit including circuitry for limiting the bandwidth of said actuation signal to prevent contact between said movable element and said stationary element.

24. A micromechanical apparatus as defined in claim 23 wherein said circuitry limits the bandwidth of said actuation signal to about one tenth of said mechanical resonance frequency.

25. A micromechanical apparatus as defined in claim 23 further including a force balance loop coupled to said micromechanical device for electrostatically controlling a position of said movable element relative to said stationary element, said force balance loop having a prescribed closed loop bandwidth, said circuitry limiting the bandwidth of said actuation signal such that said force balance loop controls deflection of said movable element within maximum deflection limits.

26. A micromechanical apparatus as defined in claim 25 wherein said circuitry limits the bandwidth of said actuation signal to less than or equal to the closed loop bandwidth of said force balance loop.