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Electrostrictive actuated mirror array

  • US 5,585,956 A
  • Filed: 07/29/1994
  • Issued: 12/17/1996
  • Est. Priority Date: 07/31/1993
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing an array of M×

  • N electrostrictive actuated mirrors for use in an optical projection system, wherein M and N are integers, M indicating the total number of columns in the array, running parallel to the vertical direction and N indicating the total number of rows therein, running parallel to the horizontal direction, the method comprising the steps of;

    (a) preparing a ceramic wafer, made of an electrostrictive material, having a top and a bottom surfaces;

    (b) forming an array of M×

    N regularly spaced, identically sized first electrodes on the bottom surface of said ceramic wafer and a set of 2×

    (M+1) identically sized second electrodes on the top surface thereof, wherein each of the 2×

    (M+1) second electrodes, having a pair of side edges running parallel to each other and to the vertical direction, extends vertically across the top surface, and each of the M×

    N first electrodes, when projected onto the top surface, includes two adjacent second electrodes and the centerline thereof coincides with the centerline therebetween;

    (c) mounting said ceramic wafer treated in accordance with said step (b) on an active matrix, including a substrate and an array of M×

    N connecting terminals to thereby connect each of the first electrodes with each of the M×

    N connecting terminals;

    (d) covering the top surface of said ceramic wafer, including the 2×

    (M+1) second electrodes, treated in accordance with said steps (b) and (c) with an insulating layer;

    (e) providing a set of (M+1) photoresistive necked segments on top of the insulating layer covering the top surface of said ceramic wafer, including the 2×

    (M+1) second electrodes, each of the photoresistive necked segments, extending in the vertical direction, is placed on a portion of the insulating layer covering a pair of second electrode, wherein the pair of second electrodes, when projected onto the bottom surface, is made up of two neighboring second electrodes from two horizontally adjacent first electrodes;

    (f) forming a set of M trenches, wherein each of the M trenches, provided with a pair of side surfaces and a bottom surface, is located between two adjacent second electrodes, the centerline thereof coinciding with the centerline of each of the first electrodes on the same column and the centerline between the two adjacent second electrodes, runs parallel to the second electrodes, and is further provided with a set of N-1 grooves, running perpendicular thereto;

    (g) removing the photoresistive necked segments;

    (h) placing an array of M×

    N hinges on the top surface of said ceramic wafer treated in accordance with said steps (b), (c), (d), (e), (f) and (g), wherein each of the M×

    N hinges is provided with a top surface and a bottom surface provided with a protrusion mounted simultaneously on the insulating layers covering the two adjacent second electrodes separated by a trench therebetween;

    (i) forming a mirror on the top surface of each of the M×

    N hinges; and

    (j) making appropriate electrical connections to thereby form an array of M×

    N electrodisplacive actuated mirrors.

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