Printer head

• US 5,585,827 A
• Filed: 10/20/1994
• Issued: 12/17/1996
• Est. Priority Date: 10/29/1993
• Status: Expired due to Term

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Murakami, Takaaki
• Primary Examiner(s): Lund, Valerie A.
• Application Number:
  US08/326,515
• Time in Patent Office: 789 Days
• Field of Search: 347/63, 347/64, 347/65, 347/20, 228/123.1, 228/198
• US Class Current: 347/64
• CPC Class Codes: B41J 2/1604 of the edge shooter type
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]

Abstract

In the printer head of this invention, the base component 1 and the lid component 5 can be easily bonded without clogging the groove 2 that serves as the ink flow channel. The eutectic alloy layer 3 is formed by a eutectic reaction on the bonding surface between the base component 1 having the groove 2 composed of silicon formed thereon and the lid component 5 having the thin gold film 4 formed thereon. Therefore, the base component/and the lid component 5 are bonded to each other.

Claims

1. A printer head for use in an ink jet printer, comprising:

a base component composed of silicon and having a groove formed in a surface of said base component, said groove having a silicon oxide protective layer defining an ink flow channel;

a lid component having a gold film layer on a surface thereof, said lid component being placed in contact with said base component such that said gold film layer defines a wall of said ink flow channel; and

a eutectic bond being formed between said gold film layer and said surface of said base component by a eutectic reaction between said gold film layer and the silicon of said base component.

2. The printer head according to claim 1, wherein said silicon base component is composed of silicon single crystal or heat-resistant glass.

3. The printer head according to claim 1, wherein said lid component is composed of silicon single crystal or heat-resistant glass.

4. The printer head according to claim 1, wherein said thin gold film is formed on a bonding surface of said lid component.

5. The printer head according to claim 1, wherein said silicon oxide protective layer is generated on a surface of said groove.

6. A printer head which is used in an ink jet printer,comprising:

a base component having a groove formed thereon, wherein a silicon oxide layer is generated on a surface of said groove; and

a lid component bonded to a surface of said base component on which said groove is formed;

wherein a eutectic alloy layer generated by a eutectic reaction between gold and silicon is formed on a bonding surface between said base component and said lid component, and wherein a thin gold film is formed on a bonding surface of said lid component, said thin gold film and said silicon oxide layer of said groove together defining an ink flow channel of said printer head.