Electrostatic discharge protection device
First Claim
1. An electrostatic discharge protection device for use with a semiconductor chip package of a type having a plurality of connector pins extending therefrom disposed in a spaced apart relationship with respect to each other for insertion into a mating receptacle, said electrostatic discharge protection device comprisinga non-conductive base having a plurality of legs extending outward therefrom where each of said plurality of legs has an aperture at a distal end passing therethrough for receiving one of the plurality of connector pins, said non-conductive base having an operative position in which an inherent bias of the non-conductive base urges an outer edge of each aperture into mechanical contact with the plurality of connector pins held within and having an inoperative position where the mechanical contact between the outer edge of each aperture and the one of the plurality of connector pins is disconnected, where insertion of said semiconductor chip package into said mating receptacle moves the non-conductive base into the inoperative position by overcoming the inherent bias and removal of the semiconductor chip package from the mating receptacle automatically returns the non-conductive base to said operative position;
- conductive means disposed on said non-conductive base for electrically connecting selected ones of said plurality of connector pins when the non-conductive base is in the operative position by establishing an electrical path between each of the outer edges of the apertures contacting the selected ones of said plurality of connector pins, and for disconnecting said electrical path when the non-conductive base is in the inoperative position to provide electrical isolation between the plurality of connector pins.
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Accused Products
Abstract
An electrostatic discharge protection device is disclosed which automatically connects selected connector pins of a semiconductor chip package ("SCP") or connectors on printed circuit boards such that the connector pins are held at a common voltage until insertion of the SCP into a receptor or until insertion of a cable into the connector which overcomes an internal resilient bias of the electrostatic discharge protection device causing the common connection to be removed. Removal of the SCP from the receptor or the cable from its connector removes the force which overcomes the bias, thereby reestablishing the common electrical connection thus automatically moving the electrostatic discharge protection device between inoperative and operative positions.
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Citations
32 Claims
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1. An electrostatic discharge protection device for use with a semiconductor chip package of a type having a plurality of connector pins extending therefrom disposed in a spaced apart relationship with respect to each other for insertion into a mating receptacle, said electrostatic discharge protection device comprising
a non-conductive base having a plurality of legs extending outward therefrom where each of said plurality of legs has an aperture at a distal end passing therethrough for receiving one of the plurality of connector pins, said non-conductive base having an operative position in which an inherent bias of the non-conductive base urges an outer edge of each aperture into mechanical contact with the plurality of connector pins held within and having an inoperative position where the mechanical contact between the outer edge of each aperture and the one of the plurality of connector pins is disconnected, where insertion of said semiconductor chip package into said mating receptacle moves the non-conductive base into the inoperative position by overcoming the inherent bias and removal of the semiconductor chip package from the mating receptacle automatically returns the non-conductive base to said operative position; conductive means disposed on said non-conductive base for electrically connecting selected ones of said plurality of connector pins when the non-conductive base is in the operative position by establishing an electrical path between each of the outer edges of the apertures contacting the selected ones of said plurality of connector pins, and for disconnecting said electrical path when the non-conductive base is in the inoperative position to provide electrical isolation between the plurality of connector pins. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electrostatic discharge protection device for use with a connector of a type having a top with a sequence of connector pins extending therefrom disposed in a spaced apart relationship with respect to each other for insertion into a mating receptacle, said electrostatic discharge protection device comprising
a base adapted to be secured to said connector, said base having a plurality of apertures with cuts along either side of the plurality of apertures, the plurality of apertures corresponding to the sequence of connector pins such that the sequence of connector pins pass through the plurality of apertures and the cuts providing independent motion to each of the plurality of apertures where said independent motion allows each of the plurality of apertures to adapt to a position of the sequence of connector pins, said base having a resilient inward bias to urge an outer portion of the plurality of apertures into contact with the connector pins; - and
grounding means disposed on said base for providing electrical communication between selected of the outer portions of the plurality of apertures where said electrostatic discharge protection device has an operative position for connecting a shunt across selected pins of the sequence of connector pins and has an inoperative position for disconnecting said shunt to provide electrical isolation between the sequence of connector pins where insertion of said connector into said mating receptacle moves the grounding means into the inoperative position by overcoming the inward bias and removal of the semiconductor chip package from the mating receptacle automatically moves the grounding means into said operative position. - View Dependent Claims (13, 14, 15, 16)
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17. An electrostatic discharge protection device for use with a semiconductor chip package of a type having a top surface and an opposite bottom surface and a plurality of lateral surfaces integral with said top and bottom surfaces where one or more of said lateral surfaces have extending therefrom a plurality of connector pins disposed in a spaced apart relationship with respect to each other for insertion into a mating receptacle, said electrostatic discharge protection device comprising
a base adapted to be secured below the bottom surface of said semiconductor chip package having a plurality of apertures corresponding to the plurality of connector pins such that the plurality of connector pins pass through the plurality of apertures, said base having a resilient inward bias to urge an outer portion of the plurality of apertures into contact with the connector pins; - and
grounding means disposed on said base to ground selected pins of the plurality of connector pins, said grounding means having an operative position for connecting a shunt across selected pins of the plurality of connector pins, and having an inoperative position for disconnecting said shunt allowing electrical isolation between the plurality of connector pins where insertion of said grounding means into said inoperative position by overcoming the inward bias and removal of the semiconductor chip package from the mating receptacle automatically moves the grounding means into said operative position. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. An electrostatic discharge protection device for use with a semiconductor chip package of a type having a top surface and an opposite bottom surface and a plurality of lateral surfaces integral with said top and bottom surfaces where one or more of said lateral surfaces have planar electrical contacts disposed thereon and said bottom surface is for mating with a substantially planar surface, said electrostatic discharge protection device comprising
a body having a base adapted to be secured around said plurality of lateral surfaces of said semiconductor chip package where an aperture is cut therethrough over each of the planar electrical contacts, and having a tab extending out from the from the base below said bottom surface corresponding to each of the planar electrical contacts where said tab folds back into said base such that a portion of the tabs extends into the aperture, said tab having a resilient inward bias to urge the tab through the apertures into contact with the planar electrical contact; - and
grounding means disposed on said body having an operative position to shunt selected planar electrical contacts, said grounding having a ground contact on the tab which establishes an electrical path with selected ones of each of the said planar electrical contacts and having a central conductor to provide electrical communication between the ground contacts, said grounding means having an inoperative position for disconnecting the shunt allowing electrical isolation between the planar electrical contacts where attachment of the bottom surface of the semiconductor chip package to said substantially planar surface moves said grounding means into an inoperative position by overcoming the inward bias of the tab and pushing the ground contact away from the planar electrical contact, and removal of the semiconductor chip package from the substantially planar surface automatically moves the grounding means back into said operative position.
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Specification